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Board-to-board Connector
Board-to-board (BTB) connectors are used to connect printed circuit boards (PCB), electronic components that contain a conductive pattern printed on the surface of the insulating base in an accurate and repeatable manner. Each terminal on a BTB connector is connected to a PCB. A BTB connector includes housing and a specific number of terminals. The terminal is made from a conductive material (mostly copper alloy), and plated to improve conductivity and antirust. Terminals transmit the current/signal between PCBs connected by BTB; the housing is made of insulating material (mostly plastic). BTB connectors are divided up into four mounting types: # Through-hole technology # Surface-mount technology # Plug-in technology #Solderless stacking mezzanine technology BTB connectors are selected by considering the mounting method, pin pitch, number of the rows (aka number of the ways), pin length, stacker height etc. See also * Pin header * Signal integrity Signal integrity or SI is a set ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Boards
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds vias: plated-through holes that allow interconnections between layers. Printed circuit boards are used in nearly all electronic products. Alternatives to PCBs include wire wrap a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Copper Alloy
Copper alloys are metal alloys that have copper as their principal component. They have high resistance against corrosion. The best known traditional types are bronze, where tin is a significant addition, and brass, using zinc instead. Both of these are imprecise terms, having both been commonly referred to as lattens in the past. Today the term ''copper alloy'' tends to be substituted, especially by museums. Composition The similarity in external appearance of the various alloys, along with the different combinations of elements used when making each alloy, can lead to confusion when categorizing the different compositions. There are as many as 400 different copper and copper alloy compositions loosely grouped into the categories: copper, high copper alloy, brasses, bronzes, copper nickels, copper–nickel–zinc (nickel silver), leaded copper, and special alloys. The following table lists the principal alloying element for four of the more common types used in modern ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Through-hole Technology
In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines. History Through-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction. From the second generation of computers in the 1950s until surface-mount technology (SMT) became popular in the mid 1980s, every component on a typical PCB was a through-hole component. PCBs initially had tracks printed on one side only, later both sides, then multi-layer boards were in use. Through holes became plated-through holes (PTH) in order for the components to make contact with the required conductive layers. Plated-through holes are no longer required with SMT boards for making the component connections, bu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pin Pitch
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using " ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pin Header
A pin header (or simply header) is a form of electrical connector. A male pin header consists of one or more rows of metal pins molded into a plastic base, often apart, though available in many spacings. Male pin headers are cost-effective due to their simplicity. The female counterparts are sometimes known as female socket headers, though there are numerous naming variations of male and female connectors. Historically, headers have sometimes been called "Berg connectors", but headers are manufactured by many companies. Overview Normally pin headers are through-hole devices (THD / THT), but surface-mount devices (SMD / SMT) exist too. In the SMD case, the solder side of the pins are bent on a 90 degree angle so as to be soldered to pads on the PCB. On single row SMD headers the pins are bent alternating to one side or the other, on dual row SMD headers the pins are simply bent outwards. If pin headers are optional, the THD variant is often chosen for ease of manual assembl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Signal Integrity
Signal integrity or SI is a set of measures of the quality of an electrical signal. In digital electronics, a stream of binary values is represented by a voltage (or current) waveform. However, digital signals are fundamentally analog in nature, and all signals are subject to effects such as noise, distortion, and loss. Over short distances and at low bit rates, a simple conductor can transmit this with sufficient fidelity. At high bit rates and over longer distances or through various mediums, various effects can degrade the electrical signal to the point where errors occur and the system or device fails. Signal integrity engineering is the task of analyzing and mitigating these effects. It is an important activity at all levels of electronics packaging and assembly, from internal connections of an integrated circuit (IC), A survey of the field of electronic design automation. Portions of IC section of this article were derived (with permission) from Vol II, Chapter 21, ''Noise ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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