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WLCSP
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for ''chip-size packaging.'' Since only a few packages are chip size, the meaning of the acronym was adapted to ''chip-scale packaging''. According to IPC's standard J-STD-012, ''Implementation of Flip Chip and Chip Scale Technology'', in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm. The concept was first proposed by Junichi Kasai of Fujitsu and Gen Murakami of Hitachi Cable in 1993. The first concept demonstration however came from Mitsubishi Electric. The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or prin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer-level Package
Wafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) ''before'' the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment. There is no single industry-standard method of wafer-level packaging at present. A major application area of WLPs are smartphones due to the size constraints. For e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
UNIO WLCSP And SOT23 Device On Penny
Unio may refer to: * ''Unio'' (bivalve), a genus of freshwater mussels * ''Unio'' (sternwheeler), a steamboat that operated in Oregon, United States, in 1861, before being renamed ''Union'' * UNI/O, an asynchronous serial bus * UNIO Satu Mare, a Romanian machine-building company * or Confederation of Unions for Professionals, a national trade union center in Norway See also * Unio Mystica, the union of the individual human soul with the Godhead * Unio Trium Nationum, a 1438 pact formed by the three Estates of Transylvania * Convergència i Unió, a political party in Catalonia * Unió Democràtica de Catalunya, a political party in Catalonia * Unió Valenciana Valencian Union ( ca-valencia, Unió Valenciana; es, Unión Valenciana; UV) was a regionalist political party in the Valencian Community, Spain. The party had not been represented in the Valencian autonomous parliament since 1999. It scored ..., a political party in Valencia * Unió Mallorquina, a political pa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
IPC (electronics)
IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. It was founded in 1957 as the Institute of Printed Circuits. Its name was later changed to the Institute for Interconnecting and Packaging Electronic Circuits to highlight the expansion from bare boards to packaging and electronic assemblies. In 1999, the organization formally changed its name to IPC with the accompanying tagline, ''Association Connecting Electronics Industries''. IPC is accredited by the American National Standards Institute (ANSI) as a standards developing organization and is known globally for its standards. It publishes the most widely used acceptability standards in the electronics industry. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. and Atlanta, Ga. in the United States, and overseas offices in China, Thailand, Vietnam, India and Belgium. Standards IPC standa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Fujitsu
is a Japanese multinational information and communications technology equipment and services corporation, established in 1935 and headquartered in Tokyo. Fujitsu is the world's sixth-largest IT services provider by annual revenue, and the largest in Japan, in 2021. The hardware offerings from Fujitsu are mainly of personal and enterprise computing products, including x86, SPARC and mainframe compatible server products, although the corporation and its subsidiaries also offer a diversity of products and services in the areas of data storage, telecommunications, advanced microelectronics, and air conditioning. It has approximately 126,400 employees and its products and services are available in approximately 180 countries. Fujitsu is listed on the Tokyo Stock Exchange and Nagoya Stock Exchange; its Tokyo listing is a constituent of the Nikkei 225 and TOPIX 100 indices. History 1935 to 2000 Fujitsu was established on June 20, 1935, which makes it one of the oldest operating ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hitachi Cable
was established in 1956 as a manufacturer of electric wire and cable for power distribution. The company, based in Tokyo, Japan, was formed from Hitachi Densen Works, the Hitachi Works Corporate spin-off, spin-off previously known as Densen Works. In the half-century following the creation of the company Hitachi Cables have expanded its business operations to include the manufacture of rubbercopper cable and optical products. Although the company still actively engages in the development of raw materials for wires and cables, it has incorporated the development of telecommunications equipment into its product line. To that end, the product line now includes antennas and coaxial cables, compound semiconductors and various electronic components, including a terminal antenna for wireless communication. The company has also developed the WirelessIP5000, a wireless IP phone that supports the Session Initiation Protocol (SIP). As a related push into the information technology, IT arena ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Mitsubishi Electric
, established on 15 January 1921, is a Japanese multinational electronics and electrical equipment manufacturing company headquartered in Tokyo, Japan. It is one of the core companies of Mitsubishi. The products from MELCO include elevators and escalators, high-end home appliances, air conditioning, factory automation systems, train systems, electric motors, pumps, semiconductors, digital signage, and satellites. In the United States, products are manufactured and sold by Mitsubishi Electric United States headquartered in Cypress, California. History MELCO was established as a spin-off from the Mitsubishi Group's other core company Mitsubishi Heavy Industries, then Mitsubishi Shipbuilding, as the latter divested a marine electric motor factory in Kobe, Nagasaki. It has since diversified to become the major electronics company. MELCO held the record for the fastest elevator in the world, in the 70-story Yokohama Landmark Tower, from 1993 to 2005. The company acquired Nihon ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Springer Science+Business Media
Springer Science+Business Media, commonly known as Springer, is a German multinational publishing company of books, e-books and peer-reviewed journals in science, humanities, technical and medical (STM) publishing. Originally founded in 1842 in Berlin, it expanded internationally in the 1960s, and through mergers in the 1990s and a sale to venture capitalists it fused with Wolters Kluwer and eventually became part of Springer Nature in 2015. Springer has major offices in Berlin, Heidelberg, Dordrecht, and New York City. History Julius Springer founded Springer-Verlag in Berlin in 1842 and his son Ferdinand Springer grew it from a small firm of 4 employees into Germany's then second largest academic publisher with 65 staff in 1872.Chronology ". Springer Science+Business Media. In 1964, Springer expanded its business internationally, o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Interposer
An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection. Interposer comes from the Latin word "interpōnere", meaning "to put between". They are often used in BGA packages, multi-chip modules and high bandwidth memory. A common example of an interposer is an integrated circuit die to BGA, such as in the Pentium II. This is done through various substrates, both rigid and flexible, most commonly FR4 for rigid, and polyimide for flexible. Silicon and glass are also evaluated as an integration method. Interposer stacks are also a widely accepted, cost-effective alternative to 3D ICs. There are already several products with interposer technology in the market, notably the AMD Fiji/Fury GPU, and the Xilinx Virtex-7 FPGA. In 2016, CEA Leti demonstrated their second generation 3D- NoC technology which combines small ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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