VIA CoreFusion
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VIA CoreFusion
VIA CoreFusion is a line of low power x86 processors manufactured by VIA starting in 2003. The Corefusion integrates the Northbridge, graphics processing unit and a V-Link Interface (Luke and John only.) The Corefusion platform is available in four varieties: Mark, Luke, Luke-Lite and John. Mark The Corefusion Mark was released on March 12, 2003. The processor core is based on the VIA C3 'Nehemiah', and includes the VIA ProSavage CLE266 Northbridge and the S3 Graphics ProSavage4 graphics processing unit. It supports 133 MHz SDRAM ;Specifications (C3 Core) * L1-Cache: 64 + 64 kB (Data + Instructions) * L2-Cache: 64 kB * MMX, 3DNow!, SSE * Security Features: RNG, AES * BGA686 * Front side bus: 133 MHz * VCore: 0.9-1.0 V * Power consumption: 6-10 W * First release: March 12, 2003 * Clockrate: ** Mark: 533-1000 MHz Luke and Luke-Lite The Corefusion Luke was released on 8 March 2005. The processor core is based on the VIA Eden-N, and includes the VIA CN400 Northbridge and ...
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KL VIA Luke Top
KL, kL, kl, or kl. may refer to: Businesses and organizations * KLM, a Dutch airline (IATA airline designator KL) * Koninklijke Landmacht, the Royal Netherlands Army * Kvenna Listin ("Women's List"), a political party in Iceland * KL FM, a Malay language radio station Places * Kaiserslautern, Germany (license plate code KL) * Kerala, India (ISO 3166-2:IN subcode KL) * Kirkland Lake, Ontario, Canada * Kowloon, Hong Kong * Kuala Lumpur, Malaysia Science, technology, and mathematics * KL engine, version of the Mazda K engine * Klepton (kl.), a type of species in zoology * Kiloliter (kL), a unit of volume * Kullback–Leibler divergence in mathematics * KL (gene), a gene which encodes the klotho enzyme in humans Other uses * Jeep Cherokee (KL) * Kalaallisut language (ISO 639 alpha-2 language code "kl") * Kl (digraph), used in the Zulu language to write /kʟ̥ʼ/ or /kxʼ/ * Konzentrationslager, or concentration camp, abbreviated KZ or KL * ''KL – A History of the Nazi Concentratio ...
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Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ...
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VIA C7
The VIA C7 is an x86 central processing unit designed by Centaur Technology and sold by VIA Technologies. Product history The C7 delivers a number of improvements to the older VIA C3 cores but is nearly identical to the latest VIA C3 Nehemiah core. The C7 was officially launched in May 2005, although according to market reports, full volume production was not in place at that date. In May 2006 Intel's cross-licensing agreement with VIA expired and was not renewed, which was the reason for the forced termination of C3 shipments on March 31, 2006, as VIA lost rights to the socket 370. The C7 appears still to be found in the marketplace, for example, on the bargain-priced Everex TC2502, sold by Walmart with a Linux distribution preinstalled and on the HP Mini-Note. A 1 GHz C7 processor with 128kB of cache memory is used in VIA's own PX10000G motherboard which is based on the proprietary Pico-ITX form factor. The chip is cooled by a large heatsink that covers most of the boa ...
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VIA C3
The VIA C3 is a family of x86 central processing units for personal computers designed by Centaur Technology and sold by VIA Technologies. The different CPU cores are built following the design methodology of Centaur Technology. In addition to x86 instructions, VIA C3 CPUs contain an undocumented Alternate Instruction Set allowing lower-level access to the CPU and in some cases privilege escalation. Cores Samuel 2 and Ezra cores VIA Cyrix III was renamed VIA C3 with the switch to the advanced "Samuel 2" (C5B) core. The addition of an on-die L2 cache improved performance somewhat. As it was not built upon Cyrix technology at all, the new name was just a logical step. To improve power consumption and reduce manufacturing costs, Samuel 2 was produced with 150 nm process technology. The VIA C3 processor continued an emphasis on minimizing power consumption with the next die shrink to a mixed 130/150 nm process. "Ezra" (C5C) and "Ezra-T" (C5N) were only new revisions o ...
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Geode (processor)
Geode was a series of x86-compatible system-on-a-chip microprocessors and I/O companions produced by AMD, targeted at the embedded computing market. The series was originally launched by National Semiconductor as the Geode family in 1999. The original Geode processor core itself is derived from the Cyrix MediaGX platform, which was acquired in National's merger with Cyrix in 1997. AMD bought the Geode business from National in August 2003 to augment its existing line of embedded x86 processor products. AMD expanded the Geode series to two classes of processor: the MediaGX-derived Geode GX and LX, and the modern Athlon-derived Geode NX. Geode processors are optimized for low power consumption and low cost while still remaining compatible with software written for the x86 platform. The MediaGX-derived processors lack modern features such as SSE and a large on-die L1 cache but these are offered on the more recent Athlon-derived Geode NX. Geode processors tightly integrate some of ...
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AMD Fusion
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit ( CPU) and integrated graphics processing unit (IGPU) on a single die. AMD announced the first generation APUs, ''Llano'' for high-performance and ''Brazos'' for low-power devices, in January 2011. The second generation ''Trinity'' for high-performance and ''Brazos-2'' for low-power devices were announced in June 2012. The third generation ''Kaveri'' for high performance devices were launched in January 2014, while ''Kabini'' and ''Temash'' for low-power devices were announced in the summer of 2013. Since the launch of the Zen microarchitecture, Ryzen and Athlon APUs have released to the global market as Raven Ridge on the DDR4 platform, after Bristol Ridge a year prior. AMD has also supplied semi-custom APUs for consoles starting with the release of Sony PlayStation 4 and Microsoft ...
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Double Data Rate
In computing, a computer bus operating with double data rate (DDR) transfers data on both the rising and falling edges of the clock signal. This is also known as double pumped, dual-pumped, and double transition. The term toggle mode is used in the context of NAND flash memory. Overview The simplest way to design a clocked electronic circuit is to make it perform one transfer per full cycle (rise and fall) of a clock signal. This, however, requires that the clock signal changes twice per transfer, while the data lines change at most once per transfer. When operating at a high bandwidth, signal integrity limitations constrain the clock frequency. By using both edges of the clock, the data signals operate with the same limiting frequency, thereby doubling the data transmission rate. This technique has been used for microprocessor front-side busses, Ultra-3 SCSI, expansion buses ( AGP, PCI-X), graphics memory (GDDR), main memory (both RDRAM and DDR1 through DDR5), and the ...
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S3 Chrome
S3, S-3 or S03 may refer to: Entertainment * ''Si3'' (flim), originally titled ''S III'' and also known as ''Singam 3'', the third film in the ''Singam'' franchise * ''Expedition to the Barrier Peaks'', code S3, a 1980 ''Dungeons & Dragons'' adventure module * S3 Plan, a fictitious program in the '' Metal Gear Solid 2: Sons of Liberty'' video game *SABC 3, South African public television channel, stylised as S3 Transportation Airlines * Ashland Municipal Airport, FAA Location identifier S03, in Oregon, US * SBA Airlines, IATA code S3, based in Caracas, Venezuela Locomotives * ALCO S-3, an American diesel switching (shunting) locomotive; see ALCO S-1 and S-3 * NER Class S3, a North Eastern Railway steam locomotive * Prussian S 3, a steam locomotive Rail lines * S3 (Berlin), an S-Bahn line * S3 (Munich), an S-Bahn line in Bavaria, Germany * S3 (Nuremberg), an S-Bahn line in Bavaria, Germany * S3 (RER Vaud), an S-Bahn line in Switzerland * S3 (Rhine-Main S-Bahn), an S-Bahn line ...
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VIA Eden
VIA Eden is a name of a variant of VIA's C3/ C7 x86 processors, designed to be used in embedded devices. They have smaller package sizes, lower power consumption, and somewhat lower computing performance than their C equivalents, due to reduced clock rates. They are often used in EPIA mini-ITX, nano-ITX, and Pico-ITX motherboards. In addition to x86 instruction decoding, the processors have a second undocumented Alternate Instruction Set. The Eden is available in four main versions: * Eden ESP: Samuel 2 and Nehemiah cores (300 MHz-1.0 GHz) - EBGA 35mm×35mm package, 66/100/133 MHz FSB * Eden-N: Nehemiah core (533 MHz-1.0 GHz) - NanoBGA 15mm×15mm package, 133 MHz FSB * Eden: Esther core (400 MHz-1.2 GHz) - NanoBGA2 21mm×21mm package, 400 MT/s FSB * Eden ULV: Esther core (500 MHz-1.5 GHz) - NanoBGA2 21mm×21mm package, 400 MT/s FSB The Eden ULV 500 MHz was the first variant to achieve a TDP of 1W .http://www.viatech.com/en/ ...
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Front Side Bus
A front-side bus (FSB) is a computer communication interface (bus) that was often used in Intel-chip-based computers during the 1990s and 2000s. The EV6 bus served the same function for competing AMD CPUs. Both typically carry data between the central processing unit (CPU) and a memory controller hub, known as the northbridge. Depending on the implementation, some computers may also have a back-side bus that connects the CPU to the cache. This bus and the cache connected to it are faster than accessing the system memory (or RAM) via the front-side bus. The speed of the front side bus is often used as an important measure of the performance of a computer. The original front-side bus architecture has been replaced by HyperTransport, Intel QuickPath Interconnect or Direct Media Interface in modern volume CPUs. History The term came into use by Intel Corporation about the time the Pentium Pro and Pentium II products were announced, in the 1990s. "Front side" refers to the extern ...
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Advanced Encryption Standard
The Advanced Encryption Standard (AES), also known by its original name Rijndael (), is a specification for the encryption of electronic data established by the U.S. National Institute of Standards and Technology (NIST) in 2001. AES is a variant of the Rijndael block cipher developed by two Belgian cryptographers, Joan Daemen and Vincent Rijmen, who submitted a proposal to NIST during the AES selection process. Rijndael is a family of ciphers with different key and block sizes. For AES, NIST selected three members of the Rijndael family, each with a block size of 128 bits, but three different key lengths: 128, 192 and 256 bits. AES has been adopted by the U.S. government. It supersedes the Data Encryption Standard (DES), which was published in 1977. The algorithm described by AES is a symmetric-key algorithm, meaning the same key is used for both encrypting and decrypting the data. In the United States, AES was announced by the NIST as U.S. FIPS PUB 197 (FIPS 197) on Novemb ...
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VIA Technologies
VIA Technologies Inc. (), is a Taiwanese manufacturer of integrated circuits, mainly motherboard chipsets, CPUs, and memory. It was the world's largest independent manufacturer of motherboard chipsets. As a fabless semiconductor company, VIA conducts research and development of its chipsets in-house, then subcontracts the actual (silicon) manufacturing to third-party merchant foundries such as TSMC. History The company was founded in 1987, in Fremont, California, USA by Cher Wang. In 1992, it was decided to move the headquarters to Taipei, Taiwan in order to establish closer partnerships with the substantial and growing IT manufacturing base in Taiwan and neighbouring China. In 1999, VIA acquired most of Cyrix, then a division of National Semiconductor. That same year, VIA acquired Centaur Technology from Integrated Device Technology, marking its entry into the x86 microprocessor market. VIA is the maker of the VIA C3, VIA C7 & VIA Nano processors, and the EPIA platform. The ...
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