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UltraSPARC II
The UltraSPARC II, code-named "Blackbird", is a microprocessor implementation of the SPARC V9 instruction set architecture (ISA) developed by Sun Microsystems. Marc Tremblay was the chief architect. Introduced in 1997, it was further development of the UltraSPARC operating at higher clock frequencies of 250 MHz, eventually reaching 650 MHz. The die contained 5.4 million transistors and had an area of 149 mm. It was fabricated by Texas Instruments in their 0.35 μm process, dissipated 25 W at 205 MHz, and used a 2.5 V power supply. L2 cache capacity was 1 to 4 MB. In 1999, the UltraSPARC II was ported to a 0.25 μm process. This version was code-named "Sapphire-Black". It operated at 360 to 480 MHz, possessed a die area of 126 mm, dissipated 21 W at 400 MHz and the power supply voltage was reduced to 1.9 V. Supported L2 cache capacity was increased to 1 to 8 MB. Derivatives The UltraSPARC II was the basis for four derivatives. ...
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Sun Microsystems
Sun Microsystems, Inc. (Sun for short) was an American technology company that sold computers, computer components, software, and information technology services and created the Java programming language, the Solaris operating system, ZFS, the Network File System (NFS), and SPARC microprocessors. Sun contributed significantly to the evolution of several key computing technologies, among them Unix, RISC processors, thin client computing, and virtualized computing. Notable Sun acquisitions include Cray Business Systems Division, Storagetek, and ''Innotek GmbH'', creators of VirtualBox. Sun was founded on February 24, 1982. At its height, the Sun headquarters were in Santa Clara, California (part of Silicon Valley), on the former west campus of the Agnews Developmental Center. Sun products included computer servers and workstations built on its own RISC-based SPARC processor architecture, as well as on x86-based AMD Opteron and Intel Xeon processors. Sun also developed its own ...
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Sun UltraSPARC IIe Back
The Sun is the star at the center of the Solar System. It is a nearly perfect ball of hot plasma, heated to incandescence by nuclear fusion reactions in its core. The Sun radiates this energy mainly as light, ultraviolet, and infrared radiation, and is the most important source of energy for life on Earth. The Sun's radius is about , or 109 times that of Earth. Its mass is about 330,000 times that of Earth, comprising about 99.86% of the total mass of the Solar System. Roughly three-quarters of the Sun's mass consists of hydrogen (~73%); the rest is mostly helium (~25%), with much smaller quantities of heavier elements, including oxygen, carbon, neon, and iron. The Sun is a G-type main-sequence star (G2V). As such, it is informally, and not completely accurately, referred to as a yellow dwarf (its light is actually white). It formed approximately 4.6 billionAll numbers in this article are short scale. One billion is 109, or 1,000,000,000. years ago from the gravitat ...
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SPARC Microprocessors
SPARC (Scalable Processor Architecture) is a reduced instruction set computer (RISC) instruction set architecture originally developed by Sun Microsystems. Its design was strongly influenced by the experimental Berkeley RISC system developed in the early 1980s. First developed in 1986 and released in 1987, SPARC was one of the most successful early commercial RISC systems, and its success led to the introduction of similar RISC designs from many vendors through the 1980s and 1990s. The first implementation of the original 32-bit architecture (SPARC V7) was used in Sun's Sun-4 computer workstation and server systems, replacing their earlier Sun-3 systems based on the Motorola 68000 series of processors. SPARC V8 added a number of improvements that were part of the SuperSPARC series of processors released in 1992. SPARC V9, released in 1993, introduced a 64-bit architecture and was first released in Sun's UltraSPARC processors in 1995. Later, SPARC processors were used in sym ...
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Sun Microprocessors
The Sun is the star at the center of the Solar System. It is a nearly perfect ball of hot plasma, heated to incandescence by nuclear fusion reactions in its core. The Sun radiates this energy mainly as light, ultraviolet, and infrared radiation, and is the most important source of energy for life on Earth. The Sun's radius is about , or 109 times that of Earth. Its mass is about 330,000 times that of Earth, comprising about 99.86% of the total mass of the Solar System. Roughly three-quarters of the Sun's mass consists of hydrogen (~73%); the rest is mostly helium (~25%), with much smaller quantities of heavier elements, including oxygen, carbon, neon, and iron. The Sun is a G-type main-sequence star (G2V). As such, it is informally, and not completely accurately, referred to as a yellow dwarf (its light is actually white). It formed approximately 4.6 billionAll numbers in this article are short scale. One billion is 109, or 1,000,000,000. years ago from the gravitat ...
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UltraSPARC T1
Sun Microsystems' UltraSPARC T1 microprocessor, known until its 14 November 2005 announcement by its development codename "Niagara", is a multithreading, multicore CPU. Designed to lower the energy consumption of server computers, the CPU typically uses 72 W of power at 1.4 GHz. Afara Websystems pioneered a radical thread-heavy SPARC design. The company was purchased by Sun, and the intellectual property became the foundation of the CoolThreads line of processors, starting with the T1. The T1 is a new-from-the-ground-up SPARC microprocessor implementation that conforms to thUltraSPARC Architecture 2005 specificationand executes the full SPARC V9 instruction set. Sun has produced two previous multicore processors (UltraSPARC IV and IV+), but UltraSPARC T1 was its first microprocessor that is both multicore ''and'' multithreaded. Security was built-in from the very first release on silicon, with hardware cryptographic units in the T1, unlike general purpose processor from ...
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Tape Out
In electronics and photonics design, tape-out or tapeout is the final result of the design process for integrated circuits or printed circuit boards before they are sent for manufacturing. The tapeout is specifically the point at which the graphic for the photomask of the circuit is sent to the fabrication facility. History Historically, the term references the early days of printed circuit design, when the enlarged (for higher precision) "artwork" for the photomask was manually "taped out" using black line tape (commonly Bishop Graphics crepe) and also Rubylith sheets. In the post-war era of the 1940–50s, the techniques developed for rapid and low-cost circuit reproduction evolved to photographically replicated 2D manufacturing. The verb "to tapeout" was already widely used for the process and adopted for transistor fabrication, which evolved to full integrated-circuit approaches. Procedures involved The term ''tapeout'' currently is used to describe the creation of the p ...
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UltraSPARC II Gemini Micrograph
The UltraSPARC is a microprocessor developed by Sun Microsystems and fabricated by Texas Instruments, introduced in mid-1995. It is the first microprocessor from Sun to implement the 64-bit SPARC V9 instruction set architecture (ISA). Marc Tremblay was a co-microarchitect. Microarchitecture The UltraSPARC is a four-issue superscalar microprocessor that executes instructions in Out of order execution#In-order processors, in-order. It has a nine-stage integer Instruction pipeline, pipeline. Functional units The execution units were simplified relative to the SuperSPARC to achieve higher clock frequencies - an example of a simplification is that the ALUs were not cascaded, unlike the SuperSPARC, to avoid restricting clock frequency. The integer register file has 32 64-bit entries. As the SPARC ISA uses register windows, of which the UltraSPARC has eight, the actual number of registers is 144. The register file has seven read and three write ports. The integer register file pr ...
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Copper Interconnect
In semiconductor technology, copper interconnects are interconnects made of copper. They are used in silicon integrated circuits (ICs) to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium, ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them. Together, these effects lead to ICs with better performance. They were first introduced by IBM, with assistance from Motorola, in 1997. The transition from aluminium to copper required significant developments in fabrication techniques, including radically different methods for patterning the metal as well as the introduction of barrier metal layers to isolate the silicon from potentially damaging copper atoms. Patterning Although some form of volatile copper compound has been known to exist since 1947, with more discovered as the century progressed, none were in industrial use, so copper could not be ...
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EDN (magazine)
''EDN'' is an electronics industry website and formerly a magazine owned by AspenCore Media, an Arrow Electronics company. The editor-in-chief is Majeed Ahmad. ''EDN'' was published monthly until, in April 2013, EDN announced that the print edition would cease publication after the June 2013 issue. History The first issue of ''Electrical Design News'', the original name, was published in May 1956 by Rogers Corporation of Englewood, Colorado. In January 1961, Cahners Publishing Company, Inc., of Boston, acquired Rogers Publishing Company. In February 1966, Cahners sold 40% of its company to International Publishing Company in London In 1970, the Reed Group merged with International Publishing Corporation and changed its name to Reed International Limited. Acquisition of ''EEE'' magazine Cahners Publishing Company acquired ''Electronic Equipment Engineering'', a monthly magazine, in March 1971 and discontinued it. In doing so, Cahners folded ''EEE's'' best features into ''EDN'', and ...
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Aluminium Interconnects
In integrated circuits (ICs), interconnects are structures that connect two or more circuit elements (such as transistors) together electrically. The design and layout of interconnects on an IC is vital to its proper function, performance, power efficiency, reliability, and fabrication yield. The material interconnects are made from depends on many factors. Chemical and mechanical compatibility with the semiconductor substrate and the dielectric between the levels of interconnect is necessary, otherwise barrier layers are needed. Suitability for fabrication is also required; some chemistries and processes prevent the integration of materials and unit processes into a larger technology (recipe) for IC fabrication. In fabrication, interconnects are formed during the back-end-of-line after the fabrication of the transistors on the substrate. Interconnects are classified as ''local'' or ''global'' interconnects depending on the signal propagation distance it is able to support. The widt ...
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KL SUN UltraSparc 2e
KL, kL, kl, or kl. may refer to: Businesses and organizations * KLM, a Dutch airline (IATA airline designator KL) * Koninklijke Landmacht, the Royal Netherlands Army * Kvenna Listin ("Women's List"), a political party in Iceland * KL FM, a Malay language radio station Places * Kaiserslautern, Germany (license plate code KL) * Kerala, India (ISO 3166-2:IN subcode KL) * Kirkland Lake, Ontario, Canada * Kowloon, Hong Kong * Kuala Lumpur, Malaysia Science, technology, and mathematics * KL engine, version of the Mazda K engine * Klepton (kl.), a type of species in zoology * Kiloliter (kL), a unit of volume * Kullback–Leibler divergence in mathematics * KL (gene), a gene which encodes the klotho enzyme in humans Other uses * Jeep Cherokee (KL) * Kalaallisut language (ISO 639 alpha-2 language code "kl") * Kl (digraph), used in the Zulu language to write /kʟ̥ʼ/ or /kxʼ/ * Konzentrationslager From 1933 to 1945, Nazi Germany operated more than a thousand concentration ca ...
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SPARC V9
SPARC (Scalable Processor Architecture) is a reduced instruction set computer (RISC) instruction set architecture originally developed by Sun Microsystems. Its design was strongly influenced by the experimental Berkeley RISC system developed in the early 1980s. First developed in 1986 and released in 1987, SPARC was one of the most successful early commercial RISC systems, and its success led to the introduction of similar RISC designs from many vendors through the 1980s and 1990s. The first implementation of the original 32-bit architecture (SPARC V7) was used in Sun's Sun-4 computer workstation and server systems, replacing their earlier Sun-3 systems based on the Motorola 68000 series of processors. SPARC V8 added a number of improvements that were part of the SuperSPARC series of processors released in 1992. SPARC V9, released in 1993, introduced a 64-bit architecture and was first released in Sun's UltraSPARC processors in 1995. Later, SPARC processors were used in sym ...
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