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Thin Small Outline Package
Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications. TSOP is the smallest leaded form factor for flash memory. History The TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card. Physical properties TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TSOP 32 (T1) BW
TSOP can stand for: *"TSOP (The Sound of Philadelphia)", a 1974 hit single by the band MFSB *The State of Palestine, the sovereign Palestinian state *TSOP Records, a subsidiary of Philadelphia International Records, named after the hit MFSB song *''The Sound of Perseverance'', a 1998 album by the band Death *Thin small-outline packages, a type of surface mount electronics technology *''This Side of Paradise ''This Side of Paradise'' is the debut novel by American writer F. Scott Fitzgerald, published in 1920. It examines the lives and morality of carefree American youth at the dawn of the Jazz Age. Its protagonist, Amory Blaine, is an attractive ...'', the 1920 debut novel by F. Scott Fitzgerald * TSOP.. Series (Example TSOP17), IR Receiver Modules for Rem ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'',Wiley VCH, 2000, ,page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thin Shrink Small Outline Package
The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. Application They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics. Physical properties The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm. Exposed Pad Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The exposed pad will be soldered on the pcb to transfer heat from the package to the pcb. In most applications, the exposed pad ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Shrink Small-outline Package
A small outline integrated circuit (SOIC) is a Surface-mount technology, surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin List of 4000 series integrated circuits, 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small-outline Integrated Circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than JEDEC MS-012.) Note that because of t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small Outline Integrated Circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than JEDEC MS-012.) Note that because of th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PCMCIA PC Card
In computing, PC Card is a configuration for computer parallel communication peripheral interface, designed for laptop computers. Originally introduced as PCMCIA, the PC Card standard as well as its successors like CardBus were defined and developed by the Personal Computer Memory Card International Association (PCMCIA). It was originally designed as a standard for memory-expansion cards for computer storage. The existence of a usable general standard for notebook peripherals led to many kinds of devices being made available based on their configurability, including network cards, modems, and hard disks. History The PCMCIA 1.0 card standard was published by the Personal Computer Memory Card International Association in November 1990 and was soon adopted by more than eighty vendors. It corresponds with the Japanese JEIDA memory card 4.0 standard. SanDisk (operating at the time as "SunDisk") launched its PCMCIA card in October 1992. The company was the first to introduce a writeab ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface Mount
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PC Card
In computing, PC Card is a configuration for computer parallel communication peripheral interface, designed for laptop computers. Originally introduced as PCMCIA, the PC Card standard as well as its successors like CardBus were defined and developed by the Personal Computer Memory Card International Association (PCMCIA). It was originally designed as a standard for memory-expansion cards for computer storage. The existence of a usable general standard for notebook peripherals led to many kinds of devices being made available based on their configurability, including network cards, modems, and hard disks. History The PCMCIA 1.0 card standard was published by the Personal Computer Memory Card International Association in November 1990 and was soon adopted by more than eighty vendors. It corresponds with the Japanese JEIDA memory card 4.0 standard. SanDisk (operating at the time as "SunDisk") launched its PCMCIA card in October 1992. The company was the first to introduce a writ ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
E2PROM
EEPROM (also called E2PROM) stands for electrically erasable programmable read-only memory and is a type of non-volatile memory used in computers, usually integrated in microcontrollers such as smart cards and remote keyless systems, or as a separate chip device to store relatively small amounts of data by allowing individual bytes to be erased and reprogrammed. EEPROMs are organized as arrays of floating-gate transistors. EEPROMs can be programmed and erased in-circuit, by applying special programming signals. Originally, EEPROMs were limited to single-byte operations, which made them slower, but modern EEPROMs allow multi-byte page operations. An EEPROM has a limited life for erasing and reprogramming, now reaching a million operations in modern EEPROMs. In an EEPROM that is frequently reprogrammed, the life of the EEPROM is an important design consideration. Flash memory is a type of EEPROM designed for high speed and high density, at the expense of large erase blocks (ty ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
