Superconducting Logic
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Superconducting Logic
Superconducting logic refers to a class of logic circuits or logic gates that use the unique properties of superconductors, including zero-resistance wires, ultrafast Josephson junction switches, and quantization of magnetic flux (fluxoid). Superconducting computing is a form of Cryogenic processor, cryogenic computing, as superconductive electronic circuits require cooling to cryogenic temperatures for operation, typically below 10 kelvin. Often superconducting computing is applied to quantum computing, with an important application known as superconducting quantum computing. Superconducting digital logic circuits use single flux quanta (SFQ), also known as magnetic flux quantum, magnetic flux quanta, to encode, process, and transport data. SFQ circuits are made up of active Josephson junctions and passive elements such as inductors, resistors, transformers, and transmission lines. Whereas voltages and capacitors are important in semiconductor logic circuits such as CMOS, curr ...
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Logic Circuit
A logic gate is an idealized or physical device implementing a Boolean function, a logical operation performed on one or more binary inputs that produces a single binary output. Depending on the context, the term may refer to an ideal logic gate, one that has for instance zero rise time and unlimited fan-out, or it may refer to a non-ideal physical device (see Ideal and real op-amps for comparison). Logic gates are primarily implemented using diodes or transistors acting as electronic switches, but can also be constructed using vacuum tubes, electromagnetic relays (relay logic), fluidic logic, pneumatic logic, optics, molecules, or even mechanical elements. Now, most logic gates are made from MOSFETs (metal–oxide–semiconductor field-effect transistors). With amplification, logic gates can be cascaded in the same way that Boolean functions can be composed, allowing the construction of a physical model of all of Boolean logic, and therefore, all of the algorithms and mathem ...
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Three-dimensional Integrated Circuit
A three-dimensional integrated circuit (3D IC) is a MOSFET, MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global (Integrated circuit packaging, package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); monolithic 3D ICs; ...
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