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SpursEngine
SpursEngine is a microprocessor from Toshiba built as a media oriented coprocessor, designed for 3D- and video processing in consumer electronics such as set-top boxes and computers. The SpursEngine processor is also known as the Quad Core HD processor. Announced 20 September 2007. The SpursEngine is a stream processor powered by four Synergistic Processing Elements (SPE), also used in the Cell processor featured in Sony PlayStation 3. These processing elements are fed by on chip H.264 and MPEG-2 codecs and controlled by an off die host CPU, connected by an on chip PCIe controller (in contrast to the Cell processor which has an on chip CPU (the PPE) doing similar work). To enable smoother interaction between the host and the SpursEngine Toshiba also integrated a simple proprietary 32-bit control core. The SpursEngine employs dedicated XDR DRAM as its working memory. The SpursEngine is designed to work at much lower frequencies than the Cell and Toshiba has also optimize ...
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SpursEngine Schema
SpursEngine is a microprocessor from Toshiba built as a media oriented coprocessor, designed for 3D- and video processing in consumer electronics such as set-top boxes and computers. The SpursEngine processor is also known as the Quad Core HD processor. Announced 20 September 2007. The SpursEngine is a stream processor powered by four Synergistic Processing Elements (SPE), also used in the Cell processor featured in Sony PlayStation 3. These processing elements are fed by on chip H.264 and MPEG-2 codecs and controlled by an off die host CPU, connected by an on chip PCIe controller (in contrast to the Cell processor which has an on chip CPU (the PPE) doing similar work). To enable smoother interaction between the host and the SpursEngine Toshiba also integrated a simple proprietary 32-bit control core. The SpursEngine employs dedicated XDR DRAM as its working memory. The SpursEngine is designed to work at much lower frequencies than the Cell and Toshiba has also optimize ...
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SpursEngine SE1000
SpursEngine is a microprocessor from Toshiba built as a media oriented coprocessor, designed for 3D- and video processing in consumer electronics such as set-top boxes and computers. The SpursEngine processor is also known as the Quad Core HD processor. Announced 20 September 2007. The SpursEngine is a stream processor powered by four Synergistic Processing Elements (SPE), also used in the Cell processor featured in Sony PlayStation 3. These processing elements are fed by on chip H.264 and MPEG-2 codecs and controlled by an off die host CPU, connected by an on chip PCIe controller (in contrast to the Cell processor which has an on chip CPU (the PPE) doing similar work). To enable smoother interaction between the host and the SpursEngine Toshiba also integrated a simple proprietary 32-bit control core. The SpursEngine employs dedicated XDR DRAM as its working memory. The SpursEngine is designed to work at much lower frequencies than the Cell and Toshiba has also optimize ...
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Coprocessor
A coprocessor is a computer processor used to supplement the functions of the primary processor (the CPU). Operations performed by the coprocessor may be floating-point arithmetic, graphics, signal processing, string processing, cryptography or I/O interfacing with peripheral devices. By offloading processor-intensive tasks from the main processor, coprocessors can accelerate system performance. Coprocessors allow a line of computers to be customized, so that customers who do not need the extra performance do not need to pay for it. Functionality Coprocessors vary in their degree of autonomy. Some (such as FPUs) rely on direct control via coprocessor instructions, embedded in the CPU's instruction stream. Others are independent processors in their own right, capable of working asynchronously; they are still not optimized for general-purpose code, or they are incapable of it due to a limited instruction set focused on accelerating specific tasks. It is common for these t ...
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Cell (microprocessor)
Cell is a multi-core microprocessor microarchitecture that combines a general-purpose PowerPC core of modest performance with streamlined coprocessing elements which greatly accelerate multimedia and vector processing applications, as well as many other forms of dedicated computation. It was developed by Sony, Toshiba, and IBM, an alliance known as "STI". The architectural design and first implementation were carried out at the STI Design Center in Austin, Texas over a four-year period beginning March 2001 on a budget reported by Sony as approaching US$400 million. Cell is shorthand for Cell Broadband Engine Architecture, commonly abbreviated ''CBEA'' in full or ''Cell BE'' in part. The first major commercial application of Cell was in Sony's PlayStation 3 game console, released in 2006. In May 2008, the Cell-based IBM Roadrunner supercomputer became the first TOP500 LINPACK sustained 1.0 petaflops system. Mercury Computer Systems also developed designs based on the Cell. The ...
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Microsoft Windows
Windows is a group of several proprietary graphical operating system families developed and marketed by Microsoft. Each family caters to a certain sector of the computing industry. For example, Windows NT for consumers, Windows Server for servers, and Windows IoT for embedded systems. Defunct Windows families include Windows 9x, Windows Mobile, and Windows Phone. The first version of Windows was released on November 20, 1985, as a graphical operating system shell for MS-DOS in response to the growing interest in graphical user interfaces (GUIs). Windows is the most popular desktop operating system in the world, with 75% market share , according to StatCounter. However, Windows is not the most used operating system when including both mobile and desktop OSes, due to Android's massive growth. , the most recent version of Windows is Windows 11 for consumer PCs and tablets, Windows 11 Enterprise for corporations, and Windows Server 2022 for servers. Genealogy By marketing ...
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Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect t ...
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Watt
The watt (symbol: W) is the unit of power or radiant flux in the International System of Units (SI), equal to 1 joule per second or 1 kg⋅m2⋅s−3. It is used to quantify the rate of energy transfer. The watt is named after James Watt (1736–1819), an 18th-century Scottish inventor, mechanical engineer, and chemist who improved the Newcomen engine with his own steam engine in 1776. Watt's invention was fundamental for the Industrial Revolution. Overview When an object's velocity is held constant at one metre per second against a constant opposing force of one newton, the rate at which work is done is one watt. : \mathrm In terms of electromagnetism, one watt is the rate at which electrical work is performed when a current of one ampere (A) flows across an electrical potential difference of one volt (V), meaning the watt is equivalent to the volt-ampere (the latter unit, however, is used for a different quantity from the real power of an electrical circuit). : ...
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Thermal Design Power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP rat ...
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Static Random-access Memory
Static random-access memory (static RAM or SRAM) is a type of random-access memory (RAM) that uses latching circuitry (flip-flop) to store each bit. SRAM is volatile memory; data is lost when power is removed. The term ''static'' differentiates SRAM from DRAM (''dynamic'' random-access memory) — SRAM will hold its data permanently in the presence of power, while data in DRAM decays in seconds and thus must be periodically refreshed. SRAM is faster than DRAM but it is more expensive in terms of silicon area and cost; it is typically used for the cache and internal registers of a CPU while DRAM is used for a computer's main memory. History Semiconductor bipolar SRAM was invented in 1963 by Robert Norman at Fairchild Semiconductor. MOS SRAM was invented in 1964 by John Schmidt at Fairchild Semiconductor. It was a 64-bit MOS p-channel SRAM. The SRAM was the main driver behind any new CMOS-based technology fabrication process since 1959 when CMOS was invented. In 1965 ...
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Logic Gate
A logic gate is an idealized or physical device implementing a Boolean function, a logical operation performed on one or more binary inputs that produces a single binary output. Depending on the context, the term may refer to an ideal logic gate, one that has for instance zero rise time and unlimited fan-out, or it may refer to a non-ideal physical device (see Ideal and real op-amps for comparison). Logic gates are primarily implemented using diodes or transistors acting as electronic switches, but can also be constructed using vacuum tubes, electromagnetic relays (relay logic), fluidic logic, pneumatic logic, optics, molecules, or even mechanical elements. Now, most logic gates are made from MOSFETs (metal–oxide–semiconductor field-effect transistors). With amplification, logic gates can be cascaded in the same way that Boolean functions can be composed, allowing the construction of a physical model of all of Boolean logic, and therefore, all of the algorithms and mathem ...
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Transistor
upright=1.4, gate (G), body (B), source (S) and drain (D) terminals. The gate is separated from the body by an insulating layer (pink). A transistor is a semiconductor device used to Electronic amplifier, amplify or electronic switch, switch electrical signals and electrical power, power. The transistor is one of the basic building blocks of modern electronics. It is composed of semiconductor material, usually with at least three terminals for connection to an electronic circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Some transistors are packaged individually, but many more are found embedded in integrated circuits. Austro-Hungarian physicist Julius Edgar Lilienfeld proposed the concept of a field-effect transistor in 1926, but it was not possible to actually constru ...
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Copper Interconnect
In semiconductor technology, copper interconnects are interconnects made of copper. They are used in silicon integrated circuits (ICs) to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium, ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them. Together, these effects lead to ICs with better performance. They were first introduced by IBM, with assistance from Motorola, in 1997. The transition from aluminium to copper required significant developments in fabrication techniques, including radically different methods for patterning the metal as well as the introduction of barrier metal layers to isolate the silicon from potentially damaging copper atoms. Patterning Although some form of volatile copper compound has been known to exist since 1947, with more discovered as the century progressed, none were in industrial use, so copper could not be ...
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