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Sherlock Automated Design Analysis
''Sherlock Automated Design Analysis'' is a software tool developed by DfR Solutions for analyzing, grading, and certifying the expected reliability of products at the circuit card assembly level. Based on the science of Physics of Failure, Sherlock predicts failure mechanism-specific failure rates over time using a combination of finite element method and material properties to capture stress values and first order analytical equations to evaluate damage evolution. The software is designed for use by design and reliability engineers and managers in the electronics industry. DfR Solutions is based in Beltsville, Maryland, USA, and was acquired by ANSYS, Inc. in May 2019. Approach Users upload either a complete design package, like ODB++ or IPC-2581, or individual data packets, such as Gerber, Bill of Materials, and Pick and Place files. Sherlock incorporates stresses from a variety of environments into its physics-based prediction algorithms, including elevated temperature, the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electromigration
Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current densities are used, such as in microelectronics and related structures. As the structure size in electronics such as integrated circuits (ICs) decreases, the practical significance of this effect increases. History The phenomenon of electromigration has been known for over 100 years, having been discovered by the French scientist Gerardin. The topic first became of practical interest during the late 1960s when packaged ICs first appeared. The earliest commercially available ICs failed in a mere three weeks of use from runaway electromigration, which led to a major industry effort to correct this problem. The first observation of electromigration in thin films was made by I. Blech.I. Blech: ''Electromigration in Thin Aluminum Fi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Life Curves
Life is a quality that distinguishes matter that has biological processes, such as signaling and self-sustaining processes, from that which does not, and is defined by the capacity for growth, reaction to stimuli, metabolism, energy transformation, and reproduction. Various forms of life exist, such as plants, animals, fungi, protists, archaea, and bacteria. Biology is the science that studies life. The gene is the unit of heredity, whereas the cell is the structural and functional unit of life. There are two kinds of cells, prokaryotic and eukaryotic, both of which consist of cytoplasm enclosed within a membrane and contain many biomolecules such as proteins and nucleic acids. Cells reproduce through a process of cell division, in which the parent cell divides into two or more daughter cells and passes its genes onto a new generation, sometimes producing genetic variation. Organisms, or the individual entities of life, are generally thought to be open systems that m ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Siemens NX
NX, formerly known as "unigraphics", is an advanced high-end CAD/CAM/ CAE, which has been owned since 2007 by Siemens Digital Industries Software. In 2000, Unigraphics purchased SDRC I-DEAS and began an effort to integrate aspects of both software packages into a single product which became Unigraphics NX or NX. It is used, among other tasks, for: * Design (parametric and direct solid/surface modelling) * Engineering analysis (static; dynamic; electro-magnetic; thermal, using the finite element method; and fluid, using the finite volume method). * Manufacturing finished design by using included machining modules. NX is a direct competitor to CATIA, Creo, Autodesk Inventor. History 1972: United Computing, Inc. releases UNIAPT, one of the world's first end-user CAM products. 1973: The company purchases the Automated Drafting and Machining (ADAM) software code from MCS in 1973. The code became a foundation for a product called UNI-GRAPHICS, later sold commercially as Unigraphic ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Abaqus
Abaqus FEA (formerly ABAQUS) is a software suite for finite element analysis and computer-aided engineering, originally released in 1978. The name and logo of this software are based on the abacus calculation tool. The Abaqus product suite consists of five core software products: # ''Abaqus/CAE'', or "Complete Abaqus Environment" (a backronym with a root in Computer-Aided Engineering). It is a software application used for both the modeling and analysis of mechanical components and assemblies (pre-processing) and visualizing the finite element analysis result. A subset of Abaqus/CAE including only the post-processing module can be launched independently in the ''Abaqus/Viewer'' product. # ''Abaqus/Standard'', a general-purpose Finite-Element analyzer that employs implicit integration scheme (traditional). # ''Abaqus/Explicit'', a special-purpose Finite-Element analyzer that employs explicit integration scheme to solve highly nonlinear systems with many complex contacts under trans ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CAD Software
Computer-aided design (CAD) is the use of computers (or ) to aid in the creation, modification, analysis, or optimization of a design. This software is used to increase the productivity of the designer, improve the quality of design, improve communications through documentation, and to create a database for manufacturing. Designs made through CAD software are helpful in protecting products and inventions when used in patent applications. CAD output is often in the form of electronic files for print, machining, or other manufacturing operations. The terms computer-aided drafting (CAD) and computer aided design and drafting (CADD) are also used. Its use in designing electronic systems is known as ''electronic design automation'' (''EDA''). In mechanical design it is known as ''mechanical design automation'' (''MDA''), which includes the process of creating a technical drawing with the use of computer software. CAD software for mechanical design uses either vector-based graphics t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reliability (semiconductor)
Reliability of semiconductor devices can be summarized as follows: # Semiconductor devices are very sensitive to impurities and particles. Therefore, to manufacture these devices it is necessary to manage many processes while accurately controlling the level of impurities and particles. The finished product quality depends upon the many layered relationship of each interacting substance in the semiconductor, including metallization, chip material (list of semiconductor materials) and package. # The problems of micro-processes, and thin films and must be fully understood as they apply to metallization and wire bonding. It is also necessary to analyze surface phenomena from the aspect of thin films. # Due to the rapid advances in technology, many new devices are developed using new materials and processes, and design calendar time is limited due to non-recurring engineering constraints, plus time to market concerns. Consequently, it is not possible to base new designs on the reliabil ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Fides (reliability)
Fides (Latin: ''trust'') is a guide allowing estimated reliability calculation for electronic components and systems. The reliability prediction is generally expressed in FIT (number of failures for 109 hours) or MTBF (Mean Time Between Failures). This guide provides reliability data for RAMS (Reliability, Availability, Maintainability, Safety) studies. Purpose Fides is a '' DGA'' (French armament industry supervision agency) study conducted by a European consortium formed by eight industrialists from the fields of aeronautics and Defence: *Airbus France * Eurocopter *Nexter Electronics *MBDA Missiles Systems *Thales Services *Thales Airborne Systems *Thales Avionics *Thales Underwater Systems The first aim of the Fides project was to develop a new reliability assessment method for electronic components which takes into consideration COTS (commercial off-the-shelf) and specific parts and the new technologies. The global aim is to find a replacement to the worldwide reference ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Physics Of Failure
Physics of failure is a technique under the practice of reliability design that leverages the knowledge and understanding of the processes and mechanisms that induce failure to predict reliability and improve product performance. Other definitions of Physics of Failure include: * A science-based approach to reliability that uses modeling and simulation to design-in reliability. It helps to understand system performance and reduce decision risk during design and after the equipment is fielded. This approach models the root causes of failure such as fatigue, fracture, wear, and corrosion. * An approach to the design and development of reliable product to prevent failure, based on the knowledge of root cause failure mechanisms. The Physics of Failure (PoF) concept is based on the understanding of the relationships between requirements and the physical characteristics of the product and their variation in the manufacturing processes, and the reaction of product elements and materials to ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hot-carrier Injection
Hot carrier injection (HCI) is a phenomenon in solid-state electronic devices where an electron or a “hole” gains sufficient kinetic energy to overcome a potential barrier necessary to break an interface state. The term "hot" refers to the effective temperature used to model carrier density, not to the overall temperature of the device. Since the charge carriers can become trapped in the gate dielectric of a MOS transistor, the switching characteristics of the transistor can be permanently changed. Hot-carrier injection is one of the mechanisms that adversely affects the reliability of semiconductors of solid-state devices. Physics The term “hot carrier injection” usually refers to the effect in MOSFETs, where a carrier is injected from the conducting channel in the silicon substrate to the gate dielectric, which usually is made of silicon dioxide (SiO2). To become “hot” and enter the conduction band of SiO2, an electron must gain a kinetic energy of ~3.2&n ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Via (electronics)
A via (Latin for ''path'' or ''way'') is an electrical connection between copper layers in a printed circuit board. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with copper that forms electrical connection through the insulation that separates the copper layers. Vias are important for PCB manufacturing. This is because the vias are drilled with certain tolerances and may be fabricated off their designated locations, so some allowance for errors in drill position must be made prior to manufacturing or else the manufacturing yield can decrease due to non-conforming boards (according to some reference standard) or even due to failing boards. In addition, regular through hole vias are considered fragile structures as they are long and narrow; the manufacturer must ensure that the vias are plated properly throughout the barrel and this in turn causes several processing steps. In printed circuit boards In printed c ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
