Socket STRX4
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Socket STRX4
Socket sTRX4, also known as Socket SP3r3, is a land grid array (LGA) CPU socket designed by AMD supporting its Zen 2-based Castle Peak Ryzen Threadripper desktop processors, launched on November 25, 2019 for the high-end desktop and workstation platforms Socket sTRX4 is the direct successor to Socket TR4 used in the first- and second-generation Ryzen Threadripper products. It is physically identical to, but electrically incompatible with, both TR4 and AMD's server Socket SP3. While Socket SP3 doesn't require a chipset, instead utilizing a system-on-a-chip design, Socket sTRX4 and its predecessor require a chipset to provide improved connectivity and functionality. For Socket sTRX4, the TRX40 chipset was developed, which provides a total of 88 PCIe 4.0 lanes, an increase from the 66 PCIe 3.0 lanes on its predecessor platform. Also it no longer features a built-in High Definition Audio interface; instead motherboard manufacturers are including a separate audio controller onbo ...
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Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ...
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Zero Insertion Force
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little (but not literally zero) force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is sufficient and no external downward force is required. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. ZIF sockets are much more expensive than standard IC sockets and also tend to take up a larger board area due to the space taken up by the lever mechanism. Typically, they are only used when there is a good reason to do so. Design A normal integrated circuit (IC) socket requires the IC to be pushed into sprung contacts which then grip by friction. For an IC with hundreds of pins, the total insertion force can be very large (hundreds of newtons), leading ...
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Flip-chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect ...
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PCI Express
PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common motherboard interface for personal computers' graphics cards, hard disk drive host adapters, SSDs, Wi-Fi and Ethernet hardware connections. PCIe has numerous improvements over the older standards, including higher maximum system bus throughput, lower I/O pin count and smaller physical footprint, better performance scaling for bus devices, a more detailed error detection and reporting mechanism (Advanced Error Reporting, AER), and native hot-swap functionality. More recent revisions of the PCIe standard provide hardware support for I/O virtualization. The PCI Express electrical interface is measured by the number of simultaneous lanes. (A lane is a single send/receive line of data. The analogy is a highway with traffic in both directions. ...
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Infinity Fabric
HyperTransport (HT), formerly known as Lightning Data Transport, is a technology for interconnection of computer processors. It is a bidirectional serial/parallel high-bandwidth, low- latency point-to-point link that was introduced on April 2, 2001. The HyperTransport Consortium is in charge of promoting and developing HyperTransport technology. HyperTransport is best known as the system bus architecture of AMD central processing units (CPUs) from Athlon 64 through AMD FX and the associated motherboard chipsets. HyperTransport has also been used by IBM and Apple for the Power Mac G5 machines, as well as a number of modern MIPS systems. The current specification HTX 3.1 remained competitive for 2014 high-speed (2666 and 3200  MT/s or about 10.4 GB/s and 12.8 GB/s) DDR4 RAM and slower (around 1 GB/similar to high end Solid-state drive#Standard card form factors, PCIe SSDs ULLtraDIMM flash RAM) technology—a wider range of RAM speeds on a common CPU b ...
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Ryzen
Ryzen ( ) is a brand of multi-core x86-64 microprocessors designed and marketed by AMD for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications. AMD announced a new series of processors on December 13, 2016, named "Ryzen", and delivered them in Q1 2017, the first of several generations. The 1000 series featured up to eight cores and 16 threads, with a 52% instructions per cycle (IPC) increase over their prior CPU products. The second generation of Ryzen processors, the Ryzen 2000 series, released in April 2018, featured the Zen+ microarchitecture, a 12 nm process (GlobalFoundries); the aggregate performance increased 10% (of which approximately 3% was IPC, 6% was frequency); most importantly, Zen+ fixed ...
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Matisse (Ryzen) And Castle Peak (Ryzen Threadripper)
Henri Émile Benoît Matisse (; 31 December 1869 – 3 November 1954) was a French visual artist, known for both his use of colour and his fluid and original draughtsmanship. He was a drawing, draughtsman, printmaking, printmaker, and sculpture, sculptor, but is known primarily as a painter. Matisse is commonly regarded, along with Pablo Picasso, as one of the artists who best helped to define the revolutionary developments in the visual arts throughout the opening decades of the twentieth century, responsible for significant developments in painting and sculpture. The intense colourism of the works he painted between 1900 and 1905 brought him notoriety as one of the Fauvism, Fauves (French language, French for "wild beasts"). Many of his finest works were created in the decade or so after 1906, when he developed a rigorous style that emphasised flattened forms and decorative pattern. In 1917, he relocated to a suburb of Nice on the French Riviera, and the more relaxed style of ...
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