PlayStation 3 Technical Specifications
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PlayStation 3 Technical Specifications
The PlayStation 3 technical specifications describe the various components of the PlayStation 3 (PS3) video game console. Central processing unit The PS3 uses the Cell microprocessor, which is made up of one 3.2  GHz PowerPC-based " Power Processing Element" (PPE) and six accessible Synergistic Processing Elements (SPEs). A seventh runs in a special mode and is dedicated to aspects of the OS and security, and an eighth is a spare to improve production yields. PlayStation 3's Cell CPU achieves a theoretical maximum of 179.2 GFLOPS in single precision floating point operations and up to 15 GFLOPS double precision. The PS3 has 256 MB () of Rambus XDR DRAM, clocked at CPU die speed. The PPE has 64 KB () L1 cache and 512 KB L2 cache, while the SPEs have 2 MB local memory (256 KB per SPE), connected by the Element Interconnect Bus (EIB) with up to 307.2 Gbit/s bandwidth. Graphics processing unit According to Nvidia, the RSX — the graphics processing unit (GPU) â ...
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is a video gaming brand that consists of five home video game consoles, two handhelds, a media center, and a smartphone, as well as an online service and multiple magazines. The brand is produced by Sony Interactive Entertainment, a division of Sony; the first PlayStation console was released in Japan in December 1994, and worldwide the following year. The original console in the series was the first console of any type to ship over 100 million units, doing so in under a decade. Its successor, the PlayStation 2, was released in 2000. The PlayStation 2 is the best-selling home console to date, having reached over 155 million units sold by the end of 2012. Sony's next console, the PlayStation 3, was released in 2006, selling over 87.4 million units by March 2017. Sony's next console, the PlayStation 4, was released in 2013, selling a million units within a day, becoming the fastest selling console in history. The latest console in the series, the PlayStation 5, was release ...
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