Phenom X6
   HOME
*



picture info

Phenom X6
Phenom II is a family of AMD's multi-core 45 nm processors using the AMD K10 microarchitecture, succeeding the original Phenom. Advanced Micro Devices released the Socket AM2+ version of Phenom II in December 2008, while Socket AM3 versions with DDR3 support, along with an initial batch of triple- and quad-core processors were released on February 9, 2009. Dual-processor systems require Socket F+ for the Quad FX platform. The next-generation Phenom II X6 was released on April 27, 2010. The Phenom II X4 operates as the processor component of AMD's Dragon Platform, which also includes the 790 series chipset and Radeon HD 4800 series graphics. The Thuban Phenom II X6 is the CPU in the Leo Platform which also includes the AMD 890 chipset and the Radeon HD 5800 series graphics. Features The Phenom II triples the shared L3 cache size from 2MB (in the original Phenom line) to 6MB, leading to benchmark performance gains as high as 30%. In another change from the original Pheno ...
[...More Info...]      
[...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]  


picture info

GlobalFoundries
GlobalFoundries Inc. (GF or GloFo) is a multinational semiconductor contract manufacturing and design company incorporated in the Cayman Islands and headquartered in Malta, New York. Created by the divestiture of the manufacturing arm of AMD, the company was privately owned by Mubadala Investment Company, the sovereign wealth fund of the United Arab Emirates, until an initial public offering (IPO) in October 2021. The company manufactures chips designed for markets such as mobility, automotive, computing and wired connectivity, consumer internet of things (IoT) and industrial. As of 2021, GlobalFoundries is the fourth-largest semiconductor manufacturer; it produces chips for more than 7% of the $86 billion semiconductor manufacturing services industry. It is the only one with operations in Singapore, the European Union, and the United States: one 200 mm and one 300 mm wafer fabrication plant in Singapore; one 300 mm plant in Dresden, Germany; one 200 mm plan ...
[...More Info...]      
[...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]  




AMD Quad FX Platform
The AMD Quad FX platform is an AMD platform targeted at enthusiasts which allows users to plug two Socket F Athlon 64 FX or 2-way Opteron processors (CPUs) into a single motherboard for a total of four physical cores. This is a type of dual processor setup, where two CPUs are installed on a motherboard to increase computing power. The major difference between the platform and past dual processor systems like Xeon (pre Intel 5000X/P chipset) is that each processor has its own dedicated memory stores. The Quad FX platform also has HyperTransport capability targeted toward consumer platforms. In May 2007, AMD officially codenamed the eight core setup with two Phenom FX processors to be the ''FASN8'' (pronounced as "fascinate", , in short for ''First AMD Silicon Next-gen 8-core Platform'') from the previous codename "''4x4+''" used in Analyst Day presentations. Configuration In each socket resides an AMD Athlon 64 FX CPU. Each socket is connected using AMD's Direct Chip Mo ...
[...More Info...]      
[...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]  


Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronics, electronic devices. It is a multiple-step sequence of Photolithography, photolithographic and chemical processing steps (such as surface passivation, thermal oxidation, planar process, planar diffusion and p–n junction isolation, junction isolation) during which electronic circuits are gradually created on a wafer (electronics), wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process takes time, from start to packaged chips ready for shipment, at least six to eight weeks (tape-out only, not including the circuit design) and is performed in highly specialized semiconduct ...
[...More Info...]      
[...Related Items...]     OR:     [Wikipedia]   [Google]   [Baidu]  



MORE