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Plasma Etching
Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge ( plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch species, can be either charged ( ions) or neutral (atoms and radicals). During the process, the plasma generates volatile etch products at room temperature from the chemical reactions between the elements of the material etched and the reactive species generated by the plasma. Eventually the atoms of the shot element embed themselves at or just below the surface of the target, thus modifying the physical properties of the target. Mechanisms Plasma generation A plasma is a high energetic condition in which a lot of processes can occur. These processes happen because of electrons and atoms. To form the plasma electrons have to be accelerated to gain energy. Highly energetic electrons transfer the energy to atoms by collisions. Three differen ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Plasma Processing
Plasma processing is a plasma-based material processing technology that aims at modifying the chemical and physical properties of a surface. Plasma processing techniques include: * Plasma activation * Plasma ashing *Plasma cleaning * Plasma electrolytic oxidation * Plasma etching * Plasma functionalization * Plasma polymerization *Corona treatment *Plasma modification Related topics are plasma chemistry, chemical vapor deposition, and physical vapor deposition processes like sputter deposition, plasma iondoping, vacuum plasmaspraying, and reactive ion etching Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The pla .... See also * List of plasma (physics) applications articles References {{reflist ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities ("doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photoresist
A photoresist (also known simply as a resist) is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface. This process is crucial in the electronic industry. The process begins by coating a substrate with a light-sensitive organic material. A patterned mask is then applied to the surface to block light, so that only unmasked regions of the material will be exposed to light. A solvent, called a developer, is then applied to the surface. In the case of a positive photoresist, the photo-sensitive material is degraded by light and the developer will dissolve away the regions that were exposed to light, leaving behind a coating where the mask was placed. In the case of a negative photoresist, the photosensitive material is strengthened (either polymerized or cross-linked) by light, and the developer will dissolve away only the regions that were not exposed to light, leaving behind a coating in areas ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photolithography
In integrated circuit manufacturing, photolithography or optical lithography is a general term used for techniques that use light to produce minutely patterned thin films of suitable materials over a substrate, such as a silicon wafer (electronics), wafer, to protect selected areas of it during subsequent etching, Chemical vapor deposition, deposition, or Ion implantation, implantation operations. Typically, ultraviolet light is used to transfer a geometry, geometric design from an photomask, optical mask to a photosensitivity, light-sensitive chemical (photoresist) coated on the substrate. The photoresist either breaks down or hardens where it is exposed to light. The patterned film is then created by removing the softer parts of the coating with appropriate solvents. Conventional photoresists typically consists of three components: resin, sensitizer, and solvent. Photolithography processes can be classified according to the type of light used, such as ultraviolet, deep ultrav ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicon Dioxide
Silicon dioxide, also known as silica, is an oxide of silicon with the chemical formula , most commonly found in nature as quartz and in various living organisms. In many parts of the world, silica is the major constituent of sand. Silica is one of the most complex and most abundant families of materials, existing as a compound of several minerals and as a synthetic product. Notable examples include fused quartz, fumed silica, silica gel, opal and aerogels. It is used in structural materials, microelectronics (as an electrical insulator), and as components in the food and pharmaceutical industries. Structure In the majority of silicates, the silicon atom shows tetrahedral coordination, with four oxygen atoms surrounding a central Si atomsee 3-D Unit Cell. Thus, SiO2 forms 3-dimensional network solids in which each silicon atom is covalently bonded in a tetrahedral manner to 4 oxygen atoms. In contrast, CO2 is a linear molecule. The starkly different structures of the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Optical Materials Express
''Optical Materials Express'' is a monthly peer-reviewed scientific journal published by The Optical Society. It covers advances in and applications of optical materials, including but not limited to nonlinear optical materials, laser media, nanomaterials, metamaterials and biomaterials. Its editor-in-chief is Andrea Alù (City University of New York). The founding editor-in-chief was David J. Hagan. According to the ''Journal Citation Reports'', the journal has a 2021 impact factor The impact factor (IF) or journal impact factor (JIF) of an academic journal is a scientometric index calculated by Clarivate that reflects the yearly mean number of citations of articles published in the last two years in a given journal, as ... of 3.074. References External links * Optics journals Materials science journals English-language journals Monthly journals Publications established in 2011 Optica (society) academic journals {{engineering-journal-stub ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Microelectromechanical Systems
Microelectromechanical systems (MEMS), also written as micro-electro-mechanical systems (or microelectronic and microelectromechanical systems) and the related micromechatronics and microsystems constitute the technology of microscopic devices, particularly those with moving parts. They merge at the nanoscale into nanoelectromechanical systems (NEMS) and nanotechnology. MEMS are also referred to as micromachines in Japan and microsystem technology (MST) in Europe. MEMS are made up of components between 1 and 100 micrometers in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2. They usually consist of a central unit that processes data (an integrated circuit chip such as microprocessor) and several components that interact with the surroundings (such as microsensors). Because of th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Double Layer (plasma)
A double layer is a structure in a plasma consisting of two parallel layers of opposite electrical charge. The sheets of charge, which are not necessarily planar, produce localised excursions of electric potential, resulting in a relatively strong electric field between the layers and weaker but more extensive compensating fields outside, which restore the global potential. Ions and electrons within the double layer are accelerated, decelerated, or deflected by the electric field, depending on their direction of motion. Double layers can be created in discharge tubes, where sustained energy is provided within the layer for electron acceleration by an external power source. Double layers are claimed to have been observed in the aurora and are invoked in astrophysical applications. Similarly, a double layer in the auroral region requires some external driver to produce electron acceleration. Electrostatic double layers are especially common in current-carrying plasmas, and are ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Debye Sheath
The Debye sheath (also electrostatic sheath) is a layer in a plasma which has a greater density of positive ions, and hence an overall excess positive charge, that balances an opposite negative charge on the surface of a material with which it is in contact. The thickness of such a layer is several Debye lengths thick, a value whose size depends on various characteristics of plasma (e.g. temperature, density, etc.). A Debye sheath arises in a plasma because the electrons usually have a temperature on the order of magnitude or greater than that of the ions and are much lighter. Consequently, they are faster than the ions by at least a factor of \sqrt. At the interface to a material surface, therefore, the electrons will fly out of the plasma, charging the surface negative relative to the bulk plasma. Due to Debye shielding, the scale length of the transition region will be the Debye length \lambda_\mathrm. As the potential increases, more and more electrons are reflected by the sh ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dielectric Breakdown
Electrical breakdown or dielectric breakdown is a process that occurs when an electrical insulating material, subjected to a high enough voltage, suddenly becomes an electrical conductor and electric current flows through it. All insulating materials undergo breakdown when the electric field caused by an applied voltage exceeds the material's dielectric strength. The voltage at which a given insulating object becomes conductive is called its breakdown voltage and in addition to its dielectric strength depends on its size and shape, and the location on the object at which the voltage is applied. Under sufficient electrical potential, electrical breakdown can occur within solids, liquids, or gases (and theoretically even in a vacuum). However, the specific breakdown mechanisms are different for each kind of dielectric medium. Electrical breakdown may be a momentary event (as in an electrostatic discharge), or may lead to a continuous electric arc if protective devices fail to ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Silicon Wafer
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit. History In the semiconductor or silicon wafer industry, the term wafer appeared in the 1950s to describe a thin round slice of semiconductor material, typically germanium or silicon. Round shape comes from single-crystal ingots usually produced using the Czochralski method. Silicon wafers were first introduced in the 1940s. By 1960, silicon wafers were being manufactured in the U.S. by ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
ISM Band
The ISM radio bands are portions of the radio spectrum reserved internationally for industrial, scientific and medical (ISM) purposes, excluding applications in telecommunications. Examples of applications for the use of radio frequency (RF) energy in these bands include radio-frequency process heating, microwave ovens, and medical diathermy machines. The powerful emissions of these devices can create electromagnetic interference and disrupt radio communication using the same frequency, so these devices are limited to certain bands of frequencies. In general, communications equipment operating in ISM bands must tolerate any interference generated by ISM applications, and users have no regulatory protection from ISM device operation in these bands. Despite the intent of the original allocations, in recent years the fastest-growing use of these bands has been for short-range, low power wireless communications systems, since these bands are often approved for such devices, w ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
