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Physics Of Failure
Physics of failure is a technique under the practice of reliability design that leverages the knowledge and understanding of the processes and mechanisms that induce failure to predict reliability and improve product performance. Other definitions of Physics of Failure include: * A science-based approach to reliability that uses modeling and simulation to design-in reliability. It helps to understand system performance and reduce decision risk during design and after the equipment is fielded. This approach models the root causes of failure such as fatigue, fracture, wear, and corrosion. * An approach to the design and development of reliable product to prevent failure, based on the knowledge of root cause failure mechanisms. The Physics of Failure (PoF) concept is based on the understanding of the relationships between requirements and the physical characteristics of the product and their variation in the manufacturing processes, and the reaction of product elements and materials t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reliability Engineering
Reliability engineering is a sub-discipline of systems engineering that emphasizes the ability of equipment to function without failure. Reliability is defined as the probability that a product, system, or service will perform its intended function adequately for a specified period of time, OR will operate in a defined environment without failure. Reliability is closely related to availability, which is typically described as the ability of a component or system to function at a specified moment or interval of time. The ''reliability function'' is theoretically defined as the probability of success. In practice, it is calculated using different techniques, and its value ranges between 0 and 1, where 0 indicates no probability of success while 1 indicates definite success. This probability is estimated from detailed (physics of failure) analysis, previous data sets, or through reliability testing and reliability modeling. Availability, testability, maintainability, and maintenance ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electromigration
Electromigration is the transport of material caused by the gradual movement of the ions in a Conductor (material), conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current densities are used, such as in microelectronics and related structures. As the structure size in electronics such as integrated circuits (ICs) decreases, the practical significance of this effect increases. History The phenomenon of electromigration has been known for over 100 years, having been discovered by the French scientist Gerardin. The topic first became of practical interest during the late 1960s when packaged ICs first appeared. The earliest commercially available ICs failed in a mere three weeks of use from runaway electromigration, which led to a major industry effort to correct this problem. The first observation of electromigration in thin films was made by I. Blech.I. Blech: ''Electromigratio ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Critical Plane Analysis
Critical plane analysis refers to the analysis of Stress (mechanics), stresses or Deformation (mechanics), strains as they are experienced by a particular plane in a material, as well as the identification of which plane is likely to experience the most extreme damage mechanics, damage. Critical plane analysis is widely used in engineering to account for the effects of cyclic, multiaxial load histories on the fatigue (material), fatigue life of materials and structures. When a structure is under cyclic multiaxial loading, it is necessary to use multiaxial fatigue criteria that account for the multiaxial loading. If the cyclic multiaxial loading is nonproportional it is mandatory to use a proper multiaxial fatigue criteria. The multiaxial criteria based on the Critical Plane Method are the most effective criteria. For the plane stress case, the orientation of the plane may be specified by an angle in the plane, and the stresses and strains acting on this plane may be computed via Mo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Finite Element Software Packages
This is a list of notable Computer software, software packages that implement the finite element method for solving partial differential equations. Feature comparison This table is contributed by a FEA-compare For ease of maintenance of this table, please, first consider to contribute changes directly to the project instead of editing the table below, however, direct wiki edits are also valid and will be backported project, which provides an alternative view of this table with the first row and Feature column being fixed for ease of table exploration. References {{DEFAULTSORT:List Of Finite Element Software Packages Scientific simulation software Engineering software companies Finite element software, List of finite element software packages Numerical analysis Lists of software, finite element ...[...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Power Cycling
Power cycling is the act of turning a piece of equipment, usually a computer, off and then on again. Reasons for power cycling include having an electronic device reinitialize its set of configuration parameters or recover from an unresponsive state of its mission critical functionality, such as in a crash or hang situation. Power cycling can also be used to reset network activity inside a modem. It can also be among the first steps for troubleshooting an issue. Overview Power cycling can be done manually, usually using the power switch on the device, or remotely, through some type of external device connected to the power input. In the data center environment, remote control power cycling can usually be done through a power distribution unit, over the network. In the home environment, this can be done through home automation powerline communications. Most Internet Service Providers publish a "how-to" on their website showing their customers the correct procedure to power cycle ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sherlock Automated Design Analysis
Sherlock Automated Design Analysis is a software tool developed by DfR Solutions for analyzing, grading, and certifying the expected reliability of products at the circuit card assembly level. Based on the physics of failure, Sherlock predicts failure mechanism-specific failure rates over time using a combination of finite element method and material properties to capture stress values and first order analytical equations to evaluate damage evolution. The software is designed for use by design and reliability engineers and managers in the electronics industry. DfR Solutions is based in Beltsville, Maryland, USA, and was acquired by Ansys in May 2019. Approach Users upload either a complete design package, like ODB++ or IPC-2581, or individual data packets, such as Gerber, Bill of Materials, and Pick and Place files. Sherlock incorporates stresses from a variety of environments into its physics-based prediction algorithms, including elevated temperature, thermal cycling, vibrati ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Humidity
Humidity is the concentration of water vapor present in the air. Water vapor, the gaseous state of water, is generally invisible to the human eye. Humidity indicates the likelihood for precipitation (meteorology), precipitation, dew, or fog to be present. Humidity depends on the temperature and pressure of the system of interest. The same amount of water vapor results in higher relative humidity in cool air than warm air. A related parameter is the dew point. The amount of water vapor needed to achieve saturation increases as the temperature increases. As the temperature of a parcel of air decreases it will eventually reach the saturation point without adding or losing water mass. The amount of water vapor contained within a parcel of air can vary significantly. For example, a parcel of air near saturation may contain 8 g of water per cubic metre of air at , and 28 g of water per cubic metre of air at Three primary measurements of humidity are widely employed: abso ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Negative Bias Temperature Instability
Negative-bias temperature instability (NBTI) is a key reliability issue in MOSFETs, a type of transistor aging. NBTI manifests as an increase in the threshold voltage and consequent decrease in drain current and transconductance of a MOSFET. The degradation is often approximated by a power-law dependence on time. It is of immediate concern in p-channel MOS devices (pMOS), since they almost always operate with negative gate-to-source voltage; however, the very same mechanism also affects nMOS transistors when biased in the accumulation region, i.e. with a negative bias applied to the gate. More specifically, over time positive charges become trapped at the oxide-semiconductor boundary underneath the gate of a MOSFET. These positive charges partially cancel the negative gate voltage ''without'' contributing to conduction through the channel as electron holes in the semiconductor are supposed to. When the gate voltage is removed, the trapped charges dissipate over a time scale of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hot Carrier Injection
Hot carrier injection (HCI) is a phenomenon in solid-state electronic devices where an electron or a “hole” gains sufficient kinetic energy to overcome a potential barrier necessary to break an interface state. The term "hot" refers to the effective temperature used to model carrier density, not to the overall temperature of the device. Since the charge carriers can become trapped in the gate dielectric of a MOS transistor, the switching characteristics of the transistor can be permanently changed. Hot-carrier injection is one of the mechanisms that adversely affects the reliability of semiconductors of solid-state devices. Physics The term “hot carrier injection” usually refers to the effect in MOSFETs, where a carrier is injected from the conducting channel in the silicon substrate to the gate dielectric, which usually is made of silicon dioxide (SiO2). To become “hot” and enter the conduction band of SiO2, an electron must gain a kinetic energy of ~3.2&nb ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Time Dependent Dielectric Breakdown
Time is the continuous progression of existence that occurs in an apparently irreversible succession from the past, through the present, and into the future. It is a component quantity of various measurements used to sequence events, to compare the duration of events (or the intervals between them), and to quantify rates of change of quantities in material reality or in the conscious experience. Time is often referred to as a fourth dimension, along with three spatial dimensions. Time is one of the seven fundamental physical quantities in both the International System of Units (SI) and International System of Quantities. The SI base unit of time is the second, which is defined by measuring the electronic transition frequency of caesium atoms. General relativity is the primary framework for understanding how spacetime works. Through advances in both theoretical and experimental investigations of spacetime, it has been shown that time can be distorted and dilated, particularl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Scaling Factor
In affine geometry, uniform scaling (or isotropic scaling) is a linear transformation that enlarges (increases) or shrinks (diminishes) objects by a '' scale factor'' that is the same in all directions ( isotropically). The result of uniform scaling is similar (in the geometric sense) to the original. A scale factor of 1 is normally allowed, so that congruent shapes are also classed as similar. Uniform scaling happens, for example, when enlarging or reducing a photograph, or when creating a scale model of a building, car, airplane, etc. More general is scaling with a separate scale factor for each axis direction. Non-uniform scaling (anisotropic scaling) is obtained when at least one of the scaling factors is different from the others; a special case is directional scaling or stretching (in one direction). Non-uniform scaling changes the shape of the object; e.g. a square may change into a rectangle, or into a parallelogram if the sides of the square are not parallel to the s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Boltzmann Constant
The Boltzmann constant ( or ) is the proportionality factor that relates the average relative thermal energy of particles in a ideal gas, gas with the thermodynamic temperature of the gas. It occurs in the definitions of the kelvin (K) and the molar gas constant, in Planck's law of black-body radiation and Boltzmann's entropy formula, and is used in calculating Johnson–Nyquist noise, thermal noise in resistors. The Boltzmann constant has Dimensional analysis, dimensions of energy divided by temperature, the same as entropy and heat capacity. It is named after the Austrian scientist Ludwig Boltzmann. As part of the 2019 revision of the SI, the Boltzmann constant is one of the seven "Physical constant, defining constants" that have been defined so as to have exact finite decimal values in SI units. They are used in various combinations to define the seven SI base units. The Boltzmann constant is defined to be exactly joules per kelvin, with the effect of defining the SI unit ke ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
