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Photoresist
A photoresist (also known simply as a resist) is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface. This process is crucial in the electronics industry. The process begins by coating a substrate with a light-sensitive organic material. A patterned mask is then applied to the surface to block light, so that only unmasked regions of the material will be exposed to light. A solvent, called a developer, is then applied to the surface. In the case of a positive photoresist, the photo-sensitive material is degraded by light and the developer will dissolve away the regions that were exposed to light, leaving behind a coating where the mask was placed. In the case of a negative photoresist, the photosensitive material is strengthened (either polymerized or cross-linked) by light, and the developer will dissolve away only the regions that were not exposed to light, leaving behind a coating in areas w ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photoresist Of Photolithography
A photoresist (also known simply as a resist) is a sensitometry, light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface. This process is crucial in the electronics industry. The process begins by coating a substrate with a light-sensitive organic material. A patterned mask is then applied to the surface to block light, so that only unmasked regions of the material will be exposed to light. A solvent, called a developer, is then applied to the surface. In the case of a positive photoresist, the photo-sensitive material is degraded by light and the developer will dissolve away the regions that were exposed to light, leaving behind a coating where the mask was placed. In the case of a negative photoresist, the photosensitive material is strengthened (either polymerized or cross-linked) by light, and the developer will dissolve away only the regions that were not exposed to light, leaving behind a coati ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photolithography
Photolithography (also known as optical lithography) is a process used in the manufacturing of integrated circuits. It involves using light to transfer a pattern onto a substrate, typically a silicon wafer. The process begins with a photosensitive material, called a photoresist, being applied to the substrate. A photomask that contains the desired pattern is then placed over the photoresist. Light is shone through the photomask, exposing the photoresist in certain areas. The exposed areas undergo a chemical change, making them either soluble or insoluble in a developer solution. After development, the pattern is transferred onto the substrate through etching, chemical vapor deposition, or ion implantation processes. Ultraviolet, Ultraviolet (UV) light is typically used. Photolithography processes can be classified according to the type of light used, including ultraviolet lithography, deep ultraviolet lithography, extreme ultraviolet lithography, extreme ultraviolet lithography ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SU-8 Photoresist
SU-8 is a commonly used epoxy-based negative photoresist. Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. As shown in the structural diagram, SU-8 derives its name from the presence of 8 epoxy groups. This is a statistical average per moiety. It is these epoxies that cross-link to give the final structure. It can be made into a viscous polymer that can be spun or spread over a thickness ranging from below 1 micrometer up to above 300 micrometers, or Thick Film Dry Sheets (TFDS) for lamination up to above 1 millimetre thick. Up to 500 μm, the resist can be processed with standard contact lithography. Above 500 μm, absorption leads to increasing sidewall undercuts and poor curing at the substrate interface. It can be used to pattern high aspect ratio structures. An aspect ratio of (> 20) has been achieved with the solution formulat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photoengraving
Photoengraving is a process that uses a light-sensitive photoresist applied to the surface to be engraved to create a mask that protects some areas during a subsequent operation which etches, dissolves, or otherwise removes some or all of the material from the unshielded areas of a substrate. Normally applied to metal, it can also be used on glass, plastic and other materials. A photoresist is selected which is resistant to the particular acid or other etching compound to be used. It may be a liquid applied by brushing, spraying, pouring or other means and then allowed to set, or it may come in sheet form and be applied by laminating. It is then exposed to light—usually strong ultraviolet (UV) light—through a photographic, mechanically printed, or manually created image or pattern on transparent film. Alternatively, a lens may be used to project an image directly onto it. Typically, the photoresist is hardened where it receives sufficient exposure to light, but some photores ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
SU-8
SU-8 is a commonly used epoxy-based negative photoresist. Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. As shown in the structural diagram, SU-8 derives its name from the presence of 8 epoxy groups. This is a statistical average per moiety. It is these epoxies that cross-link to give the final structure. It can be made into a viscous polymer that can be spun or spread over a thickness ranging from below 1 micrometer up to above 300 micrometers, or Thick Film Dry Sheets (TFDS) for lamination up to above 1 millimetre thick. Up to 500 μm, the resist can be processed with standard contact lithography. Above 500 μm, absorption leads to increasing sidewall undercuts and poor curing at the substrate interface. It can be used to pattern high aspect ratio structures. An aspect ratio of (> 20) has been achieved with the solution formulat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Photopolymer
A photopolymer or light-activated resin is a polymer that changes its properties when exposed to light, often in the ultraviolet or visible region of the electromagnetic spectrum. These changes are often manifested structurally, for example hardening of the material occurs as a result of cross-linking when exposed to light. An example is shown below depicting a mixture of monomers, oligomers, and photoinitiators that conform into a hardened polymeric material through a process called curing. A wide variety of technologically useful applications rely on photopolymers; for example, some enamels and varnishes depend on photopolymer formulation for proper hardening upon exposure to light. In some instances, an enamel can cure in a fraction of a second when exposed to light, as opposed to thermally cured enamels which can require half an hour or longer. Curable materials are widely used for medical, printing, and photoresist technologies. Changes in structural and chemical propert ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Diazonaphthoquinone
Diazonaphthoquinone (DNQ) is a diazo derivative of naphthoquinone. Upon exposure to light, DNQ converts to a derivative that is susceptible to etching. In this way, DNQ has become an important reagent in photoresist technology in the semiconductor industry. Diazonaphthoquinone sulfonic acid esters are components of common photoresist materials. Such photoresists are used in the manufacture of semiconductors. In this application DNQs are mixed with Novolac resin, a type of phenolic polymer. The DNQ functions as a dissolution inhibitor. During the masking/patterning process, portions of the photoresist film are exposed to light while others remain unexposed. In the unexposed regions of the resist film, the DNQ acts as a dissolution inhibitor and the resist remains insoluble in the aqueous base developer. In the exposed regions, the DNQ forms a ketene In organic chemistry, a ketene is an organic compound of the form , where R and R' are two arbitrary valence (chemistry), mon ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Microelectromechanical Systems
MEMS (micro-electromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2. They usually consist of a central unit that processes data (an integrated circuit chip such as microprocessor) and several components that interact with the surroundings (such as microsensors). Because of the large surface area to volume ratio of MEMS, forces produced by ambient electromagnetism (e.g., electrostatic charges and magnetic moments), and fluid dynamics (e.g., surface tension and viscosity) are more important design considerations than with larger scale mechanical devices. MEMS technology is distinguished from molecular nanotechnol ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Diazonaphthoquinone
Diazonaphthoquinone (DNQ) is a diazo derivative of naphthoquinone. Upon exposure to light, DNQ converts to a derivative that is susceptible to etching. In this way, DNQ has become an important reagent in photoresist technology in the semiconductor industry. Diazonaphthoquinone sulfonic acid esters are components of common photoresist materials. Such photoresists are used in the manufacture of semiconductors. In this application DNQs are mixed with Novolac resin, a type of phenolic polymer. The DNQ functions as a dissolution inhibitor. During the masking/patterning process, portions of the photoresist film are exposed to light while others remain unexposed. In the unexposed regions of the resist film, the DNQ acts as a dissolution inhibitor and the resist remains insoluble in the aqueous base developer. In the exposed regions, the DNQ forms a ketene In organic chemistry, a ketene is an organic compound of the form , where R and R' are two arbitrary valence (chemistry), mon ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Deep Ultraviolet
Ultraviolet radiation, also known as simply UV, is electromagnetic radiation of wavelengths of 10–400 nanometers, shorter than that of visible light, but longer than X-rays. UV radiation is present in sunlight and constitutes about 10% of the total electromagnetic radiation output from the Sun. It is also produced by electric arcs, Cherenkov radiation, and specialized lights, such as mercury-vapor lamps, tanning lamps, and black lights. The photons of ultraviolet have greater energy than those of visible light, from about 3.1 to 12 electron volts, around the minimum energy required to ionize atoms. Although long-wavelength ultraviolet is not considered an ionizing radiation because its photons lack sufficient energy, it can induce chemical reactions and cause many substances to glow or fluoresce. Many practical applications, including chemical and biological effects, are derived from the way that UV radiation can interact with organic molecules. These i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Poly(phthalaldehyde)
Poly(phthalaldehyde), abbreviated as PPA, is a metastable Smart polymer, stimuli-responsive polymer first synthesized in 1967. It has garnered significant attention during the past couple of years due to its ease of synthesis and outstanding transient and mechanical properties. For this reason, it has been exploited for a variety of applications including sensing, drug delivery, and Extreme ultraviolet lithography, EUV lithography. As of 2023, it is considered the only aromatic aldehyde polymerized through a living Chain-growth polymerization, chain growth polymerization. Discovery and history Poly(phthalaldehyde) was first reported in 1967 by Chuji Aso and Sanae Tagami from the department of Organic Synthesis at Kyushu University by an addition Homopolymerization, homopolymerization reaction of aromatic O-Phthalaldehyde, ''o''-phthalaldehyde. This polymer, consisting of a polyacetal main chain, is still to date, the only aromatic aldehyde that can be homopolymerized through a c ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Tetramethylammonium Hydroxide
Tetramethylammonium hydroxide (TMAH or TMAOH) is a quaternary ammonium salt with molecular formula N(CH3)4+ OH−. It is commonly encountered in form of concentrated solutions in water or methanol. TMAH in solid state and its aqueous solutions are all colorless, but may be yellowish if impure. Although TMAH has virtually no odor when pure, samples often have a strong fishy smell due to presence of trimethylamine which is a common impurity. TMAH has several diverse industrial and research applications. Chemical properties Structure TMAH is most commonly encountered as an aqueous solution, in concentrations from ~2–25%, and less frequently as solutions in methanol. These solutions are identified by CAS numbe75-59-2 Several hydrates such as N(CH3)4OH·xH2O. have been crystallized. These salts contain well separated Me4N+ cations and hydroxide anions ( Me is an abbreviation of methyl group). The hydroxide groups are linked by hydrogen bonds to the water of crystallization ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
