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Package On Package
Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations. Configuration Two widely used configurations exist for PoP: * Pure memory stacking: two or more memory only packages are stacked on each other * Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be a system on a chip (SoC) for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard. During PCB assembly, the bottom package of a P ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit Packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing. The packaging stage is followed by testing of the integrated circuit. The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip sign ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Institute Of Electrical And Electronics Engineers
The Institute of Electrical and Electronics Engineers (IEEE) is a 501(c)(3) professional association for electronic engineering and electrical engineering (and associated disciplines) with its corporate office in New York City and its operations center in Piscataway, New Jersey. The mission of the IEEE is ''advancing technology for the benefit of humanity''. The IEEE was formed from the amalgamation of the American Institute of Electrical Engineers and the Institute of Radio Engineers in 1963. Due to its expansion of scope into so many related fields, it is simply referred to by the letters I-E-E-E (pronounced I-triple-E), except on legal business documents. , it is the world's largest association of technical professionals with more than 423,000 members in over 160 countries around the world. Its objectives are the educational and technical advancement of electrical and electronic engineering, telecommunications, computer engineering and similar disciplines. History Or ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronics, electronic devices. It is a multiple-step sequence of Photolithography, photolithographic and chemical processing steps (such as surface passivation, thermal oxidation, planar process, planar diffusion and p–n junction isolation, junction isolation) during which electronic circuits are gradually created on a wafer (electronics), wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The entire manufacturing process takes time, from start to packaged chips ready for shipment, at least six to eight weeks (tape-out only, not including the circuit design) and is performed in highly specialized semiconduct ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Korea Times
''The Korea Times'' is the oldest of three English-language newspapers published daily in South Korea. It is a sister paper of the ''Hankook Ilbo'', a major Korean language daily; both are owned by Dongwha Enterprise, a wood-based manufacturer. Since the late 1950s, it had been published by the Hankook Ilbo Media Group, but following an embezzlement scandal in 2013–2014 it was sold to Dongwha Group, which also acquired ''Hankook Ilbo''. The president-publisher of ''The Korea Times'' is Oh Young-jin. Former Korean President Kim Dae-jung famously taught himself English by reading ''The Korea Times''. Newspaper headquarters The newspaper's headquarters is located in the same building with ''Hankook Ilbo'' on Sejong-daero between Sungnyemun and Seoul Station in Seoul, South Korea. The publication also hosts major operations in New York City and Los Angeles. History ''The Korea Times'' was founded by Helen Kim five months into the 1950-53 Korean War. The first issue on Nove ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hynix Semiconductor
SK hynix Inc. is a South Korean supplier of dynamic random-access memory (DRAM) chips and flash memory chips. Hynix is the world's second-largest memory chipmaker (after Samsung Electronics) and the world's third-largest semiconductor company. Founded as Hyundai Electronic Industrial Co., Ltd. in 1983 and known as Hyundai Electronics, the company has manufacturing sites in Korea, the United States, mainland China and Taiwan. In 2012, when SK Telecom became its major shareholder, Hynix merged with SK Group (the third largest conglomerate in South Korea). The company's major customers include Microsoft, Apple, Asus, Dell, MSI, HP Inc., and Hewlett Packard Enterprise (formerly Hewlett-Packard). Other products that use Hynix memory include DVD players, cellular phones, set-top boxes, personal digital assistants, networking equipment, and hard disk drives. History * 1949: Founded as Gukdo construction. * 1983: Incorporated and renamed as Hyundai Electronics Industries Co., Ltd. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Maxim Integrated
Maxim Integrated, a subsidiary of Analog Devices, designs, manufactures, and sells analog and mixed-signal integrated circuits for the automotive, industrial, communications, consumer, and computing markets. Maxim's product portfolio includes power and battery management ICs, sensors, analog ICs, interface ICs, communications solutions, digital ICs, embedded security, and microcontrollers. The company is headquartered in San Jose, California, and has design centers, manufacturing facilities, and sales offices worldwide. History Maxim was founded in April 1983. The founding team included Jack Gifford, a semiconductor industry pioneer since the 1960s; Fred Beck, an IC sales and distribution pioneer; Dave Bingham, General Electric’s Scientist of the Year in 1982; Steve Combs, a pioneer in wafer technologies and manufacturing; Lee Evans, also a pioneer in CMOS analog microchip design and General Electric’s Scientist of the Year in 1982; Dave Fullagar, inventor of the first inte ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
NAND Flash
Flash memory is an electronic non-volatile computer memory storage medium that can be electrically erased and reprogrammed. The two main types of flash memory, NOR flash and NAND flash, are named for the NOR and NAND logic gates. Both use the same cell design, consisting of floating gate MOSFETs. They differ at the circuit level depending on whether the state of the bit line or word lines is pulled high or low: in NAND flash, the relationship between the bit line and the word lines resembles a NAND gate; in NOR flash, it resembles a NOR gate. Flash memory, a type of floating-gate memory, was invented at Toshiba in 1980 and is based on EEPROM technology. Toshiba began marketing flash memory in 1987. EPROMs had to be erased completely before they could be rewritten. NAND flash memory, however, may be erased, written, and read in blocks (or pages), which generally are much smaller than the entire device. NOR flash memory allows a single machine word to be written to an era ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Embedded System
An embedded system is a computer system—a combination of a computer processor, computer memory, and input/output peripheral devices—that has a dedicated function within a larger mechanical or electronic system. It is ''embedded'' as part of a complete device often including electrical or electronic hardware and mechanical parts. Because an embedded system typically controls physical operations of the machine that it is embedded within, it often has real-time computing constraints. Embedded systems control many devices in common use today. , it was estimated that ninety-eight percent of all microprocessors manufactured were used in embedded systems. Modern embedded systems are often based on microcontrollers (i.e. microprocessors with integrated memory and peripheral interfaces), but ordinary microprocessors (using external chips for memory and peripheral interface circuits) are also common, especially in more complex systems. In either case, the processor(s) u ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Gibibyte
The byte is a unit of digital information that most commonly consists of eight bits. Historically, the byte was the number of bits used to encode a single character of text in a computer and for this reason it is the smallest addressable unit of memory in many computer architectures. To disambiguate arbitrarily sized bytes from the common 8-bit definition, network protocol documents such as The Internet Protocol () refer to an 8-bit byte as an octet. Those bits in an octet are usually counted with numbering from 0 to 7 or 7 to 0 depending on the bit endianness. The first bit is number 0, making the eighth bit number 7. The size of the byte has historically been hardware-dependent and no definitive standards existed that mandated the size. Sizes from 1 to 48 bits have been used. The six-bit character code was an often-used implementation in early encoding systems, and computers using six-bit and nine-bit bytes were common in the 1960s. These systems often had memory words ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dynamic Random-access Memory
Dynamic random-access memory (dynamic RAM or DRAM) is a type of random-access semiconductor memory that stores each bit of data in a memory cell, usually consisting of a tiny capacitor and a transistor, both typically based on metal-oxide-semiconductor (MOS) technology. While most DRAM memory cell designs use a capacitor and transistor, some only use two transistors. In the designs where a capacitor is used, the capacitor can either be charged or discharged; these two states are taken to represent the two values of a bit, conventionally called 0 and 1. The electric charge on the capacitors gradually leaks away; without intervention the data on the capacitor would soon be lost. To prevent this, DRAM requires an external '' memory refresh'' circuit which periodically rewrites the data in the capacitors, restoring them to their original charge. This refresh process is the defining characteristic of dynamic random-access memory, in contrast to static random-access memory (S ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
EDRAM
Embedded DRAM (eDRAM) is dynamic random-access memory (DRAM) integrated on the same die or multi-chip module (MCM) of an application-specific integrated circuit (ASIC) or microprocessor. eDRAM's cost-per-bit is higher when compared to equivalent standalone DRAM chips used as external memory, but the performance advantages of placing eDRAM onto the same chip as the processor outweigh the cost disadvantages in many applications. In performance and size, eDRAM is positioned between level 3 cache and conventional DRAM on the memory bus, and effectively functions as a level 4 cache, though architectural descriptions may not explicitly refer to it in those terms. Embedding memory on the ASIC or processor allows for much wider buses and higher operation speeds, and due to much higher density of DRAM in comparison to SRAM, larger amounts of memory can be installed on smaller chips if eDRAM is used instead of eSRAM. eDRAM requires additional fab process steps compared with embedded S ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PSP Hardware
The PlayStation Portable's hardware consists of the physical components of the PlayStation Portable (PSP) and its accessories. Overview The PSP was designed by for the Sony Computer Entertainment subsidiary of Sony Corporation. Early models pre-installed with 1.xx firmware were made in Japan but in order to cut costs, Sony has farmed out PSP production to non-Japanese manufacturers, mainly in China for units pre-installed with firmware version 2.00 and above. The unit measures 170 mm (6.7 inches) in length, 74 mm (2.9 inches) in width, and 23 mm (0.9 inches) in depth, and has a mass of 280 grams (9.9 oz or 0.62 lb) including the battery. The Samsung (previously Sharp) branded TFT LCD screen measures 110 mm (4.3 in) diagonal with a 16:9 ratio and a 480×272 pixel resolution capable of 16.77 million colors and has a brightness of up to 115 (battery powered) or 148 cd/m2 (AC powered). It has four possible brightness settings, the b ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
