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Organic Solderability Preservative
Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering. The compounds typically used are from the azole family such as benzotriazoles, imidazoles, benzimidazoles. These adsorb on copper surfaces, by forming coordination bonds with copper atoms and form thicker films through formation of copper (I) – N–heterocycle complexes. The typical film thickness used is in the tens to hundreds of nanometers. See also * Electroless nickel immersion gold (ENIG) * Hot air solder leveling (HASL) * Immersion silver plating (IAg) * Immersion tin plating (ISn) * Reflow soldering * Wave soldering Wave soldering is a bulk soldering process used for the manufacturing of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the ci ... ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Coating
A coating is a covering that is applied to the surface of an object, usually referred to as the Substrate (materials science), substrate. The purpose of applying the coating may be decorative, functional, or both. Coatings may be applied as liquids, gases or solids e.g. Powder coatings. Paints and lacquers are coatings that mostly have dual uses of protecting the substrate and being decorative, although some artists paints are only for decoration, and the paint on large industrial pipes is for preventing corrosion and identification e.g. blue for process water, red for fire-fighting control etc. Functional coatings may be applied to change the surface properties of the substrate, such as adhesion, Wetting, wettability, corrosion resistance, or wear resistance. In other cases, e.g. semiconductor device fabrication (where the substrate is a wafer (electronics), wafer), the coating adds a completely new property, such as a magnetic response or electrical conductivity, and forms an e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heterocyclic Compound
A heterocyclic compound or ring structure is a cyclic compound that has atoms of at least two different elements as members of its ring(s). Heterocyclic chemistry is the branch of organic chemistry dealing with the synthesis, properties, and applications of these heterocycles. Examples of heterocyclic compounds include all of the nucleic acids, the majority of drugs, most biomass (cellulose and related materials), and many natural and synthetic dyes. More than half of known compounds are heterocycles. 59% of US FDA-approved drugs contain nitrogen heterocycles. Classification The study of heterocyclic chemistry focuses especially on unsaturated derivatives, and the preponderance of work and applications involves unstrained 5- and 6-membered rings. Included are pyridine, thiophene, pyrrole, and furan. Another large class of heterocycles refers to those fused to benzene rings. For example, the fused benzene derivatives of pyridine, thiophene, pyrrole, and furan are quinol ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reflow Soldering
Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or (unconventionally) by soldering individual joints with a desoldering hot air pencil. Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology components or SMT to a printed circuit board or PCB. Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly. Reflow ovens meant specifically for the soldering of surface mount components may also be used for through-hole components by filling the holes with solder paste and inse ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Immersion Tin Plating
Immersion may refer to: The arts * "Immersion", a 2012 story by Aliette de Bodard * ''Immersion'', a French comic book series by Léo Quievreux * ''Immersion'' (album), the third album by Australian group Pendulum * ''Immersion'' (film), a 2021 Chilean thriller film * Immersion (series), a webseries which test the concepts of video games in real life, created by Rooster Teeth Productions * Immersion journalism, a style of journalism Science and technology * Immersion lithography or immersion microscopy, optical techniques in which liquid is between the objective and image plane in order to raise numerical aperture * Immersion (mathematics), a smooth map whose differential is everywhere injective, related to the mathematical concept of an embedding * Immersion (virtual reality), the perception of being physically present in a non-physical world, created by using VR Other uses * Immersion baptism, a type of baptism whereby the subject is immersed in water * Immersion Corporation, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Immersion Silver Plating
Immersion silver plating (or IAg plating) is a surface plating process that creates a thin layer of silver over copper objects. It consists in dipping the object briefly into a solution containing silver ions. Immersion silver plating is used by the electronics industry in manufacture of printed circuit boards (PCBs), to protect copper conductors from oxidation and improve solderability. Advantages and disadvantages Immersion silver coatings have excellent surface planarity, compared more traditional coating processes such as hot air solder leveling (HASL). They also have low losses in high-frequency applications due to the skin effect. On the other hand, silver coatings will degrade over time due to oxidation or air contaminants such as sulfur compounds and chlorine. A problem peculiar to silver coatings is the formation of silver whiskers under electric fields, which may short out components. Specifications IPC Standard: IPC-4553 See also * Electroless nickel immersion gol ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hot Air Solder Leveling
{{unreferenced, date=November 2012 HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs). The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives. HASL can be applied with or without lead (Pb), but only lead-free HASL is RoHS compliant. Advantages of HASL * Excellent wetting during component soldering * Avoids copper corrosion. Disadvantages of HASL * Low planarity on vertical levelers may make this surface finish unsuitable for use with fine pitch components. Improved planarity can be achieved using a horizontal leveler. * High thermal stress during the process may introduce defects into PCB See also * Electroless Nickel Immersion Gold (ENIG) * Immersion Silver (IAg) * Organic Solderability Preservative (OSP) * Reflow soldering * Wave soldering Wave soldering is a bulk soldering process used f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electroless Nickel Immersion Gold
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to while the gold is reduced to metallic state. A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG. ENIG can be applied before or after the solder mask, also known as overall or selective chemical Ni/Au, respectively. The latter type is more common and significantly cheaper as less gold is needed to cover only the solder pads. Advantages and disadvantages ENIG and ENEPIG are meant ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Nanometer
330px, Different lengths as in respect to the molecular scale. The nanometre (international spelling as used by the International Bureau of Weights and Measures; SI symbol: nm) or nanometer (American and British English spelling differences#-re, -er, American spelling) is a units of measurement, unit of length in the International System of Units (SI), equal to one billionth (short scale) of a metre () and to 1000 picometres. One nanometre can be expressed in scientific notation as , and as metres. History The nanometre was formerly known as the millimicrometre – or, more commonly, the millimicron for short – since it is of a micron (micrometre), and was often denoted by the symbol mμ or (more rarely and confusingly, since it logically should refer to a ''millionth'' of a micron) as μμ. Etymology The name combines the SI prefix ''nano-'' (from the Ancient Greek , ', "dwarf") with the parent unit name ''metre'' (from Greek , ', "unit of measurement"). ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Coordination Complex
A coordination complex consists of a central atom or ion, which is usually metallic and is called the ''coordination centre'', and a surrounding array of bound molecules or ions, that are in turn known as ''ligands'' or complexing agents. Many metal-containing compounds, especially those that include transition metals (elements like titanium that belong to the Periodic Table's d-block), are coordination complexes. Nomenclature and terminology Coordination complexes are so pervasive that their structures and reactions are described in many ways, sometimes confusingly. The atom within a ligand that is bonded to the central metal atom or ion is called the donor atom. In a typical complex, a metal ion is bonded to several donor atoms, which can be the same or different. A polydentate (multiple bonded) ligand is a molecule or ion that bonds to the central atom through several of the ligand's atoms; ligands with 2, 3, 4 or even 6 bonds to the central atom are common. These compl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Coordination Bond
In coordination chemistry, a coordinate covalent bond, also known as a dative bond, dipolar bond, or coordinate bond is a kind of two-center, two-electron covalent bond in which the two electrons derive from the same atom. The bonding of metal ions to ligands involves this kind of interaction. This type of interaction is central to Lewis acid–base theory. Coordinate bonds are commonly found in coordination compounds. Examples Coordinate covalent bonding is ubiquitous. In all metal aquo-complexes (H2O)''n'''m''+, the bonding between water and the metal cation is described as a coordinate covalent bond. Metal-ligand interactions in most organometallic compounds and most coordination compounds are described similarly. The term ''dipolar bond'' is used in organic chemistry for compounds such as amine oxides for which the electronic structure can be described in terms of the basic amine donating two electrons to an oxygen atom. : → O The arrow → indicates that both ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Adsorb
Adsorption is the adhesion of atoms, ions or molecules from a gas, liquid or dissolved solid to a surface. This process creates a film of the ''adsorbate'' on the surface of the ''adsorbent''. This process differs from absorption, in which a fluid (the ''absorbate'') is dissolved by or permeates a liquid or solid (the ''absorbent''). Adsorption is a '' surface phenomenon'', while absorption involves the whole volume of the material, although adsorption does often precede absorption. The term ''sorption'' encompasses both processes, while ''desorption'' is the reverse of it. Like surface tension, adsorption is a consequence of surface energy. In a bulk material, all the bonding requirements (be they ionic, covalent or metallic) of the constituent atoms of the material are fulfilled by other atoms in the material. However, atoms on the surface of the adsorbent are not wholly surrounded by other adsorbent atoms and therefore can attract adsorbates. The exact nature of the bond ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
