|
Mini Small Outline Package
The Mini Small Outline Package (MSOP) a miniaturized version of the Shrink Small Outline ic package . Application Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in Disk drives, video/audio and consumer electronics. Physical properties The size of the Mini Small Outline Package is only 3mm x 3mm for the 8 & 10 pins version and 3mm x 4mm for the 12 & 16 pins version. The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability. Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB. Synonyms for the MSOP Package * μMAX or micro max - Maxim name for the msop package. * µMAX-EP or micro max exposed pad - Maxim name for the msop package with exposed pad. * MSE - Linear Technology name for the msop pa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Shrink Small-Outline Package
A small outline integrated circuit (SOIC) is a Surface-mount technology, surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin List of 4000 series integrated circuits, 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Disk Drives
Data storage is the recording (storing) of information (data) in a storage medium. Handwriting, phonographic recording, magnetic tape, and optical discs are all examples of storage media. Biological molecules such as RNA and DNA are considered by some as data storage. Recording may be accomplished with virtually any form of energy. Electronic data storage requires electrical power to store and retrieve data. Data storage in a digital, machine-readable medium is sometimes called ''digital data''. Computer data storage is one of the core functions of a general-purpose computer. Electronic documents can be stored in much less space than paper documents. Barcodes and magnetic ink character recognition (MICR) are two ways of recording machine-readable data on paper. Recording media A recording medium is a physical material that holds information. Newly created information is distributed and can be stored in four storage media–print, film, magnetic, and optical–and seen or ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Consumer Electronics
Consumer electronics or home electronics are electronic (analog or digital) equipment intended for everyday use, typically in private homes. Consumer electronics include devices used for entertainment, communications and recreation. Usually referred to as black goods due to many products being housed in black or dark casings. This term is used to distinguish them from "white goods" which are meant for housekeeping tasks, such as washing machines and refrigerators, although nowadays, these would be considered black goods, some of these being connected to the Internet. In British English, they are often called brown goods by producers and sellers. In the 2010s, this distinction is absent in large big box consumer electronics stores, which sell entertainment, communication and home office devices, light fixtures and appliances, including the bathroom type. Radio broadcasting in the early 20th century brought the first major consumer product, the broadcast receiver. Later produc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Footprint (electronics)
A footprint or land pattern is the arrangement of pads (in surface-mount technology) or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board. The land pattern on a circuit board matches the arrangement of leads on a component. Component manufacturers often produce multiple pin-compatible product variants to allow systems integrators to change the exact component in use without changing the footprint on the circuit board. This can provide large cost savings for integrators, especially with dense BGA components where the footprint pads may be connected to multiple layers of the circuit board. Many component vendors provide footprints for their components, includinTexas Instruments anCUI Other sources include third party libraries, such aSnapEDA See also * Surface-mount technology * Through-hole technology * Chip carrier * List of integrated circuit packaging types * IPC (standards body) * JED ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Moisture Sensitivity Level
Moisture sensitivity level (MSL) relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions (30 °C/85%RH at Level 1; 30 °C/60%RH at all other levels). Increasingly, semiconductors have been manufactured in smaller sizes. Components such as thin fine-pitch devices and ball grid arrays could be damaged during SMT reflow when moisture trapped inside the component expands. The expansion of trapped moisture can result in internal separation (delamination) of the plastic from the die or lead-frame, wire bond damage, die damage, and internal cracks. Most of this damage is not visible on the component surface. In extreme cases, cracks will extend to the component surface. In the most severe cases, the component will bulge and pop. This is known as the "popcorn" effect. This occurs when part temperature rises rapidly to a high ma ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small Outline Integrated Circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than JEDEC MS-012.) Note that because of th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Maxim Integrated
Maxim Integrated, a subsidiary of Analog Devices, designs, manufactures, and sells analog and mixed-signal integrated circuits for the automotive, industrial, communications, consumer, and computing markets. Maxim's product portfolio includes power and battery management ICs, sensors, analog ICs, interface ICs, communications solutions, digital ICs, embedded security, and microcontrollers. The company is headquartered in San Jose, California, and has design centers, manufacturing facilities, and sales offices worldwide. History Maxim was founded in April 1983. The founding team included Jack Gifford, a semiconductor industry pioneer since the 1960s; Fred Beck, an IC sales and distribution pioneer; Dave Bingham, General Electric’s Scientist of the Year in 1982; Steve Combs, a pioneer in wafer technologies and manufacturing; Lee Evans, also a pioneer in CMOS analog microchip design and General Electric’s Scientist of the Year in 1982; Dave Fullagar, inventor of the first inte ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Linear Technology
Linear Technology Corporation was an American semiconductor company that designed, manufactured and marketed high performance analog integrated circuits. Applications for the company's products included telecommunications, cellular telephones, networking products, notebook and desktop computers, video/multimedia, industrial instrumentation, automotive electronics, factory automation, process control, military and space systems. The company was founded in 1981 by Robert H. Swanson, Jr. and Robert C. Dobkin. In July 2016, Analog Devices agreed to buy Linear Technology for 14.8 billion dollars. This acquisition was finalized on March 10, 2017. The Linear name survives as the "Power by Linear" brand that is used to market the combined power management portfolios of Linear Technology and Analog Devices. Products As of August 2010, the company made over 7500 products, which they organized into seven product categories: data conversion (analog to digital converters, digital to anal ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thin Shrink Small Outline Package
The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull-wing leads. Application They are suited for applications requiring 1 mm or less mounted height and are commonly used in analog and operation amplifiers, controllers and Drivers, Logic, Memory, and RF/Wireless, Disk drives, video/audio and consumer electronics. Physical properties The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count. Body widths are 3.0 mm, 4.4 mm and 6.1 mm. The lead counts range from 8 to 80 pins. The lead pitches are 0.5 or 0.65 mm. Exposed Pad Some TSSOP packages have an exposed pad. This is a rectangular metal pad on the bottom side of the package. The exposed pad will be soldered on the pcb to transfer heat from the package to the pcb. In most applications, the exposed pad ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Integrated Circuit Packaging Types
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using " ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
_-_Linear_Technology_3455-1768.jpg "Click for more on -> Linear Technology")
