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MIL-STD-883
The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices. The standard was issued by Department of Defense Department of Defence or Department of Defense may refer to: Current ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pull Off Test
The pull-off test, also called stud pull test in which an adhesive connection is made between a stud and the carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested. The force required to pull the stud from the surface, together with the carrier, is Measure (mathematics), measured. Simple mechanical hand-operated loading Tool, equipment has been developed for this purpose. When higher accuracy is required, tests can be performed with more advanced equipment called a bond tester. A bond tester provides more control and possibly automation. Applying the glue automatically and curing with UV light is the next step in automation. This methodology can also be used to measure direct tensile strength or/and the bond strength between two different layers. MIL-STD-883 methods 2011.9 destructive bond pull test and 2031.1 flip chip pull off test apply, as well as JEDEC JESD22-B109. Partial coring may be us ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PIND
A PIND test is a Particle Impact Noise Detection test. According to method 2020.9 of MIL-STD-883 and method 2052.5 of MIL-STD-750, the purpose of a PIND test is to detect loose particles inside an electronics device cavity. The test provides a nondestructive means of identifying those devices containing particles of sufficient mass that, upon impact within the cavity, excite the transducer A transducer is a device that converts energy from one form to another. Usually a transducer converts a signal in one form of energy to a signal in another. Transducers are often employed at the boundaries of automation, measurement, and cont .... References Nondestructive testing {{measurement-stub ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Microelectronic
Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication) of very small electronic designs and components. Usually, but not always, this means micrometre-scale or smaller. These devices are typically made from semiconductor materials. Many components of normal electronic design are available in a microelectronic equivalent. These include transistors, capacitors, inductors, resistors, diodes and (naturally) insulators and conductors can all be found in microelectronic devices. Unique wiring techniques such as wire bonding are also often used in microelectronics because of the unusually small size of the components, leads and pads. This technique requires specialized equipment and is expensive. Digital integrated circuits (ICs) consist of billions of transistors, resistors, diodes, and capacitors. Analog circuits commonly contain resistors and capacitors as well. Inductors are used in som ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Aerospace
Aerospace is a term used to collectively refer to the atmosphere and outer space. Aerospace activity is very diverse, with a multitude of commercial, industrial and military applications. Aerospace engineering consists of aeronautics and astronautics. Aerospace organizations research, design, manufacture, operate, or maintain both aircraft and spacecraft. The beginning of space and the ending of the air is considered as 100 km (62 mi) above the ground according to the physical explanation that the air pressure is too low for a lifting body to generate meaningful lift force without exceeding orbital velocity. Overview In most industrial countries, the aerospace industry is a cooperation of the public and private sectors. For example, several states have a civilian space program funded by the government, such as NASA, National Aeronautics and Space Administration in the United States, European Space Agency in Europe, the Canadian Space Agency in Canada, Indian Space Re ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reliability (statistics)
In statistics and psychometrics, reliability is the overall consistency of a measure. A measure is said to have a high reliability if it produces similar results under consistent conditions:"It is the characteristic of a set of test scores that relates to the amount of random error from the measurement process that might be embedded in the scores. Scores that are highly reliable are precise, reproducible, and consistent from one testing occasion to another. That is, if the testing process were repeated with a group of test takers, essentially the same results would be obtained. Various kinds of reliability coefficients, with values ranging between 0.00 (much error) and 1.00 (no error), are usually used to indicate the amount of error in the scores." For example, measurements of people's height and weight are often extremely reliable.The Marketing Accountability Standards Board (MASB) endorses this definition as part of its ongoinCommon Language: Marketing Activities and Metrics Pr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-chip Module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. Overview Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Hybrid Integrated Circuit
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534. Overview "Integrated circuit" as the term is currently used refers to a monolithic IC which differs notably from a HIC in that a HIC is fabricated by inter-connecting a number of components on a substrate whereas an IC's (monolithic) components are fabricated in a series of steps entirely on a single wafer which is then diced into chips. Some hybrid circuits may contain monolithic ICs, particularly Multi-chip module (MCM) hybrid circuits. Hybrid circuits could be enc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Department Of Defense
Department of Defence or Department of Defense may refer to: Current departments of defence * Department of Defence (Australia) * Department of National Defence (Canada) * Department of Defence (Ireland) * Department of National Defense (Philippines) * Department of Defence (South Africa) * Federal Department of Defence, Civil Protection and Sport (Switzerland) * Department of Defense (United States) Historical * Department of Defence (1901–21) (Australia) * Department of Defence (1921–39) (Australia) * Department of Defence Co-ordination (Australia, 1939–1942) * Department of Defence Production (Australia, 1951–1958) * Department of Defence Support (Australia, 1982–1984) See also *Defence diplomacy, the pursuit of foreign policy objectives through the peaceful employment of defence resources and capabilities *Ministry of defence, a part of government *Ministry of Defence {{unsourced, date=February 2021 A ministry of defence or defense (see spelling differences), al ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Burn-in
Burn-in is the process by which components of a system are exercised before being placed in service (and often, before the system being completely assembled from those components). This testing process will force certain failures to occur under supervised conditions so an understanding of load capacity of the product can be established. The intention is to detect those particular components that would fail as a result of the initial, high-failure rate portion of the bathtub curve of component reliability. If the burn-in period is made sufficiently long (and, perhaps, artificially stressful), the system can then be trusted to be mostly free of further early failures once the burn-in process is complete. Theoretically, any weak components would fail during the "Burn In" time allowing those parts to be replaced. Replacing the weak components would prevent premature failure, infant mortality failure, or other latent defects. When the equivalent lifetime of the stress is extended i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Vibration Fatigue
Vibration fatigue is a mechanical engineering term describing material fatigue, caused by forced vibration of random nature. An excited structure responds according to its natural-dynamics modes, which results in a dynamic stress load in the material points. The process of material fatigue is thus governed largely by the shape of the excitation profile and the response it produces. As the profiles of excitation and response are preferably analyzed in the frequency domain it is practical to use fatigue life evaluation methods, that can operate on the data in frequency-domain, s power spectral density (PSD). A crucial part of a vibration fatigue analysis is the modal analysis, that exposes the natural modes and frequencies of the vibrating structure and enables accurate prediction of the local stress responses for the given excitation. Only then, when the stress responses are known, can vibration fatigue be successfully characterized. The more classical approach of fatigue evaluat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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