LGA 1700
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LGA 1700
LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021. LGA 1700 is designed as a replacement for LGA 1200 (known as ''Socket H5'') and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs. Heatsink design Since the introduction of Land grid array (LGA)-based sockets in the consumer hardware space in 2004, the thermal solution ''hole pattern'' (the dis ...
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Flip-chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect ...
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LGA 775
LGA 775 (land grid array 775), also known as Socket T, is an Intel desktop CPU socket. Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on the underside of the processor (CPU). The socket had an unusually long life span, lasting 7 years until the last processors supporting it ceased production in 2011. The socket was superseded by the LGA 1156 (Socket H) and LGA 1366 (Socket B) sockets. LGA 775 processors (some of the processors listed here might not work on newer Intel based chipsets) * Pentium 4 * Pentium 4 Extreme Edition * Pentium D * Celeron/ Celeron D * Pentium Dual-Core * Pentium Extreme Edition * Core 2 Duo/ Core 2 Quad Heatsink design For LGA 775, the distance between the screw-holes for the heatsink is 72 mm. Such heat-sinks are not interchangeable with heatsinks for sockets that have a distance of 75 mm, such as LGA 1156, LGA 1155, LGA 1150, LGA 1151 an ...
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RAID
Raid, RAID or Raids may refer to: Attack * Raid (military), a sudden attack behind the enemy's lines without the intention of holding ground * Corporate raid, a type of hostile takeover in business * Panty raid, a prankish raid by male college students on the living quarters of female students to steal panties as trophies * Police raid, a police action involving the entering of a house with the intent to capture personnel or evidence, often taking place early in the morning * Union raid, when an outsider trade union takes over the membership of an existing union Arts, entertainment, and media Films * ''Raid'' (1947 film), an East German film * ''Raid'' (2003 film), a 2003 Finnish film * ''Raid'' (2018 film), an Indian period crime thriller Gaming * Raid (gaming), a type of mission in a video game where a large number of people combine forces to defeat a powerful enemy * ''Raid'' (video game), a Nintendo Entertainment System title released by Sachen in 1989 * ''Raid over ...
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IEEE 802
IEEE 802 is a family of Institute of Electrical and Electronics Engineers (IEEE) standards for local area networks (LAN), personal area network (PAN), and metropolitan area networks (MAN). The IEEE 802 LAN/MAN Standards Committee (LMSC) maintains these standards. The IEEE 802 family of standards has had twenty-four members, numbered 802.1 through 802.24, with a working group of the LMSC devoted to each. However, not all of these working groups are currently active. The IEEE 802 standards are restricted to computer networks carrying variable-size packets, unlike cell relay networks, for example, in which data is transmitted in short, uniformly sized units called cells. Isochronous signal networks, in which data is transmitted as a steady stream of octets, or groups of octets, at regular time intervals, are also outside the scope of the IEEE 802 standards. The number 802 has no significance: it was simply the next number in the sequence that the IEEE used for standards project ...
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Platform Controller Hub
The Platform Controller Hub (PCH) is a family of Intel's single-chip chipsets, first introduced in 2009. It is the successor to the Intel Hub Architecture, which used two chips - a northbridge and southbridge, and first appeared in the Intel 5 Series. The PCH controls certain data paths and support functions used in conjunction with Intel CPUs. These include clocking (the system clock), Flexible Display Interface (FDI) and Direct Media Interface (DMI), although FDI is used only when the chipset is required to support a processor with integrated graphics. As such, I/O functions are reassigned between this new central hub and the CPU compared to the previous architecture: some northbridge functions, the memory controller and PCIe lanes, were integrated into the CPU while the PCH took over the remaining functions in addition to the traditional roles of the southbridge. AMD has its equivalent for the PCH, known simply as a chipset, no longer using the previous term Fusion control ...
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SATA
SATA (Serial AT Attachment) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives, optical drives, and solid-state drives. Serial ATA succeeded the earlier Parallel ATA (PATA) standard to become the predominant interface for storage devices. Serial ATA industry compatibility specifications originate from the Serial ATA International Organization (SATA-IO) which are then promulgated by the INCITS Technical Committee T13, AT Attachment (INCITS T13). History SATA was announced in 2000 in order to provide several advantages over the earlier PATA interface such as reduced cable size and cost (seven conductors instead of 40 or 80), native hot swapping, faster data transfer through higher signaling rates, and more efficient transfer through an (optional) I/O queuing protocol. Revision 1.0 of the specification was released in January 2003. Serial ATA industry compatibility specifications originate from the Serial ATA Int ...
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DIMM
A DIMM () (Dual In-line Memory Module), commonly called a RAM stick, comprises a series of dynamic random-access memory integrated circuits. These memory modules are mounted on a printed circuit board and designed for use in personal computers, workstations, printers, and servers. They are the predominant method for adding memory into a computer system. The vast majority of DIMMs are standardized through JEDEC standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and sizes, but generally are one of two lengths - PC which are and laptop (SO-DIMM) which are about half the size at . History DIMMs (Dual In-line Memory Module) were a 1990s upgrade for SIMMs (Single In-line Memory Modules) as Intel P5-based Pentium processors began to gain market share. The Pentium had a 64-bit bus width, which would require SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel. DIMMs were ...
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Direct Media Interface
In computing, Direct Media Interface (DMI) is Intel's proprietary link between the northbridge and southbridge on a computer motherboard. It was first used between the 9xx chipsets and the ICH6, released in 2004. Previous Intel chipsets had used the Intel Hub Architecture to perform the same function, and server chipsets use a similar interface called ''Enterprise Southbridge Interface'' (ESI). While the "DMI" name dates back to ICH6, Intel mandates specific combinations of compatible devices, so the presence of a DMI interface does not guarantee by itself that a particular northbridge–southbridge combination is allowed. DMI shares many characteristics with PCI Express, using multiple lanes and differential signaling to form a point-to-point link. Most implementations use a ×4 link, while some mobile systems (e.g. 915GMS, 945GMS/GSE/GU and the Atom N450) use a ×2 link, halving the bandwidth. The original implementation provides 10 Gbit/s (1 GB/s) in each di ...
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Random-access Memory
Random-access memory (RAM; ) is a form of computer memory that can be read and changed in any order, typically used to store working data and machine code. A random-access memory device allows data items to be read or written in almost the same amount of time irrespective of the physical location of data inside the memory, in contrast with other direct-access data storage media (such as hard disks, CD-RWs, DVD-RWs and the older magnetic tapes and drum memory), where the time required to read and write data items varies significantly depending on their physical locations on the recording medium, due to mechanical limitations such as media rotation speeds and arm movement. RAM contains multiplexing and demultiplexing circuitry, to connect the data lines to the addressed storage for reading or writing the entry. Usually more than one bit of storage is accessed by the same address, and RAM devices often have multiple data lines and are said to be "8-bit" or "16-bit", etc. ...
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Overclocking
In computing, overclocking is the practice of increasing the clock rate of a computer to exceed that certified by the manufacturer. Commonly, operating voltage is also increased to maintain a component's operational stability at accelerated speeds. Semiconductor devices operated at higher frequencies and voltages increase power consumption and heat. An overclocked device may be unreliable or fail completely if the additional heat load is not removed or power delivery components cannot meet increased power demands. Many device warranties state that overclocking or over-specification voids any warranty, however there are an increasing number of manufacturers that will allow overclocking as long as performed (relatively) safely. Overview The purpose of overclocking is to increase the operating speed of a given component. Normally, on modern systems, the target of overclocking is increasing the performance of a major chip or subsystem, such as the main processor or graphics cont ...
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Integrated Heat Spreader
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat transfer with expenditure of energy as work supplied by an external source. A heat pipe uses fluids inside a sealed case. The fluids circulate either passively, by spontaneous convection, triggered when a threshold temperature difference occurs; or actively, because of an impeller driven by an external source of work. Without sealed circulation, energy can be carried by transfer of fluid matter, for example externally supplied colder air, driven by an external source of work, from a hotter body to another external body, though this is not exactly heat transfer as defined in physics. Exemplifying increase of entropy according to the second ...
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LGA 1151
LGA 1151, also known as Socket H4, zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in two distinct versions: the first revision which supports both Intel's Skylake and Kaby Lake CPUs, and the second revision which supports Coffee Lake CPUs exclusively. LGA 1151 is designed as a replacement for the LGA 1150 (known as ''Socket H3''). LGA 1151 has 1151 protruding pins to make contact with the pads on the processor. The Fully Integrated Voltage Regulator, i.e. a voltage regulator which integrated on the CPU's die, introduced with Haswell and Broadwell, has again been moved to the motherboard. Most motherboards for the first revision of the socket support solely DDR4 memory, a lesser number support DDR3(L) memory, and the least number have slots for both DDR4 or DDR3(L) but only one memory type can be installed. Some have UniDIMM support, enabling either type of memory to be placed in the same DIMM, rather than having ...
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