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LGA 1356
LGA 1356, also called Socket B2, is an Intel microprocessor socket released in Q1 2012 with 1356 Land Grid Array pins. It launched alongside LGA 2011 to replace its predecessor, LGA 1366 (Socket B) and LGA 1567. It's compatible with Intel Sandy Bridge-EN (also known as Romley-EN) and Ivy Bridge-EN microprocessors. Description LGA 1356 has 1356 protruding pins to make contact with the pads on the processor. Processors of LGA 1356 and LGA 1366 sockets are not compatible with each other since they have different socket notches. While LGA 2011 was designed for high-end desktops and high-performance servers, LGA 1356 was designed for the dual-processor and low-end segment of the server market. It supports 64-bit wide DDR3 triple channel memory, and equipped with 1 Intel QPI connection and 24 PCI Express lanes. Meanwhile LGA 2011 supports quad channel memory, 2 QPI connections and 40 PCIe lanes. Socket LGA 1155, desktop socket of the same generation supports dual channel memory. E ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Land Grid Array
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board. Description The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowin ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sandy Bridge-E
Intel Sandy Bridge-based Xeon microprocessors (often referred to as Sandy Bridge-E) are microprocessors based on the Intel's 32 nm Sandy Bridge architecture for servers, workstations, and high-end desktops. It succeeds the six-core Gulftown/Westmere-EP processor which used the older LGA 1366 package, and uses LGA 2011, LGA 1356 and LGA 1155 socket depending on the package. Overview There are five different families of Xeon processors that were based on Sandy Bridge architecture: * Sandy Bridge-E (LGA 2011) targeted high-end desktop (HEDT) enthusiast segment. It was branded as Core i7 Extreme Edition and Core i7 processors, despite sharing many similarities with Xeon models. * Sandy Bridge-EP (LGA 2011) branded as Xeon E5 models aimed at high-end servers and workstations. It supported motherboards equipped with up to 4 sockets. * Sandy Bridge-EN (LGA 1356) uses a smaller socket for low-end and dual-processor servers on certain Xeon E5 and Pentium branded models. * Sandy Bridge X ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Direct Media Interface
In computing, Direct Media Interface (DMI) is Intel's proprietary link between the northbridge and southbridge on a computer motherboard. It was first used between the 9xx chipsets and the ICH6, released in 2004. Previous Intel chipsets had used the Intel Hub Architecture to perform the same function, and server chipsets use a similar interface called ''Enterprise Southbridge Interface'' (ESI). While the "DMI" name dates back to ICH6, Intel mandates specific combinations of compatible devices, so the presence of a DMI interface does not guarantee by itself that a particular northbridge–southbridge combination is allowed. DMI shares many characteristics with PCI Express, using multiple lanes and differential signaling to form a point-to-point link. Most implementations use a ×4 link, while some mobile systems (e.g. 915GMS, 945GMS/GSE/GU and the Atom N450) use a ×2 link, halving the bandwidth. The original implementation provides 10 Gbit/s (1 GB/s) in each di ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intel Turbo Boost
Intel Turbo Boost is Intel's trade name for central processing units (CPUs) dynamic frequency scaling feature that automatically raises certain versions of its operating frequency when demanding tasks are running, thus enabling a higher resulting performance. The frequency is accelerated when the operating system requests the highest performance state of the processor. Processor performance states are defined by the Advanced Configuration and Power Interface (ACPI) specification, an open standard supported by all major operating systems; no additional software or drivers are required to support the technology. The design concept behind Turbo Boost is commonly referred to as "dynamic overclocking". When the workload on the processor calls for faster performance, the processor's clock will try to increase the operating frequency in regular increments as required to meet demand. The increased clock rate is limited by the processor's power, current, and thermal limits, the number ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Design Power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP rat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Clock Rate
In computing, the clock rate or clock speed typically refers to the frequency at which the clock generator of a processor can generate pulses, which are used to synchronize the operations of its components, and is used as an indicator of the processor's speed. It is measured in the SI unit of frequency hertz (Hz). The clock rate of the first generation of computers was measured in hertz or kilohertz (kHz), the first personal computers (PCs) to arrive throughout the 1970s and 1980s had clock rates measured in megahertz (MHz), and in the 21st century the speed of modern CPUs is commonly advertised in gigahertz (GHz). This metric is most useful when comparing processors within the same family, holding constant other features that may affect performance. Determining factors Binning Manufacturers of modern processors typically charge premium prices for processors that operate at higher clock rates, a practice called binning. For a given CPU, the clock rates are determined at th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CPU Cache
A CPU cache is a hardware cache used by the central processing unit (CPU) of a computer to reduce the average cost (time or energy) to access data from the main memory. A cache is a smaller, faster memory, located closer to a processor core, which stores copies of the data from frequently used main memory locations. Most CPUs have a hierarchy of multiple cache levels (L1, L2, often L3, and rarely even L4), with different instruction-specific and data-specific caches at level 1. The cache memory is typically implemented with static random-access memory (SRAM), in modern CPUs by far the largest part of them by chip area, but SRAM is not always used for all levels (of I- or D-cache), or even any level, sometimes some latter or all levels are implemented with eDRAM. Other types of caches exist (that are not counted towards the "cache size" of the most important caches mentioned above), such as the translation lookaside buffer (TLB) which is part of the memory management unit (MMU) w ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pound-force
The pound of force or pound-force (symbol: lbf, sometimes lbf,) is a unit of force used in some systems of measurement, including English Engineering units and the foot–pound–second system. Pound-force should not be confused with pound-mass (lb), often simply called ''pound'', which is a unit of mass, nor should these be confused with foot-pound (ft⋅lbf), a unit of energy, or pound-foot (lbf⋅ft), a unit of torque. Definitions The pound-force is equal to the gravitational force exerted on a mass of one avoirdupois pound on the surface of Earth. Since the 18th century, the unit has been used in low-precision measurements, for which small changes in Earth's gravity (which varies from equator to pole by up to half a percent) can safely be neglected. The 20th century, however, brought the need for a more precise definition, requiring a standardized value for acceleration due to gravity. Product of avoirdupois pound and standard gravity The pound-force is the product ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Newton (unit)
The newton (symbol: N) is the unit of force in the International System of Units (SI). It is defined as 1 kg⋅m/s, the force which gives a mass of 1 kilogram an acceleration of 1 metre per second per second. It is named after Isaac Newton in recognition of his work on classical mechanics, specifically Newton's second law of motion. Definition A newton is defined as 1 kg⋅m/s (it is a derived unit which is defined in terms of the SI base units). One newton is therefore the force needed to accelerate one kilogram of mass at the rate of one metre per second squared in the direction of the applied force. The units "metre per second squared" can be understood as measuring a rate of change in velocity per unit of time, i.e. an increase in velocity by 1 metre per second every second. In 1946, Conférence Générale des Poids et Mesures (CGPM) Resolution 2 standardized the unit of force in the MKS system of units to be the amount needed to accelerate 1 kilogram of mass at the rate ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DIMM
A DIMM () (Dual In-line Memory Module), commonly called a RAM stick, comprises a series of dynamic random-access memory integrated circuits. These memory modules are mounted on a printed circuit board and designed for use in personal computers, workstations, printers, and servers. They are the predominant method for adding memory into a computer system. The vast majority of DIMMs are standardized through JEDEC standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and sizes, but generally are one of two lengths - PC which are and laptop (SO-DIMM) which are about half the size at . History DIMMs (Dual In-line Memory Module) were a 1990s upgrade for SIMMs (Single In-line Memory Modules) as Intel P5-based Pentium processors began to gain market share. The Pentium had a 64-bit bus width, which would require SIMMs installed in matched pairs in order to populate the data bus. The processor would then access the two SIMMs in parallel. DIMMs were i ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
LGA 1155
LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy Bridge (2nd Gen) and Ivy Bridge (3rd Gen) microarchitectures. It is the successor of LGA 1156 (known as ''Socket H'') and was itself succeeded by LGA 1150 in 2013. Along with selected variations of LGA 2011 socket, it was the last Intel socket to fully support Windows XP, Windows Server 2003, Windows Vista, and Windows Server 2008. LGA 1155 has 1155 protruding pins to make contact with the pads on the processor. The pins are arranged in a 40×40 array with a 24×16 central void and additional 61 omitted pins (two adjoining the central void, six in each of the four corners, and 35 in groups around the perimeter), yielding the 1600 − 384 − 61 = 1155 pin count. Processors for LGA 1155 and LGA 1156 sockets are not compatible with each other since they have different socket notches. LGA 1155 al ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PCI Express
PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common motherboard interface for personal computers' graphics cards, hard disk drive host adapters, SSDs, Wi-Fi and Ethernet hardware connections. PCIe has numerous improvements over the older standards, including higher maximum system bus throughput, lower I/O pin count and smaller physical footprint, better performance scaling for bus devices, a more detailed error detection and reporting mechanism (Advanced Error Reporting, AER), and native hot-swap functionality. More recent revisions of the PCIe standard provide hardware support for I/O virtualization. The PCI Express electrical interface is measured by the number of simultaneous lanes. (A lane is a single send/receive line of data. The analogy is a highway with traffic in both directions. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
