Ion Beam Assisted Deposition
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Ion Beam Assisted Deposition
Ion beam assisted deposition or IBAD or IAD (not to be confused with ion beam induced deposition, IBID) is a materials engineering technique which combines ion implantation with simultaneous sputtering or another physical vapor deposition technique. Besides providing independent control of parameters such as ion energy, temperature and arrival rate of atomic species during deposition, this technique is especially useful to create a gradual transition between the substrate material and the deposited film, and for depositing films with less built-in strain than is possible by other techniques. These two properties can result in films with a much more durable bond to the substrate. Experience has shown that some meta-stable compounds like cubic boron nitride (c-BN), can only be formed in thin films when bombarded with energetic ions during the deposition process. See also *Ion beam deposition *Physical vapor deposition *Ion plating Ion plating (IP) is a physical vapor deposit ...
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Ion Beam Induced Deposition
Electron-beam-induced deposition (EBID) is a process of decomposing gaseous molecules by an electron beam leading to deposition of non-volatile fragments onto a nearby substrate. The electron beam is usually provided by a scanning electron microscope, which results in high spatial accuracy (potentially below one nanometer) and the possibility to produce free-standing, three-dimensional structures. Process The focused electron beam of a scanning electron microscope (SEM) or scanning transmission electron microscope (STEM) is commonly used. Another method is ion-beam-induced deposition (IBID), where a focused ion beam is applied instead. Precursor materials are typically liquid or solid and gasified prior to deposition, usually through vaporization or sublimation, and introduced, at accurately controlled rate, into the high-vacuum chamber of the electron microscope. Alternatively, solid precursors can be sublimated by the electron beam itself. When deposition occurs at a high ...
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Ion Implantation
Ion implantation is a low-temperature process by which ions of one element are accelerated into a solid target, thereby changing the physical, chemical, or electrical properties of the target. Ion implantation is used in semiconductor device fabrication and in metal finishing, as well as in materials science research. The ions can alter the elemental composition of the target (if the ions differ in composition from the target) if they stop and remain in the target. Ion implantation also causes chemical and physical changes when the ions impinge on the target at high energy. The crystal structure of the target can be damaged or even destroyed by the energetic collision cascades, and ions of sufficiently high energy (10s of MeV) can cause nuclear transmutation. General principle Ion implantation equipment typically consists of an ion source, where ions of the desired element are produced, an accelerator, where the ions are electrostatically accelerated to a high energy, and ...
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Sputter Deposition
Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K). The sputtered ions (typically only a small fraction of the ejected particles are ionized — on the order of 1 percent) can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber (causing resputtering). Alternatively, at higher gas pressures, the ions collide with the gas atoms that act as a moderator and move diffusively, reaching the substrates or vacuum chamber wall and condensing after undergoing a random walk. The entire range from high-energy ballistic impact to low-energy ...
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Physical Vapor Deposition
Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation. PVD is used in the manufacturing of items which require thin films for optical, mechanical, electrical, acoustic or chemical functions. Examples include semiconductor devices such as thin-film solar cells, microelectromechanical devices such as thin film bulk acoustic resonator, aluminized PET film for food packaging and balloons, and titanium nitride coated cutting tools for metalworking. Besides PVD tools for fabrication, special smaller tools used mainly for scientific purposes have been developed. The source material i ...
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Chemical Species
A chemical species is a chemical substance or ensemble composed of chemically identical molecular entity, molecular entities that can explore the same set of molecular energy levels on a characteristic or delineated time scale. These energy levels determine the way the chemical species will interact with others (engaging in chemical bonds, etc.). The species can be an atom, molecule, ion, or radical, and it has a specific chemical name and chemical formula. The term is also applied to a set of chemically identical atomic or molecular structural units in a solid array. In supramolecular chemistry, chemical species are those supramolecular structures whose interactions and associations are brought about via intermolecular bonding and debonding actions, and function to form the basis of this branch of chemistry. For instance: * The chemical species argon is an atom, atomic species of formula Ar; * dioxygen and ozone are different molecule, molecular species, of respective formulas O ...
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Substrate (materials Science)
Substrate is a term used in materials science and engineering to describe the base material on which processing is conducted. This surface could be used to produce new film or layers of material such as deposited coatings. It could be the base to which paint, adhesives, or adhesive tape is bonded. A typical substrate might be rigid such as metal, concrete, or glass, onto which a coating might be deposited. Flexible substrates are also used. With all coating processes, the condition of the surface of the substrate can strongly affect the bond of subsequent layers. This can include cleanliness, smoothness, surface energy, moisture, etc. Some substrates are anisotropic with surface properties being different depending on the direction: examples include wood and paper products. Coatings Coating can be by a variety of processes: * Adhesives and Adhesive tapes * Coating and printing processes * Chemical vapor deposition and physical vapor deposition * Conversion coating :* A ...
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Deformation (mechanics)
In physics, deformation is the continuum mechanics transformation of a body from a ''reference'' configuration to a ''current'' configuration. A configuration is a set containing the positions of all particles of the body. A deformation can occur because of external loads, intrinsic activity (e.g. muscle contraction), body forces (such as gravity or electromagnetic forces), or changes in temperature, moisture content, or chemical reactions, etc. Strain is related to deformation in terms of ''relative'' displacement of particles in the body that excludes rigid-body motions. Different equivalent choices may be made for the expression of a strain field depending on whether it is defined with respect to the initial or the final configuration of the body and on whether the metric tensor or its dual is considered. In a continuous body, a deformation field results from a stress field due to applied forces or because of some changes in the temperature field of the body. The rel ...
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Chemical Bond
A chemical bond is a lasting attraction between atoms or ions that enables the formation of molecules and crystals. The bond may result from the electrostatic force between oppositely charged ions as in ionic bonds, or through the sharing of electrons as in covalent bonds. The strength of chemical bonds varies considerably; there are "strong bonds" or "primary bonds" such as covalent, ionic and metallic bonds, and "weak bonds" or "secondary bonds" such as dipole–dipole interactions, the London dispersion force and hydrogen bonding. Strong chemical bonding arises from the sharing or transfer of electrons between the participating atoms. Since opposite electric charges attract, the negatively charged electrons surrounding the nucleus and the positively charged protons within a nucleus attract each other. An electron positioned between two nuclei will be attracted to both of them, and the nuclei will be attracted toward electrons in this position. This attraction constitu ...
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Metastability
In chemistry and physics, metastability denotes an intermediate Energy level, energetic state within a dynamical system other than the system's ground state, state of least energy. A ball resting in a hollow on a slope is a simple example of metastability. If the ball is only slightly pushed, it will settle back into its hollow, but a stronger push may start the ball rolling down the slope. Bowling pins show similar metastability by either merely wobbling for a moment or tipping over completely. A common example of metastability in science is isomerisation. Higher energy isomers are long lived because they are prevented from rearranging to their preferred ground state by (possibly large) barriers in the potential energy. During a metastable state of finite lifetime, all state-describing parameters reach and hold stationary values. In isolation: *the state of least energy is the only one the system will inhabit for an indefinite length of time, until more external energy is added ...
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Chemical Compounds
A chemical compound is a chemical substance composed of many identical molecules (or molecular entities) containing atoms from more than one chemical element held together by chemical bonds. A molecule consisting of atoms of only one element is therefore not a compound. A compound can be transformed into a different substance by a chemical reaction, which may involve interactions with other substances. In this process, bonds between atoms may be broken and/or new bonds formed. There are four major types of compounds, distinguished by how the constituent atoms are bonded together. Molecular compounds are held together by covalent bonds; ionic compounds are held together by ionic bonds; intermetallic compounds are held together by metallic bonds; coordination complexes are held together by coordinate covalent bonds. Non-stoichiometric compounds form a disputed marginal case. A chemical formula specifies the number of atoms of each element in a compound molecule, using the sta ...
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Cubic Boron Nitride
Boron nitride is a thermally and chemically resistant refractory compound of boron and nitrogen with the chemical formula BN. It exists in various crystalline forms that are isoelectronic to a similarly structured carbon lattice. The hexagonal form corresponding to graphite is the most stable and soft among BN polymorphs, and is therefore used as a lubricant and an additive to cosmetic products. The cubic ( zincblende aka sphalerite structure) variety analogous to diamond is called c-BN; it is softer than diamond, but its thermal and chemical stability is superior. The rare wurtzite BN modification is similar to lonsdaleite but slightly softer than the cubic form. Because of excellent thermal and chemical stability, boron nitride ceramics are used in high-temperature equipment and metal casting. Boron nitride has potential use in nanotechnology. Structure Boron nitride exists in multiple forms that differ in the arrangement of the boron and nitrogen atoms, giving rise to varyin ...
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