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IBM Solid Logic Technology
Solid Logic Technology (SLT) was IBM's method for hybrid packaging of electronic circuitry introduced in 1964 with the IBM System/360 series of computers and related machines. IBM chose to design custom hybrid circuits using discrete, flip chip Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to externa ...-mounted, glass-encapsulated transistors and diodes, with screen-printing, silk-screened resistors on a ceramic substrate, forming an SLT module. The circuits were either encapsulated in plastic or covered with a metal lid. Several of these SLT modules (20 in the image on the right) were then mounted on a small multi-layer printed circuit board to make an SLT card. Each SLT card had a socket on one edge that plugged into pins on the computer's backplane (the exact reverse of how most other c ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Keypunch
A keypunch is a device for precisely punching holes into stiff paper cards at specific locations as determined by keys struck by a human operator. Other devices included here for that same function include the gang punch, the pantograph punch, and the stamp. The term was also used for similar machines used by humans to transcribe data onto punched tape media. For Jacquard looms, the resulting punched cards were joined together to form a paper tape, called a "chain", containing a program that, when read by a loom, directed its operation.Bell, T.F. (1895) '' Jacquard Weaving and Designing'', Longmans, Green And Co. For Hollerith machines and other unit record machines the resulting punched cards contained data to be processed by those machines. For computers equipped with a punched card input/output device the resulting punched cards were either data or programs directing the computer's operation. Early Hollerith keypunches were manual devices. Later keypunches were electrom ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thick-film Technology
Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. Main manufacturing technique is screen printing (stenciling), which in addition to use in manufacturing electronic devices can also be used for various graphic reproduction targets. It became one of the key manufacturing/miniaturisation techniques of electronic devices/modules during 1950s. Typical film thickness – manufactured with thick film manufacturing processes for electronic devices – is 0.0001 to 0.1 mm. Thick-film circuits/modules are widely used in the automotive industry, both in sensors, e.g. mixture of fuel/air, pressure sensors, engine and gearbox controls, sensor for releasing airbags, ignitors to airbags; common is that high reliability is required, often extended temperature range also along massive thermocycling of circuits without failure. Other application areas ar ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip Carriers
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using " ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
NPN Transistor
A bipolar junction transistor (BJT) is a type of transistor that uses both electrons and electron holes as charge carriers. In contrast, a unipolar transistor, such as a field-effect transistor, uses only one kind of charge carrier. A bipolar transistor allows a small current injected at one of its terminals to control a much larger current flowing between the terminals, making the device capable of amplification or switching. BJTs use two p–n junctions between two semiconductor types, n-type and p-type, which are regions in a single crystal of material. The junctions can be made in several different ways, such as changing the doping of the semiconductor material as it is grown, by depositing metal pellets to form alloy junctions, or by such methods as diffusion of n-type and p-type doping substances into the crystal. The superior predictability and performance of junction transistors quickly displaced the original point-contact transistor. Diffused transistors, along wi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Emitter-coupled Logic
In electronics, emitter-coupled logic (ECL) is a high-speed integrated circuit bipolar transistor logic family. ECL uses an overdriven bipolar junction transistor (BJT) differential amplifier with single-ended input and limited emitter current to avoid the saturated (fully on) region of operation and its slow turn-off behavior. As the current is steered between two legs of an emitter-coupled pair, ECL is sometimes called ''current-steering logic'' (CSL), ''current-mode logic'' (CML) or ''current-switch emitter-follower'' (CSEF) logic. In ECL, the transistors are never in saturation, the input and output voltages have a small swing (0.8 V), the input impedance is high and the output impedance is low. As a result, the transistors change states quickly, gate delays are low, and the fanout capability is high. In addition, the essentially constant current draw of the differential amplifiers minimises delays and glitches due to supply-line inductance and capacitance, and the complement ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Emitter-follower-coupled-switch
In electronics, emitter-coupled logic (ECL) is a high-speed integrated circuit bipolar transistor logic family. ECL uses an overdriven bipolar junction transistor (BJT) differential amplifier with single-ended input and limited emitter current to avoid the saturated (fully on) region of operation and its slow turn-off behavior. As the current is steered between two legs of an emitter-coupled pair, ECL is sometimes called ''current-steering logic'' (CSL), ''current-mode logic'' (CML) or ''current-switch emitter-follower'' (CSEF) logic. In ECL, the transistors are never in saturation, the input and output voltages have a small swing (0.8 V), the input impedance is high and the output impedance is low. As a result, the transistors change states quickly, gate delays are low, and the fanout capability is high. In addition, the essentially constant current draw of the differential amplifiers minimises delays and glitches due to supply-line inductance and capacitance, and the complementa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Saturn V
Saturn V is a retired American super heavy-lift launch vehicle developed by NASA under the Apollo program for human exploration of the Moon. The rocket was human-rated, with multistage rocket, three stages, and powered with liquid-propellant rocket, liquid fuel. It was flown from 1967 to 1973. It was used for nine crewed flights to the Moon, and to launch Skylab, the first American space station. the Saturn V remains the only launch vehicle to carry humans beyond low Earth orbit (LEO). Saturn V holds records for the heaviest payload launched and largest payload capacity to low Earth orbit: , which included the third stage and unburned propellant needed to send the Apollo command and service module and Apollo Lunar Module, Lunar Module to the Moon. The largest production model of the Saturn (rocket family), Saturn family of rockets, the Saturn V was designed under the direction of Wernher von Braun at the Marshall Space Flight Center in Huntsville, Alabama; the lead contractor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Launch Vehicle Digital Computer
The Launch Vehicle Digital Computer (LVDC) was a computer that provided the autopilot for the Saturn V rocket from launch to Earth orbit insertion. Designed and manufactured by IBM's Electronics Systems Center in Owego, New York, it was one of the major components of the Instrument Unit, fitted to the S-IVB stage of the Saturn V and Saturn IB rockets. The LVDC also supported pre- and post-launch checkout of the Saturn hardware. It was used in conjunction with the Launch Vehicle Data Adaptor (LVDA) which performed signal conditioning from the sensor inputs to the computer from the launch vehicle. Hardware The LVDC was capable of executing 12190 instructions per second. For comparison, as of 2022, researchers at the University of California created a chip capable of running at 1.78 trillion instructions per second, 146 million times faster. Its master clock ran at 2.048 MHz, but operations were performed bit-serially, with 4 cycles required to process each bit, 14 bits per ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Standard Modular System
The Standard Modular System (SMS) is a system of standard transistorized circuit boards and mounting racks developed by IBM in the late 1950s, originally for the IBM 7030 Stretch. They were used throughout IBM's second-generation computers, peripherals, the IBM 700/7000 series, 7000 series, the IBM 1400 series, 1400 series, and the IBM 1620, 1620. SMS was superseded by Solid Logic Technology (SLT) introduced with System/360 in 1964, however they remained in use with legacy systems through the 1970s. Overview Many IBM peripheral devices that are part of System/360, but were adapted from second-generation designs, continued to use SMS circuitry instead of the newer SLT. These included the IBM 2400, 240x-series tape drives and controllers, the IBM 2540, 2540 card reader/punch and IBM 1403, 1403N1 printer, and the IBM 2821 Control Unit, 2821 Integrated Control Unit for the 1403 and 2540. A few SMS cards used in System/360 peripheral devices even have SLT-type hybrid ICs mounted on ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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