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Head In Pillow (metallurgy)
In the assembly of integrated circuit packages to printed circuit boards, a head-in-pillow defect (HIP or HNP) is a failure of the soldering process. For example, in the case of a ball grid array (BGA) package, the pre-deposited solder ball on the package and the solder paste applied to the circuit board may both melt, but the melted solder does not join. A cross-section through the failed joint shows a distinct boundary between the solder ball on the part and the solder paste on the circuit board, rather like a section through a head resting on a pillow. The defect can be caused by surface oxidation or poor wetting of the solder, or by distortion of the integrated circuit package or circuit board by the heat of the soldering process. This is particularly a concern when using lead-free solder, which requires higher processing temperature. Since the warping of the circuit board or integrated circuit may disappear when the board cools, an intermittent fault may be created. Diagnos ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Soldering
Soldering (; ) is a process in which two or more items are joined by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not involve melting the work pieces. In brazing, the work piece metal also does not melt, but the filler metal is one that melts at a higher temperature than in soldering. In the past, nearly all solders contained lead, but environmental and health concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes. Origins There is evidence that soldering was employed as early as 5,000 years ago in Mesopotamia. Soldering and brazing are thought to have originated very early in the history of metal-working, probably before 4000 BC. Sumerian swords from were assembled using hard soldering. Soldering was historically used to make jewelry, cookware and cooking tools, assembling stained glass, as well as other uses. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solder Ball
In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps (μbumps, ubumps), since they are usually significantly smaller than the former. The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. The ball grid array, chip-scale package, and flip chip packages generally use solder balls. Underfill After the solder balls are used to attach an integrated circuit chip to a PCB, often the remaining air gap between them is underfilled with epoxy. In some cases, there may be multiple layers of solder balls—for exampl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lead-free Solder
Solder (; NA: ) is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of , and is commonly used in electronics, plumbing, and sheet metal work. Alloys that melt between are the most commonly used. Soldering performed using alloys with a melting point above is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and co ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Intermittent Fault
An intermittent fault, often called simply an "intermittent", (or anecdotally "interfailing") is a malfunction of a device or system that occurs at intervals, usually irregular, in a device or system that functions normally at other times. Intermittent faults are common to all branches of technology, including computer software. An intermittent fault is caused by several contributing factors, some of which may be effectively random, which occur simultaneously. The more complex the system or mechanism involved, the greater the likelihood of an intermittent fault. Intermittent faults are not easily repeatable because of their complicated behavioral patterns. These are also sometimes referred to as “soft” failures, since they do not manifest themselves all the time and disappear in an unpredictable manner. In contrast, “hard” failures are permanent failures that occur over a period of time (or are sometimes instantaneous). They have a specific failure site (location of failure) ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electro Optical Terahertz Pulse Reflectometry
A time-domain reflectometer (TDR) is an electronic instrument used to determine the characteristics of electrical lines by observing reflected waveforms. It can be used to characterize and locate faults in metallic cables (for example, twisted pair wire or coaxial cable). It can also be used to locate discontinuities in a connector, printed circuit board, or any other electrical path. Description A TDR measures reflections along a conductor. In order to measure those reflections, the TDR will transmit an incident signal onto the conductor and listen for its reflections. If the conductor is of a uniform impedance and is properly terminated, then there will be no reflections and the remaining incident signal will be absorbed at the far-end by the termination. Instead, if there are impedance variations, then some of the incident signal will be reflected back to the source. A TDR is similar in principle to radar. The impedance of the discontinuity can be determined from th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball And Socket Joint
The ball-and-socket joint (or spheroid joint) is a type of synovial joint in which the ball-shaped surface of one rounded bone fits into the cup-like depression of another bone. The distal bone is capable of motion around an indefinite number of axes, which have one common center. This enables the joint to move in many directions. An enarthrosis is a special kind of spheroidal joint in which the socket covers the sphere beyond its equator.Platzer, Werner (2008) ''Color Atlas of Human Anatomy'', Volume 1p.28/ref> Examples Examples of this form of articulation are found in the hip, where the round head of the femur (ball) rests in the cup-like acetabulum (socket) of the pelvis; and in the shoulder joint, where the rounded upper extremity of the humerus (ball) rests in the cup-like glenoid fossa (socket) of the shoulder blade.And the phalanges (toes, fingers)Introduction to Joints: Synovial Joints - Ball and Socket Joints (The shoulder also includes a sternoclavicular joint ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics Manufacturing
Electronics Manufacturing Services (EMS) is a term used for companies that design, manufacture, test, distribute, and provide return/repair services for electronic components and assemblies for original equipment manufacturers (OEMs). The concept is also referred to as Electronics Contract Manufacturing (ECM). Many consumer electronics are built in China, due to maintenance cost, availability of materials, and speed as opposed to other countries such as the United States. Cities such as Shenzhen and Penang have become important production centres for the industry, attracting many consumer electronics companies such as Apple Inc. Some companies such as Flex (company), Flex and Wistron are Original design manufacturers and providers of Electronics manufacturing services. History The EMS industry was initially established in 1961 by SCI Systems of Huntsville Alabama. The industry realized its most significant growth in the 1980s; at the time, most electronics manufacturing for large-s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Engineering Failures
Engineering is the use of scientific principles to design and build machines, structures, and other items, including bridges, tunnels, roads, vehicles, and buildings. The discipline of engineering encompasses a broad range of more specialized fields of engineering, each with a more specific emphasis on particular areas of applied mathematics, applied science, and types of application. See glossary of engineering. The term ''engineering'' is derived from the Latin ''ingenium'', meaning "cleverness" and ''ingeniare'', meaning "to contrive, devise". Definition The American Engineers' Council for Professional Development (ECPD, the predecessor of ABET) has defined "engineering" as: The creative application of scientific principles to design or develop structures, machines, apparatus, or manufacturing processes, or works utilizing them singly or in combination; or to construct or operate the same with full cognizance of their design; or to forecast their behavior under specif ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Metallurgy
Metallurgy is a domain of materials science and engineering that studies the physical and chemical behavior of metallic elements, their inter-metallic compounds, and their mixtures, which are known as alloys. Metallurgy encompasses both the science and the technology of metals; that is, the way in which science is applied to the production of metals, and the engineering of metal components used in products for both consumers and manufacturers. Metallurgy is distinct from the craft of metalworking. Metalworking relies on metallurgy in a similar manner to how medicine relies on medical science for technical advancement. A specialist practitioner of metallurgy is known as a metallurgist. The science of metallurgy is further subdivided into two broad categories: chemical metallurgy and physical metallurgy. Chemical metallurgy is chiefly concerned with the reduction and oxidation of metals, and the chemical performance of metals. Subjects of study in chemical metallurgy include mi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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