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HBM2
High Bandwidth Memory (HBM) is a high-speed computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix. It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs and FPGAs and in some supercomputers (such as the NEC SX-Aurora TSUBASA and Fujitsu A64FX). The first HBM memory chip was produced by SK Hynix in 2013, and the first devices to use HBM were the AMD Fiji GPUs in 2015. High Bandwidth Memory has been adopted by JEDEC as an industry standard in October 2013.High Bandwidth Memory (HBM) DRAM (JESD235) JEDEC, October 2013 The second generation, HBM2, was accepted by JEDEC in January 2016. Technology ...
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Radeon RX Vega Series
The Radeon RX Vega series is a series of graphics processors developed by AMD. These GPUs use the Graphics Core Next (GCN) 5th generation architecture, codenamed Vega, and are manufactured on 14 nm FinFET technology, developed by Samsung Electronics and licensed to GlobalFoundries. The series consists of desktop graphics cards and APUs aimed at desktops, mobile devices, and embedded applications. The lineup was released on 14 August 2017. It included the RX Vega 56 and the RX Vega 64, priced at $399 and $499 respectively. These were followed by two mobile APUs, the Ryzen 2500U and Ryzen 2700U, in October 2017. February 2018 saw the release of two desktop APUs, the Ryzen 3 2200G and the Ryzen 5 2400G, and the Ryzen Embedded V1000 line of APUs. In September 2018 AMD announced several Vega APUs in their Athlon line of products. Later in January 2019, the Radeon VII was announced based on the 7nm FinFET node manufactured by TSMC. History The Vega microarchitecture was AMD's ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Synchronous Dynamic Random-access Memory
Synchronous dynamic random-access memory (synchronous dynamic RAM or SDRAM) is any DRAM where the operation of its external pin interface is coordinated by an externally supplied clock signal. DRAM integrated circuits (ICs) produced from the early 1970s to early 1990s used an ''asynchronous'' interface, in which input control signals have a direct effect on internal functions only delayed by the trip across its semiconductor pathways. SDRAM has a ''synchronous'' interface, whereby changes on control inputs are recognised after a rising edge of its clock input. In SDRAM families standardized by JEDEC, the clock signal controls the stepping of an internal finite-state machine that responds to incoming commands. These commands can be pipelined to improve performance, with previously started operations completing while new commands are received. The memory is divided into several equally sized but independent sections called ''banks'', allowing the device to operate on a memory ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Graphics Processing Unit
A graphics processing unit (GPU) is a specialized electronic circuit designed to manipulate and alter memory to accelerate the creation of images in a frame buffer intended for output to a display device. GPUs are used in embedded systems, mobile phones, personal computers, workstations, and game consoles. Modern GPUs are efficient at manipulating computer graphics and image processing. Their parallel structure makes them more efficient than general-purpose central processing units (CPUs) for algorithms that process large blocks of data in parallel. In a personal computer, a GPU can be present on a video card or embedded on the motherboard. In some CPUs, they are embedded on the CPU die. In the 1970s, the term "GPU" originally stood for ''graphics processor unit'' and described a programmable processing unit independently working from the CPU and responsible for graphics manipulation and output. Later, in 1994, Sony used the term (now standing for ''graphics processing ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Fujitsu A64FX
The A64FX is a 64-bit ARM architecture microprocessor designed by Fujitsu. The processor is replacing the SPARC64 V as Fujitsu's processor for supercomputer applications. It powers the Fugaku supercomputer, the fastest supercomputer in the world by TOP500 rankings as of June 2020 as well as November 2020, June 2021 and November 2021. Design Fujitsu collaborated with ARM to develop the processor; it is the first processor to use the ARMv8.2-A Scalable Vector Extension SIMD instruction set with 512-bit vector implementation. It has "Four-operand FMA with Prefix Instruction", i.e. MOVPRFX instruction followed by 3-operand FMA operation ( ARM, like RISC in general, is a 3-operand machine, doesn't have space for 4 operands), which get packed into a single operation in the pipeline. For the processor the designer claim ">90% execution efficiency in (D, S, H) GEMM and INT16/8 dot product". The processor uses 32 gigabytes of HBM2 memory with a bandwidth of 1 TB per second ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Samsung Electronics
Samsung Electronics Co., Ltd. (, sometimes shortened to SEC and stylized as SΛMSUNG) is a South Korean multinational electronics corporation headquartered in Yeongtong-gu, Suwon, South Korea. It is the pinnacle of the Samsung chaebol, accounting for 70% of the group's revenue in 2012. Samsung Electronics has played a key role in the group's corporate governance due to circular ownership. Samsung Electronics has assembly plants and sales networks in 74 countries and employs around 290,000 people. It is majority-owned by foreign investors. Samsung Electronics is the world's second-largest technology company by revenue, and its market capitalization stood at US$520.65 billion, the 12th largest in the world. Samsung is a major manufacturer of Electronic Components such as lithium-ion batteries, semiconductors, image sensors, camera modules, and displays for clients such as Apple, Sony, HTC, and Nokia. It is the world's largest manufacturer of mobile phones an ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Three-dimensional Integrated Circuit
A three-dimensional integrated circuit (3D IC) is a MOSFET, MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global (Integrated circuit packaging, package), intermediate (bond pad) and local (transistor) level. In general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked ICs (3D-SICs); monolithic 3D ICs; ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Advanced Micro Devices
Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufactured its own processors, the company later outsourced its manufacturing, a practice known as going fabless, after GlobalFoundries was spun off in 2009. AMD's main products include microprocessors, motherboard chipsets, embedded processors, graphics processors, and FPGAs for servers, workstations, personal computers, and embedded system applications. History First twelve years Advanced Micro Devices was formally incorporated by Jerry Sanders, along with seven of his colleagues from Fairchild Semiconductor, on May 1, 1969. Sanders, an electrical engineer who was the director of marketing at Fairchild, had, like many Fairchild executives, grown frustrated with the increasing lack of support, opportunity, and flexibility wi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dynamic Random-access Memory
Dynamic random-access memory (dynamic RAM or DRAM) is a type of random-access semiconductor memory that stores each bit of data in a memory cell, usually consisting of a tiny capacitor and a transistor, both typically based on metal-oxide-semiconductor (MOS) technology. While most DRAM memory cell designs use a capacitor and transistor, some only use two transistors. In the designs where a capacitor is used, the capacitor can either be charged or discharged; these two states are taken to represent the two values of a bit, conventionally called 0 and 1. The electric charge on the capacitors gradually leaks away; without intervention the data on the capacitor would soon be lost. To prevent this, DRAM requires an external '' memory refresh'' circuit which periodically rewrites the data in the capacitors, restoring them to their original charge. This refresh process is the defining characteristic of dynamic random-access memory, in contrast to static random-access memory (S ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Samsung
The Samsung Group (or simply Samsung) ( ko, 삼성 ) is a South Korean multinational manufacturing conglomerate headquartered in Samsung Town, Seoul, South Korea. It comprises numerous affiliated businesses, most of them united under the ''Samsung'' brand, and is the largest South Korean (business conglomerate). Samsung has the eighth highest global brand value. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Over the next three decades, the group diversified into areas including food processing, textiles, insurance, securities, and retail. Samsung entered the electronics industry The electronics industry is the economic sector that produces electronic devices. It emerged in the 20th century and is today one of the largest global industries. Contemporary society uses a vast array of electronic devices built-in automated or ... in the late 1960s and the construction and shipbuilding industries in the mid-1970s; these areas would drive its subseque ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Virtual Reality
Virtual reality (VR) is a simulated experience that employs pose tracking and 3D near-eye displays to give the user an immersive feel of a virtual world. Applications of virtual reality include entertainment (particularly video games), education (such as medical or military training) and business (such as virtual meetings). Other distinct types of VR-style technology include augmented reality and mixed reality, sometimes referred to as extended reality or XR, although definitions are currently changing due to the nascence of the industry. Currently, standard virtual reality systems use either virtual reality headsets or multi-projected environments to generate realistic images, sounds and other sensations that simulate a user's physical presence in a virtual environment. A person using virtual reality equipment is able to look around the artificial world, move around in it, and interact with virtual features or items. The effect is commonly created by VR headsets cons ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Microbump
In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps (μbumps, ubumps), since they are usually significantly smaller than the former. The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. The ball grid array, chip-scale package, and flip chip packages generally use solder balls. Underfill After the solder balls are used to attach an integrated circuit chip to a PCB, often the remaining air gap between them is underfilled with epoxy. In some cases, there may be multiple layers of solder balls—for exampl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
GT/s
In computer technology, transfers per second and its more common secondary terms gigatransfers per second (abbreviated as GT/s) and megatransfers per second (MT/s) are informal language that refer to the number of operations transferring data that occur in each second in some given data-transfer channel. It is also known as sample rate, i.e. the number of data samples captured per second, each sample normally occurring at the clock edge. The terms are neutral with respect to the method of physically accomplishing each such data-transfer operation; nevertheless, they are most commonly used in the context of transmission of digital data. 1 MT/s is 106 or one million transfers per second; similarly, 1 GT/s means 109, or equivalently in the US/short scale, one billion transfers per second. Units The choice of the symbol ''T'' for ''transfer'' conflicts with the International System of Units, in which ''T'' stands for the tesla unit of magnetic flux density (so "Megatesla pe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
