|
Footprint (electronics)
A footprint or land pattern is the arrangement of pads (in surface-mount technology) or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board. The land pattern on a circuit board matches the arrangement of leads on a component. Component manufacturers often produce multiple pin-compatible product variants to allow systems integrators to change the exact component in use without changing the footprint on the circuit board. This can provide large cost savings for integrators, especially with dense BGA components where the footprint pads may be connected to multiple layers of the circuit board. Many component vendors provide footprints for their components, includinTexas Instruments anCUI Other sources include third party libraries, such aSnapEDA See also * Surface-mount technology * Through-hole technology * Chip carrier * List of integrated circuit packaging types * IPC (standards body) * JED ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TSOP LandPatterns Pop+Unpop
TSOP can stand for: *"TSOP (The Sound of Philadelphia)", a 1974 hit single by the band MFSB *The State of Palestine, the sovereign Palestinian state *TSOP Records, a subsidiary of Philadelphia International Records, named after the hit MFSB song *''The Sound of Perseverance'', a 1998 album by the band Death *Thin small-outline packages, a type of surface mount electronics technology *''This Side of Paradise ''This Side of Paradise'' is the debut novel by American writer F. Scott Fitzgerald, published in 1920. It examines the lives and morality of carefree American youth at the dawn of the Jazz Age. Its protagonist, Amory Blaine, is an attractive ...'', the 1920 debut novel by F. Scott Fitzgerald * TSOP.. Series (Example TSOP17), IR Receiver Modules for Rem ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Printed Circuit Board
A printed circuit board (PCB; also printed wiring board or PWB) is a medium used in Electrical engineering, electrical and electronic engineering to connect electronic components to one another in a controlled manner. It takes the form of a Lamination, laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features (similar to wires on a flat surface) Chemical milling, etched from one or more sheet layers of copper Lamination, laminated onto and/or between sheet layers of a Insulator (electricity), non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds Via (electronics), vias: plated-through holes that allow interconnections between layers. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
JEDEC
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in Arlington County, Virginia, United States. JEDEC has over 300 members, including some of the world's largest computer companies. Its scope and past activities includes standardization of part numbers, defining an electrostatic discharge (ESD) standard, and leadership in the lead-free manufacturing transition. The origin of JEDEC traces back to 1944, when RMA (subsequently renamed EIA) and NEMA established the Joint Electron Tube Engineering Council (JETEC) to coordinate vacuum tube type numberings. In 1958, with the advent of semiconductor technology, the joint JETEC-activity of EIA and NEMA was renamed into Joint Electron Device Engineering Council. NEMA discontinued its involvement in 1979. In the fall of 1999, JEDEC became a separate trade association under the current name, but maintained an EIA alliance, until EIA ceased o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
IPC (electronics)
IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. It was founded in 1957 as the Institute of Printed Circuits. Its name was later changed to the Institute for Interconnecting and Packaging Electronic Circuits to highlight the expansion from bare boards to packaging and electronic assemblies. In 1999, the organization formally changed its name to IPC with the accompanying tagline, ''Association Connecting Electronics Industries''. IPC is accredited by the American National Standards Institute (ANSI) as a standards developing organization and is known globally for its standards. It publishes the most widely used acceptability standards in the electronics industry. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. and Atlanta, Ga. in the United States, and overseas offices in China, Thailand, Vietnam, India and Belgium. Standards IPC standa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
List Of Integrated Circuit Packaging Types
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using " ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'',Wiley VCH, 2000, ,page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Through-hole Technology
In electronics, through-hole technology (also spelled "thru-hole") is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly (hand placement) or by the use of automated insertion mount machines. History Through-hole technology almost completely replaced earlier electronics assembly techniques such as point-to-point construction. From the second generation of computers in the 1950s until surface-mount technology (SMT) became popular in the mid 1980s, every component on a typical PCB was a through-hole component. PCBs initially had tracks printed on one side only, later both sides, then multi-layer boards were in use. Through holes became plated-through holes (PTH) in order for the components to make contact with the required conductive layers. Plated-through holes are no longer required with SMT boards for making the component connections, bu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Surface-mount Technology
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Row Of Through-holes For A Pin Header
Row or ROW may refer to: Exercise *Rowing, or a form of aquatic movement using oars *Row (weight-lifting), a form of weight-lifting exercise Math *Row vector, a 1 × ''n'' matrix in linear algebra. *Row (database), a single, implicitly structured data item in a table *Tone row, an arrangement of the twelve notes of the chromatic scale Other *Reality of Wrestling, an American professional wrestling promotion founded in 2005 * ''Row'' (album), an album by Gerard *Right-of-way (transportation), ROW, also often R/O/W. *The Row (fashion label) Places * Rów, Pomeranian Voivodeship, north Poland *Rów, Warmian-Masurian Voivodeship, north Poland *Rów, West Pomeranian Voivodeship, northwest Poland *Roswell International Air Center's IATA code * Row, a former spelling of Rhu, Dunbartonshire, Scotland *The Row (Lyme, New York), a set of historic homes *The Row, Virginia, an unincorporated community *Rest of the world or RoW See also *Row house *Controversy, sometimes called "row" in Br ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Systems Integrator
A systems integrator (or system integrator) is a person or company that specializes in bringing together component subsystems into a whole and ensuring that those subsystems function together, a practice known as system integration. They also solve problems of automation. Systems integrators may work in many fields but the term is generally used in the information technology (IT) field such as computer networking, the defense industry, the mass media, enterprise application integration, business process management or manual computer programming. Data quality issues are an important part of the work of systems integrators. Required skills A system integration engineer needs a broad range of skills and is likely to be defined by a breadth of knowledge rather than a depth of knowledge. These skills are likely to include software, systems and enterprise architecture, software and hardware engineering, interface protocols, and general problem solving skills. It is likely that the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Pin Compatibility
In electronics, pin-compatible devices are electronic components, generally integrated circuits or expansion cards, sharing a common footprint and with the same functions assigned or usable on the same pins. Pin compatibility is a property desired by systems integrators as it allows a product to be updated without redesigning printed circuit boards, which can reduce costs and decrease time to market. Although devices which are pin-compatible share a common footprint, they are not necessarily electrically or thermally compatible. As a result, manufacturers often specify devices as being either ''pin-to-pin'' or ''drop-in'' compatible. Pin-compatible devices are generally produced to allow upgrading within a single product line, to allow end-of-life devices to be replaced with newer equivalents, or to compete with the equivalent products of other manufacturers. Pin-to-pin compatibility ''Pin-to-pin compatible'' devices share an assignment of functions to pins, but may have di ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
.jpg "Click for more on -> Through-hole Technology")
