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Excavator (microarchitecture)
AMD Excavator Family 15h is a microarchitecture developed by Advanced Micro Devices, AMD to succeed Steamroller (microarchitecture), Steamroller Family 15h for use in AMD APU processors and normal CPUs. On October 12, 2011, AMD revealed Excavator to be the code name for the fourth-generation Bulldozer (microarchitecture), Bulldozer-derived core. The Excavator-based Accelerated processing unit, APU for mainstream applications is called ''Carrizo'' and was released in 2015. The ''Carrizo'' APU is designed to be Heterogeneous System Architecture, HSA 1.0 compliant. An Excavator-based APU and CPU variant named ''Toronto'' for server and enterprise markets was also produced. Excavator was the final revision of the Bulldozer (microarchitecture)#Revisions, "Bulldozer" family, with two new microarchitectures replacing Excavator a year later. Excavator was succeeded by the x86-64 Zen (first generation microarchitecture), Zen architecture in early 2017. Architecture Excavator added hardwar ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Advanced Micro Devices
Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufactured its own processors, the company later outsourced its manufacturing, a practice known as going fabless, after GlobalFoundries was spun off in 2009. AMD's main products include microprocessors, motherboard chipsets, embedded processors, graphics processors, and FPGAs for servers, workstations, personal computers, and embedded system applications. History First twelve years Advanced Micro Devices was formally incorporated by Jerry Sanders, along with seven of his colleagues from Fairchild Semiconductor, on May 1, 1969. Sanders, an electrical engineer who was the director of marketing at Fairchild, had, like many Fairchild executives, grown frustrated with the increasing lack of support, opportunity, and flexibility within th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Graphics Processing Unit
A graphics processing unit (GPU) is a specialized electronic circuit designed to manipulate and alter memory to accelerate the creation of images in a frame buffer intended for output to a display device. GPUs are used in embedded systems, mobile phones, personal computers, workstations, and game consoles. Modern GPUs are efficient at manipulating computer graphics and image processing. Their parallel structure makes them more efficient than general-purpose central processing units (CPUs) for algorithms that process large blocks of data in parallel. In a personal computer, a GPU can be present on a video card or embedded on the motherboard. In some CPUs, they are embedded on the CPU die. In the 1970s, the term "GPU" originally stood for ''graphics processor unit'' and described a programmable processing unit independently working from the CPU and responsible for graphics manipulation and output. Later, in 1994, Sony used the term (now standing for ''graphics processing unit'' ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
PCI Express
PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common motherboard interface for personal computers' graphics cards, hard disk drive host adapters, SSDs, Wi-Fi and Ethernet hardware connections. PCIe has numerous improvements over the older standards, including higher maximum system bus throughput, lower I/O pin count and smaller physical footprint, better performance scaling for bus devices, a more detailed error detection and reporting mechanism (Advanced Error Reporting, AER), and native hot-swap functionality. More recent revisions of the PCIe standard provide hardware support for I/O virtualization. The PCI Express electrical interface is measured by the number of simultaneous lanes. (A lane is a single send/receive line of data. The analogy is a highway with traffic in both directions. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR3 SDRAM
Double Data Rate 3 Synchronous Dynamic Random-Access Memory (DDR3 SDRAM) is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth (" double data rate") interface, and has been in use since 2007. It is the higher-speed successor to DDR and DDR2 and predecessor to DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither forward nor backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors. DDR3 is a DRAM interface specification. The actual DRAM arrays that store the data are similar to earlier types, with similar performance. The primary benefit of DDR3 SDRAM over its immediate predecessor DDR2 SDRAM, is its ability to transfer data at twice the rate (eight times the speed of its internal memory arrays), enabling higher bandwidth or peak data rates. The DDR3 standard permits DRAM chip capacities of up to 8 gigabits (Gbit), and up to four ranks ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Uniform Memory Access
Uniform memory access (UMA) is a shared memory architecture used in parallel computers. All the processors in the UMA model share the physical memory uniformly. In an UMA architecture, access time to a memory location is independent of which processor makes the request or which memory chip contains the transferred data. Uniform memory access computer architectures are often contrasted with non-uniform memory access (NUMA) architectures. In the NUMA architecture, each processor may use a private cache. Peripherals are also shared in some fashion. The UMA model is suitable for general purpose and time sharing applications by multiple users. It can be used to speed up the execution of a single large program in time-critical applications. Types of architectures There are three types of UMA architectures: * UMA using bus-based symmetric multiprocessing (SMP) architectures; * UMA using crossbar switches; * UMA using multistage interconnection networks. hUMA In April 2013, the term hUMA ( ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Instructions Per Cycle
In computer architecture, instructions per cycle (IPC), commonly called instructions per clock is one aspect of a processor's performance: the average number of instructions executed for each clock cycle. It is the multiplicative inverse of cycles per instruction. John L. Hennessy, David A. Patterson.Computer architecture: a quantitative approach. 2007. Explanation While early generations of CPUs carried out all the steps to execute an instruction sequentially, modern CPUs can do many things in parallel. As it is impossible to just keep doubling the speed of the clock, instruction pipelining and superscalar processor design have evolved so CPUs can use a variety of execution units in parallel - looking ahead through the incoming instructions in order to optimise them. This leads to the ''instructions per cycle completed'' being much higher than 1 and is responsible for much of the speed improvements in subsequent CPU generations. Calculation of IPC The calculation of IPC is ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
AMD Radeon Rx 200 Series
The Radeon 200 series is a series of graphics processors developed by AMD. These GPUs are manufactured on a 28 nm Gate-Last process through TSMC or Common Platform Alliance. Release The Rx 200 series was announced on September 25, 2013, at the AMD GPU14 Tech Day event. Non-disclosure agreements were lifted on October 15, except for the R9 290X, and pre-orders opened on October 3. Architecture * Graphics Core Next 3 (Volcanic Islands) is found on the R9 285 (Tonga Pro) branded products. * Graphics Core Next 2 (Sea Islands) is found on R7 260 (Bonaire), R7 260X (Bonaire XTX), R9 290 (Hawaii Pro), R9 290X (Hawaii XT), and R9 295X2 (Vesuvius) branded products. * Graphics Core Next 1 (Southern Islands) is found on R9 270, 270X, 280, 280X, R7 240, 250, 250X, 265, and R5 240 branded products. * TeraScale 2 (VLIW5) (Northern Islands or Evergreen) is found on R5 235X and below branded products. * OpenGL 4.x compliance requires supporting FP64 shaders. These are implemented by em ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Design Power
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called ''scenario design power'' (SDP) for some Ivy Bridge Y-series processors. Calculation The ''average CPU power'' (ACP) is the power consumption of central processing units, especially server processors, under "average" daily usage as defined by Advanced Micro Devices (AMD) for use in its line of processors based on the K10 microarchitecture ( Opteron 8300 and 2300 series processors). Intel's thermal design power (TDP), used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP rat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Graphics Core Next
Graphics Core Next (GCN) is the codename for a series of microarchitectures and an instruction set architecture that were developed by AMD for its GPUs as the successor to its TeraScale microarchitecture. The first product featuring GCN was launched on January 9, 2012. GCN is a reduced instruction set SIMD microarchitecture contrasting the very long instruction word SIMD architecture of TeraScale. GCN requires considerably more transistors than TeraScale, but offers advantages for general-purpose GPU (GPGPU) computation due to a simpler compiler. GCN graphics chips were fabricated with CMOS at 28 nm, and with FinFET at 14 nm (by Samsung Electronics and GlobalFoundries) and 7 nm (by TSMC), available on selected models in AMD's Radeon HD 7000, HD 8000, 200, 300, 400, 500 and Vega series of graphics cards, including the separately released Radeon VII. GCN was also used in the graphics portion of Accelerated Processing Units (APUs), such as those in the PlayStation 4 and Xb ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DDR4 SDRAM
Double Data Rate 4 Synchronous Dynamic Random-Access Memory (DDR4 SDRAM) is a type of synchronous dynamic random-access memory with a high bandwidth (" double data rate") interface. Released to the market in 2014, it is a variant of dynamic random-access memory (DRAM), of which some have been in use since the early 1970s, and a higher-speed successor to the DDR2 and DDR3 technologies. DDR4 is not compatible with any earlier type of random-access memory (RAM) due to different signaling voltage and physical interface, besides other factors. DDR4 SDRAM was released to the public market in Q2 2014, focusing on ECC memory, while the non-ECC DDR4 modules became available in Q3 2014, accompanying the launch of Haswell-E processors that require DDR4 memory. Features The primary advantages of DDR4 over its predecessor, DDR3, include higher module density and lower voltage requirements, coupled with higher data rate transfer speeds. The DDR4 standard allows for DIMMs of up ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Socket AM4
Socket AM4 is a PGA microprocessor socket used by AMD's central processing units (CPUs) built on the Zen (including Zen+, Zen 2 and Zen 3) and Excavator microarchitectures. ''AM4'' was launched in September 2016 and was designed to replace the sockets AM3+, FM2+ and FS1b as a single platform. It has 1331 pin slots and is the first from AMD to support DDR4 memory as well as achieve unified compatibility between high-end CPUs (previously using Socket AM3+) and AMD's lower-end APUs (on various other sockets). In 2017, AMD made a commitment to using the AM4 platform with socket 1331 until 2020. Features * Support for Zen (including Zen+, Zen 2 and Zen 3) based family of CPUs and APUs (Ryzen, Athlon), as well as for some A-Series APUs and Athlon X4 CPUs (Bristol Ridge based on the Excavator microarchitecture) * Supports PCIe 3.0 and PCIe 4.0 * Supports up to 4 modules of DDR4 RAM in dual-channel configuration Heatsink The AM4 socket specifies the 4 holes for fastening the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
