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Elnec
Elnec is a Slovak manufacturer of device programming systems for programmable integrated circuits. History Since its founding in 1991, the company has been oriented towards developing and manufacturing developer tools like device programmers, emulators, simulators and logic analyzers. Core business of the company today is only the development and manufacture of equipment that transfers data into various non-volatile semiconductor devices. These devices can be sorted into three categories: Microcontroller, Flash Memory, Programmable Logic Devices. Most of Elnec device programmers can be referred as universal due to support of many programmable devices from different semiconductor companies as Microchip, STMicroelectronics, EM microelectronics, etc. Elnec’s products are sold also under ODM names as B&K Precision, Dataman or Minato. One of company's competitors is Data I/O. Current products Elnec production can be divided into groups: *Multiprogramming systems (Product ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Programmer (hardware)
A programmer, device programmer, chip programmer, device burner, or PROM writer is a piece of electronic equipment that arranges written software to configure programmable non-volatile integrated circuits, called programmable devices. The target devices include PROM, EPROM, EEPROM, Flash memory, eMMC, MRAM, FeRAM, NVRAM, PLDs, PLAs, PALs, GALs, CPLDs, FPGAs, and microcontrollers. Function Programmer hardware has two variants. One is configuring the target device itself with a socket on the programmer. Another is configuring the device on a printed circuit board. In the former case, the target device is inserted into a socket (usually ZIF) on top of the programmer. If the device is not a standard ''DIP packaging'', a plug-in adapter board, which converts the footprint with another socket, is used. In the latter case, device programmer is directly connected to the printed circuit board by a connector, usually with a cable. This way is called ''on-board progr ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Chip Tuning
Chip tuning is changing or modifying an erasable programmable read only memory chip in an automobile's or other vehicle's electronic control unitECU to achieve superior performance, whether it be more power, cleaner emissions, or better fuel efficiency. Engine manufacturers generally use a conservative electronic control unit map to allow for individual engine variations as well as infrequent servicing and poor-quality fuel. Vehicles with a remapped electronic control unit may be more sensitive to fuel quality and service schedules. This was done with early engine computers in the 1980s and 1990s. Today, the term chip tuning can be misleading, as people will often use it to describe ECU tuning that does not involve swapping the chip. Modern electronic control units can be tuned by simply updating their software through a standard interface, such as On Board Diagnostics. This procedure is commonly referred to as engine or electronic control unit tuning. Electronic control units a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics Companies Of Slovakia
The field of electronics is a branch of physics and electrical engineering that deals with the emission, behaviour and effects of electrons using electronic devices. Electronics uses active devices to control electron flow by amplification and rectification Rectification has the following technical meanings: Mathematics * Rectification (geometry), truncating a polytope by marking the midpoints of all its edges, and cutting off its vertices at those points * Rectifiable curve, in mathematics * Recti ..., which distinguishes it from classical electrical engineering, which only uses Passive electronic component, passive effects such as Electrical resistance and conductance, resistance, capacitance and inductance to control electric current flow. Electronics has hugely influenced the development of modern society. The central driving force behind the entire electronics industry is the semiconductor industry sector, which has annual sales of over $481 billion as of 2018. The la ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics Companies Established In 1991
The field of electronics is a branch of physics and electrical engineering that deals with the emission, behaviour and effects of electrons using electronic devices. Electronics uses active devices to control electron flow by amplification and rectification, which distinguishes it from classical electrical engineering, which only uses passive effects such as resistance, capacitance and inductance to control electric current flow. Electronics has hugely influenced the development of modern society. The central driving force behind the entire electronics industry is the semiconductor industry sector, which has annual sales of over $481 billion as of 2018. The largest industry sector is e-commerce, which generated over $29 trillion in 2017. History and development Electronics has hugely influenced the development of modern society. The identification of the electron in 1897, along with the subsequent invention of the vacuum tube which could amplify and rectify small elec ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
DIL Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For ex ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ball Grid Array
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. BGAs were introduced in the 1990s and became popular by 2001. Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens. Description The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals betwe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Quad Flat No Leads Package
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the ''surfaces'' of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. Flat no-lead packages include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA). Flat no-lead cross-section The figure shows the cross section of a flat no-lead package with a lead frame and wire bonding. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Plastic Leaded Chip Carrier
In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.Kenneth Jackson, Wolfgang Schroter, (ed), ''Handbook of Semiconductor Technology Volume 2'',Wiley VCH, 2000, ,page 627 Types Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is " flat pack". Chip carriers can be smaller than dual in-line packages and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as JEDEC. Other forms are ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small-outline Integrated Circuit
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than JEDEC MS-012.) Note that because of t ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Shrink Small-Outline Package
A small outline integrated circuit (SOIC) is a Surface-mount technology, surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin List of 4000 series integrated circuits, 4011 would be housed in an SOIC-14 or SO-14 package. JEDEC and JEITA/EIAJ standards ''Small outline'' actually refers to IC packaging standards from at least two different organizations: * JEDEC: *MS-012PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH. *MS-013VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH. * JEITA (previously EIAJ, which term some vendors still use): *Semiconductor Device Packages (EIAJ Type II is 5.3 mm body width, and slightl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flash Memory
Flash memory is an electronic non-volatile computer memory storage medium that can be electrically erased and reprogrammed. The two main types of flash memory, NOR flash and NAND flash, are named for the NOR and NAND logic gates. Both use the same cell design, consisting of floating gate MOSFETs. They differ at the circuit level depending on whether the state of the bit line or word lines is pulled high or low: in NAND flash, the relationship between the bit line and the word lines resembles a NAND gate; in NOR flash, it resembles a NOR gate. Flash memory, a type of floating-gate memory, was invented at Toshiba in 1980 and is based on EEPROM technology. Toshiba began marketing flash memory in 1987. EPROMs had to be erased completely before they could be rewritten. NAND flash memory, however, may be erased, written, and read in blocks (or pages), which generally are much smaller than the entire device. NOR flash memory allows a single machine word to be written to an era ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
