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Electronic Packaging
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, Electromagnetic interference, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering. Design Electronic packaging can be organized by levels: * Level 0 - "Chip", protecting a bare semiconductor die from contaminat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Mainframe Computer
A mainframe computer, informally called a mainframe or big iron, is a computer used primarily by large organizations for critical applications like bulk data processing for tasks such as censuses, industry and consumer statistics, enterprise resource planning, and large-scale transaction processing. A mainframe computer is large but not as large as a supercomputer and has more processing power than some other classes of computers, such as minicomputers, servers, workstations, and personal computers. Most large-scale computer-system architectures were established in the 1960s, but they continue to evolve. Mainframe computers are often used as servers. The term ''mainframe'' was derived from the large cabinet, called a ''main frame'', that housed the central processing unit and main memory of early computers. Later, the term ''mainframe'' was used to distinguish high-end commercial computers from less powerful machines. Design Modern mainframe design is characterized less by ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small Form Factor Cases
Small may refer to: Science and technology * SMALL, an ALGOL-like programming language * Small (anatomy), the lumbar region of the back * ''Small'' (journal), a nano-science publication * <small>, an HTML element that defines smaller text Arts and entertainment Fictional characters * Small, in the British children's show Big & Small Other uses * Small, of little size * Small (surname) * "Small", a song from the album ''The Cosmos Rocks'' by Queen + Paul Rodgers See also * Smal (other) * List of people known as the Small The Small is an epithet applied to: *Bolko II the Small (c. 1312–1368), Duke of Świdnica, of Jawor and Lwówek, of Lusatia, over half of Brzeg and Oława, of Siewierz, and over half of Głogów and Ścinawa *Dionysius Exiguus (c. 470–c. 5 ... * Smalls (other) {{disambiguation ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Industrial Design
Industrial design is a process of design applied to physical products that are to be manufactured by mass production. It is the creative act of determining and defining a product's form and features, which takes place in advance of the manufacture or production of the product. It consists purely of repeated, often automated, replication, while craft-based design is a process or approach in which the form of the product is determined by the product's creator largely concurrent with the act of its production. All manufactured products are the result of a design process, but the nature of this process can vary. It can be conducted by an individual or a team, and such a team could include people with varied expertise (e.g. designers, engineers, business experts, etc.). It can emphasize intuitive creativity or calculated scientific decision-making, and often emphasizes a mix of both. It can be influenced by factors as varied as materials, production processes, business strategy, a ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Packaging
Packaging is the science, art and technology of enclosing or protecting products for distribution, storage, sale, and use. Packaging also refers to the process of designing, evaluating, and producing packages. Packaging can be described as a coordinated system of preparing goods for transport, warehousing, logistics, sale, and end use. Packaging contains, protects, preserves, transports, informs, and sells. In many countries it is fully integrated into government, business, institutional, industrial, and personal use. Package labeling (American English) or labelling (British English) is any written, electronic, or graphic communication on the package or on a separate but associated label. History of packaging Ancient era The first packages used the natural materials available at the time: baskets of reeds, wineskins (bota bags), wooden boxes, pottery vases, ceramic amphorae, wooden barrels, woven bags, etc. Processed materials were used to form packages as they were develop ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Packaging (other)
Packaging most often refers to packaging and labeling, including Specialised packaging *Active packaging, packaging systems to help extend shelf life, monitor freshness, display information on quality, improve safety, and improve convenience** Self-heating food packaging, active packaging with the ability to heat food contents without external heat sources or power * Blister packaging, pre-formed plastic packaging used for small goods *Child-resistant packaging, packaging used to reduce the risk of children ingesting hazardous materials *Cosmetic packaging, cosmetic containers and secondary packaging of cosmetic products *Currency packaging, forms of packing money for easy handling and counting *Electronic packaging, enclosures and protective features in electronic devices **Dual in-line package, an electronic component package **Integrated circuit packaging, final stage in construction of an integrated circuit *** Quilt packaging, an integrated circuit packaging ***Wafer-level ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit Packaging
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing. The packaging stage is followed by testing of the integrated circuit. The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip si ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Package
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities (" doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabrica ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Autoclave
An autoclave is a machine used to carry out industrial and scientific processes requiring elevated temperature and pressure in relation to ambient pressure and/or temperature. Autoclaves are used before surgical procedures to perform sterilization and in the chemical industry to cure coatings and vulcanize rubber and for hydrothermal synthesis. Industrial autoclaves are used in industrial applications, especially in the manufacturing of composites. Many autoclaves are used to sterilize equipment and supplies by subjecting them to pressurized saturated steam at for around 30-60 minutes at a pressure of 15 psi (103 kPa or 1.02 atm) depending on the size of the load and the contents. The autoclave was invented by Charles Chamberland in 1879, although a precursor known as the steam digester was created by Denis Papin in 1679. The name comes from Greek ''auto-'', ultimately meaning self, and Latin ''clavis'' meaning key, thus a self-locking device. Uses Sterilization auto ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Solderability
The solderability of a substrate is a measure of the ease with which a soldered joint can be made to that material. Good solderability requires wetting (low contact angle) of the substrate by the solder. __TOC__ Of metals Solderability varies depending on the type of solder alloy under discussion. The discussion that follows applies only to unspecified electronic solders (which may include solders that contain lead, now banned for use in nearly all electronic equipment made or sold in the EU). Solderability when using lead-free alloys can differ significantly from solderability when using lead based alloys. Noble metals may be easy to solder but they have brittle joints. The metals in the good category require a large amount of heat therefore oxidation is an issue. To overcome this a flux is required. For carbon steel, low alloy steel, zinc, and nickel the presence of sulfur creates a brittle joint; lower temperatures are used to minimize this problem. The oxides on the surface of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Shock
Thermal shock is a type of rapidly transient mechanical load. By definition, it is a mechanical load caused by a rapid change of temperature of a certain point. It can be also extended to the case of a thermal gradient, which makes different parts of an object expand by different amounts. This differential expansion can be more directly understood in terms of strain, than in terms of stress, as it is shown in the following. At some point, this stress can exceed the tensile strength of the material, causing a crack to form. If nothing stops this crack from propagating through the material, it will cause the object's structure to fail. Failure due to thermal shock can be prevented by: # Reducing the thermal gradient seen by the object, by changing its temperature more slowly or increasing the material's thermal conductivity # Reducing the material's coefficient of thermal expansion # Increasing its strength # Introducing built-in compressive stress, as for example in tempe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Temperature Cycling
Temperature cycling (or temperature cycle) is the process of cycling through two temperature extremes, typically at relatively high rates of change. It is an environmental stress test used in evaluating product reliability as well as in manufacturing to catch early-term, latent defects by inducing failure through thermal fatigue Fatigue describes a state of tiredness that does not resolve with rest or sleep. In general usage, fatigue is synonymous with extreme tiredness or exhaustion that normally follows prolonged physical or mental activity. When it does not resolve .... External links Temperature Cycling (JEDEC Standard No. 22-A104D) Environmental testing ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
