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CoreExpress
CoreExpress modules are complete computer-on-module (COM) highly integrated, compact computers that can be used in an embedded computer board design, much like an integrated circuit component. COMs integrate CPU, memory, graphics, and BIOS, and common I/O interfaces. The interfaces are modern, using only digital buses such as PCI Express, Serial ATA, Ethernet, USB, and HD audio (Intel High Definition Audio). All signals are accessible on a high-density, high-speed, 220-pin connector. Although most implementations use Intel processors, the specification is open for different CPU modules. CoreExpress modules are mounted on a custom carrier board, containing the peripherals required for the specific application. In this way, small but highly specialized computer systems can be built. The CoreExpress form factor was originally developed by LiPPERT Embedded Computers and standardized by the Small Form Factor Special Interest Group in March 2010. Size and mechanics The specification ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Small Form Factor Special Interest Group
The Small Form Factor Special Interest Group (SFF-SIG, pronounced ''ess-eff-eff-sig'') is an international non-profit standards body focused on modular computer hardware technologies used in embedded and small form factor computers and controllers. Members are mainly computer board and component manufacturers. The group was founded in 2007 and had a web site until early 2020. History SFF-SIG generally targets low power components and processors from VIA Technologies and Intel including the Nano and Atom processors, although products for RISC processors were discussed in some working groups. VIA, WinSystems, and Octagon Systems were founding members of SFF-SIG. It was created in 2007. A logo and web site debuted in April 2008. SFF-SIG creates, promotes, and maintains embedded computer standards for form factors and computer buses. Examples include the governing documents and trademarks for CoreExpress, Pico-ITX, Express104, and SUMIT. Members use the specifications to build s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer-on-module
A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of system on chip (SoC) and system in package (SiP), COM lies between a full-up computer and a microcontroller in nature. It is very similar to a system on module (SOM). Design COMs are complete embedded computers built on a single circuit board. The design is centered on a microprocessor with RAM, input/output controllers and all other features needed to be a functional computer on the one board. However, unlike a single-board computer, the COM usually lacks the standard connectors for any input/output peripherals to be attached directly to the board. The module usually needs to be mounted on a carrier board (or "baseboard") which breaks the bus out to standard peripheral connectors. Some COMs also include peripheral connectors. Some can be used without a carrier. A COM solution offers a dense package computer system for use in s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer-on-module
A computer-on-module (COM) is a type of single-board computer (SBC), a subtype of an embedded computer system. An extension of the concept of system on chip (SoC) and system in package (SiP), COM lies between a full-up computer and a microcontroller in nature. It is very similar to a system on module (SOM). Design COMs are complete embedded computers built on a single circuit board. The design is centered on a microprocessor with RAM, input/output controllers and all other features needed to be a functional computer on the one board. However, unlike a single-board computer, the COM usually lacks the standard connectors for any input/output peripherals to be attached directly to the board. The module usually needs to be mounted on a carrier board (or "baseboard") which breaks the bus out to standard peripheral connectors. Some COMs also include peripheral connectors. Some can be used without a carrier. A COM solution offers a dense package computer system for use in s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Spreader
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat transfer with expenditure of energy as work supplied by an external source. A heat pipe uses fluids inside a sealed case. The fluids circulate either passively, by spontaneous convection, triggered when a threshold temperature difference occurs; or actively, because of an impeller driven by an external source of work. Without sealed circulation, energy can be carried by transfer of fluid matter, for example externally supplied colder air, driven by an external source of work, from a hotter body to another external body, though this is not exactly heat transfer as defined in physics. Exemplifying increase of entropy according to the second ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Embedded System
An embedded system is a computer system—a combination of a computer processor, computer memory, and input/output peripheral devices—that has a dedicated function within a larger mechanical or electronic system. It is ''embedded'' as part of a complete device often including electrical or electronic hardware and mechanical parts. Because an embedded system typically controls physical operations of the machine that it is embedded within, it often has real-time computing constraints. Embedded systems control many devices in common use today. , it was estimated that ninety-eight percent of all microprocessors manufactured were used in embedded systems. Modern embedded systems are often based on microcontrollers (i.e. microprocessors with integrated memory and peripheral interfaces), but ordinary microprocessors (using external chips for memory and peripheral interface circuits) are also common, especially in more complex systems. In either case, the processor(s) used ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Computer Form Factor
Form factor is a hardware design aspect that defines and prescribes the size, shape, and other physical specifications of components, particularly in electronics. A form factor may represent a broad class of similarly sized components, or it may prescribe a specific standard. It may also define an entire system, as in a computer form factor. Evolution and standardization As electronic hardware has become smaller following Moore's law and related patterns, ever-smaller form factors have become feasible. Specific technological advances, such as PCI Express, have had a significant design impact, though form factors have historically been slower to evolve than individual components. Standardization of form factors is vital for compatibility of hardware from different manufacturers. Trade-offs Smaller form factors may offer more efficient use of limited space, greater flexibility in the placement of components within a larger assembly, reduced use of material, and greater ease of tran ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Embedded System Module
Embedded System Module, or ESM, is a compact computer-on-module (COM) standard. An ESM module typically includes a CPU processor, memory, module-specific I/O interfaces and a number of basic front I/O connectors. They can be plugged on a carrier board or be used as a stand-alone processor card. If the ESM module is plugged on a carrier, it relies on the standard PCI bus as a board-to-board interface. In this case two connectors create a link to the carrier. While the "J1" connector provides a specified PCI connection, the "J2" connector brings I/O signals from the ESM module to the carrier, which then includes all necessary connectors. The signal assignment of J2 is not fixed but can be completely customized, although there are reserved pins for a 64-bit PCI bus interface. A third connector, "J3", is used for additional I/O signals if the ESM module has no front I/O. The signal assignment of this connector is fixed to support a special set of I/O functions. A large part of the I/O f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electromagnetic Interference
Electromagnetic interference (EMI), also called radio-frequency interference (RFI) when in the radio frequency spectrum, is a disturbance generated by an external source that affects an electrical circuit by electromagnetic induction, electrostatic coupling, or conduction. The disturbance may degrade the performance of the circuit or even stop it from functioning. In the case of a data path, these effects can range from an increase in error rate to a total loss of the data. Both man-made and natural sources generate changing electrical currents and voltages that can cause EMI: ignition systems, cellular network of mobile phones, lightning, solar flares, and auroras (northern/southern lights). EMI frequently affects AM radios. It can also affect mobile phones, FM radios, and televisions, as well as observations for radio astronomy and atmospheric science. EMI can be used intentionally for radio jamming, as in electronic warfare. History Since the earliest days of ra ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Sink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dissipation
In thermodynamics, dissipation is the result of an irreversible process that takes place in homogeneous thermodynamic systems. In a dissipative process, energy (internal, bulk flow kinetic, or system potential) transforms from an initial form to a final form, where the capacity of the final form to do thermodynamic work is less than that of the initial form. For example, heat transfer is dissipative because it is a transfer of internal energy from a hotter body to a colder one. Following the second law of thermodynamics, the entropy varies with temperature (reduces the capacity of the combination of the two bodies to do work), but never decreases in an isolated system. These processes produce entropy at a certain rate. The entropy production rate times ambient temperature gives the dissipated power. Important examples of irreversible processes are: heat flow through a thermal resistance, fluid flow through a flow resistance, diffusion (mixing), chemical reactions, and electric cu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dissipation
In thermodynamics, dissipation is the result of an irreversible process that takes place in homogeneous thermodynamic systems. In a dissipative process, energy (internal, bulk flow kinetic, or system potential) transforms from an initial form to a final form, where the capacity of the final form to do thermodynamic work is less than that of the initial form. For example, heat transfer is dissipative because it is a transfer of internal energy from a hotter body to a colder one. Following the second law of thermodynamics, the entropy varies with temperature (reduces the capacity of the combination of the two bodies to do work), but never decreases in an isolated system. These processes produce entropy at a certain rate. The entropy production rate times ambient temperature gives the dissipated power. Important examples of irreversible processes are: heat flow through a thermal resistance, fluid flow through a flow resistance, diffusion (mixing), chemical reactions, and electric cu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Credit Card
A credit card is a payment card issued to users (cardholders) to enable the cardholder to pay a merchant for goods and services based on the cardholder's accrued debt (i.e., promise to the card issuer to pay them for the amounts plus the other agreed charges). The card issuer (usually a bank or credit union) creates a revolving account and grants a line of credit to the cardholder, from which the cardholder can borrow money for payment to a merchant or as a cash advance. There are two credit card groups: consumer credit cards and business credit cards. Most cards are plastic, but some are metal cards (stainless steel, gold, palladium, titanium), and a few gemstone-encrusted metal cards. A regular credit card is different from a charge card, which requires the balance to be repaid in full each month or at the end of each statement cycle. In contrast, credit cards allow the consumers to build a continuing balance of debt, subject to interest being charged. A credit car ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
