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BASIC Atom
''Basic Atom'' refers to a line of self-contained microcontrollers froBasic Micro Like the Basic stamp, the Basic Atom line is based upon various microchips pre-programmed with an interpreter, making it easy to change "programs", as they are only "data" being interpreted. A compiler converts a high level language into the interpretive "code" which is then loaded in as data, and run. * The product line consists of: ** Basic Atom - ''Basic Stamp 2'' compatible devices, claiming faster execution ** Basic Atom Nano, a series of pre-programmed chips for those that want to integrate the functionality into other products without adding other boards ** Basic Atom Pro, a line of higher capacity devices. ** Board-level products, such as for robotic control, etc. ** Accessories such as power supplies. Basic Atom chips may be added to other projects via the familiar Dual in-line package style, or the higher density TQFP. One small Basic Atom Pro is implemented as a Single in-line pa ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Microcontroller
A microcontroller (MCU for ''microcontroller unit'', often also MC, UC, or μC) is a small computer on a single VLSI integrated circuit (IC) chip. A microcontroller contains one or more CPUs (processor cores) along with memory and programmable input/output peripherals. Program memory in the form of ferroelectric RAM, NOR flash or OTP ROM is also often included on chip, as well as a small amount of RAM. Microcontrollers are designed for embedded applications, in contrast to the microprocessors used in personal computers or other general purpose applications consisting of various discrete chips. In modern terminology, a microcontroller is similar to, but less sophisticated than, a system on a chip (SoC). An SoC may connect the external microcontroller chips as the motherboard components, but an SoC usually integrates the advanced peripherals like graphics processing unit (GPU) and Wi-Fi interface controller as its internal microcontroller unit circuits. Microcontrollers are use ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Basic Stamp
The BASIC Stamp is a microcontroller with a small, specialized BASIC interpreter (PBASIC) built into ROM. It is made by Parallax, Inc. and has been popular with electronics hobbyists since the early 1990s. Technical specifications Although the BASIC Stamp 2 has the form of a 24 pin DIP chip, it is in fact a small printed circuit board (PCB) that contains the essential elements of a microprocessor system: * A Microcontroller containing the CPU, a built in ROM containing the BASIC interpreter, and various peripherals * 2kB of i²C EEPROM memory. * A clock, in the form of a ceramic resonator * Voltage regulator * External input/output The end result is that a hobbyist can connect a 9 V battery to a BASIC Stamp and have a complete system. A serial connection to a personal computer allows the programmer to download software to the BASIC Stamp, which is stored in the onboard non-volatile memory device: it remains programmed until it is erased or reprogrammed, even when the po ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TQFP
A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP). The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB). A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR flash memories and other programmable component ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Single In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For ex ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
