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Bond Characterization
The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws. Those flaws can be caused by void formation in the interface due to unevenness or impurities. The bond connection is characterized for wafer bond development or quality assessment of fabricated wafers and sensors. Overview Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, hermeticity of encapsulation and bonding induced stress. The bond strength can be evaluated using double cantilever beam or chevron respectively micro-chevron tests. Other pull tests as well as burst, direct shear tests or bend tests enable the determination of the bond strength. The packaging hermeticity is characterized using membrane, He-leak, resonator/pressure tests. Three additional possibilities to evaluate the bond connection are optical, electron and Acoustical measurements and instrumentati ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Void (composites)
A void is a pore that remains unfilled with polymer and fibers in a composite material. Voids are typically the result of poor manufacturing of the material and are generally deemed undesirable. Voids can affect the mechanical properties and lifespan of the composite. They degrade mainly the matrix-dominated properties such as interlaminar shear strength, longitudinal compressive strength, and transverse tensile strength. Voids can act as crack initiation sites as well as allow moisture to penetrate the composite and contribute to the anisotropy of the composite. For aerospace applications, a void content of approximately 1% is still acceptable, while for less sensitive applications, the allowance limit is 3-5%. Although a small increase in void content may not seem to cause significant issues, a 1-3% increase in void content of carbon fiber reinforced composite can reduce the mechanical properties by up to 20% Void content in composites is represented as a ratio, also called ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Interference (wave Propagation)
In physics, interference is a phenomenon in which two waves combine by adding their displacement together at every single point in space and time, to form a resultant wave of greater, lower, or the same amplitude. Constructive and destructive interference result from the interaction of waves that are correlated or coherent with each other, either because they come from the same source or because they have the same or nearly the same frequency. Interference effects can be observed with all types of waves, for example, light, radio, acoustic, surface water waves, gravity waves, or matter waves. Etymology The word ''interference'' is derived from the Latin words ''inter'' which means "between" and ''fere'' which means "hit or strike", and was coined by Thomas Young in 1801. Mechanisms The principle of superposition of waves states that when two or more propagating waves of the same type are incident on the same point, the resultant amplitude at that point is equal to th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer Bonding
Wafer bonding is a packaging technology on Wafer (electronics), wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices. Smaller wafers were used in the early days of the microelectronics industry, with wafers being just 1 inch in diameter in the 1950s. Overview In microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS), the package protects the sensitive internal structures from environmental influences such as temperature, moisture, high pressure and oxidizing species. The long-term stability and reliability of the functional elements depend on the encapsulation process, as does the overall device cost. The package has to fulfil ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Technology
A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities (" doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabricat ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Packaging (microfabrication)
In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing. The packaging stage is followed by testing of the integrated circuit. The term is sometimes confused with electronic packaging, which is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signal ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics Manufacturing
Electronics Manufacturing Services (EMS) is a term used for companies that design, manufacture, test, distribute, and provide return/repair services for electronic components and assemblies for original equipment manufacturers (OEMs). The concept is also referred to as Electronics Contract Manufacturing (ECM). Many consumer electronics are built in China, due to maintenance cost, availability of materials, and speed as opposed to other countries such as the United States. Cities such as Shenzhen and Penang have become important production centres for the industry, attracting many consumer electronics companies such as Apple Inc. Some companies such as Flex (company), Flex and Wistron are Original design manufacturers and providers of Electronics manufacturing services. History The EMS industry was initially established in 1961 by SCI Systems of Huntsville Alabama. The industry realized its most significant growth in the 1980s; at the time, most electronics manufacturing for large-s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
USB Tweezers CBP
Universal Serial Bus (USB) is an industry standard that establishes specifications for cables, connectors and protocols for connection, communication and power supply (interfacing) between computers, peripherals and other computers. A broad variety of USB hardware exists, including 14 different connector types, of which USB-C is the most recent and the only one not currently deprecated. First released in 1996, the USB standards are maintained by the USB Implementers Forum (USB-IF). The four generations of USB are: USB 1.''x'', USB 2.0, USB 3.''x'', and USB4. Overview USB was designed to standardize the connection of peripherals to personal computers, both to communicate with and to supply electric power. It has largely replaced interfaces such as serial ports and parallel ports, and has become commonplace on a wide range of devices. Examples of peripherals that are connected via USB include computer keyboards and mice, video cameras, printers, portable media players, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Laser Bond Inspection
A laser is a device that emits light through a process of optical amplification based on the stimulated emission of electromagnetic radiation. The word "laser" is an acronym for "light amplification by stimulated emission of radiation". The first laser was built in 1960 by Theodore H. Maiman at Hughes Research Laboratories, based on theoretical work by Charles Hard Townes and Arthur Leonard Schawlow. A laser differs from other sources of light in that it emits light which is ''coherent''. Spatial coherence allows a laser to be focused to a tight spot, enabling applications such as laser cutting and lithography. Spatial coherence also allows a laser beam to stay narrow over great distances (collimation), enabling applications such as laser pointers and lidar (light detection and ranging). Lasers can also have high temporal coherence, which allows them to emit light with a very narrow spectrum. Alternatively, temporal coherence can be used to produce ultrashort pulses of ligh ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Young's Modulus
Young's modulus E, the Young modulus, or the modulus of elasticity in tension or compression (i.e., negative tension), is a mechanical property that measures the tensile or compressive stiffness of a solid material when the force is applied lengthwise. It quantifies the relationship between tensile/compressive stress \sigma (force per unit area) and axial strain \varepsilon (proportional deformation) in the linear elastic region of a material and is determined using the formula: E = \frac Young's moduli are typically so large that they are expressed not in pascals but in gigapascals (GPa). Example: * Silly Putty (increasing pressure: length increases quickly, meaning tiny E) * Aluminum (increasing pressure: length increases slowly, meaning high E) Higher Young's modulus corresponds to greater (lengthwise) stiffness. Although Young's modulus is named after the 19th-century British scientist Thomas Young, the concept was developed in 1727 by Leonhard Euler. The first experime ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Signal-to-noise Ratio
Signal-to-noise ratio (SNR or S/N) is a measure used in science and engineering that compares the level of a desired signal to the level of background noise. SNR is defined as the ratio of signal power to the noise power, often expressed in decibels. A ratio higher than 1:1 (greater than 0 dB) indicates more signal than noise. SNR, bandwidth, and channel capacity of a communication channel are connected by the Shannon–Hartley theorem. Definition Signal-to-noise ratio is defined as the ratio of the power of a signal (meaningful input) to the power of background noise (meaningless or unwanted input): : \mathrm = \frac, where is average power. Both signal and noise power must be measured at the same or equivalent points in a system, and within the same system bandwidth. Depending on whether the signal is a constant () or a random variable (), the signal-to-noise ratio for random noise becomes: : \mathrm = \frac where E refers to the expected value, i.e. in this case ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electromagnetic Acoustic Transducer
Electromagnetic acoustic transducer (EMAT) is a transducer for non-contact acoustic wave generation and reception in conducting materials. Its effect is based on electromagnetic mechanisms, which do not need direct coupling with the surface of the material. Due to this couplant-free feature, EMATs are particularly useful in harsh, i.e., hot, cold, clean, or dry environments. EMATs are suitable to generate all kinds of waves in metallic and/or magnetostrictive materials. Depending on the design and orientation of coils and magnets, shear horizontal (SH) bulk wave mode (norm-beam or angle-beam), surface wave, plate waves such as SH and Lamb waves, and all sorts of other bulk and guided-wave modes can be excited. After decades of research and development, EMAT has found its applications in many industries such as primary metal manufacturing and processing, automotive, railroad, pipeline, boiler and pressure vessel industries, in which they are typically used for nondestructive testing ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
