|
Apple A6X
The Apple A6X is a 32-bit system-on-a-chip (SoC) designed by Apple Inc., introduced at the launch of the 4th generation iPad on October 23, 2012. It is a high-performance variant of the Apple A6 and the last 32-bit chip Apple used on an iOS device before Apple switched to 64-bit. Apple claims the A6X has twice the CPU performance and up to twice the graphics performance of its predecessor, the Apple A5X. Software updates for the 4th generation iPad ended in 2019 with the release of iOS 10.3.4 for cellular models, thus ceasing support for this chip as it was discontinued with the release of iOS 11 in 2017. Design The A6X features a 1.4 GHz custom Apple-designed ARMv7-A architecture based dual-core CPU called Swift, introduced in the Apple A6. It includes an integrated quad-core PowerVR SGX554MP4 graphics processing unit (GPU) running at 300 MHz and a quad-channel memory subsystem. The memory subsystem supports LPDDR2-1066 DRAM, increasing the theoretical memor ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Apple Inc
Apple Inc. is an American multinational technology company headquartered in Cupertino, California, United States. Apple is the largest technology company by revenue (totaling in 2021) and, as of June 2022, is the world's biggest company by market capitalization, the fourth-largest personal computer vendor by unit sales and second-largest mobile phone manufacturer. It is one of the Big Five American information technology companies, alongside Alphabet, Amazon, Meta, and Microsoft. Apple was founded as Apple Computer Company on April 1, 1976, by Steve Wozniak, Steve Jobs and Ronald Wayne to develop and sell Wozniak's Apple I personal computer. It was incorporated by Jobs and Wozniak as Apple Computer, Inc. in 1977 and the company's next computer, the Apple II, became a best seller and one of the first mass-produced microcomputers. Apple went public in 1980 to instant financial success. The company developed computers featuring innovative graphical user interface ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
IOS 11
iOS 11 is the eleventh major release of the iOS mobile operating system developed by Apple Inc., being the successor to iOS 10. It was announced at the company's Worldwide Developers Conference on June 5, 2017, and released on September 19, 2017. It was succeeded by iOS 12 on September 17, 2018. Changes iOS 11 brought many changes to iOS. Some major highlights were: * The lock screen and Notification Center were combined, allowing all notifications to be displayed directly on the lock screen. * The control center was completely redesigned, combining all pages into a single unified page. It also brought the ability to rearrange the position of the controls, some of which could be used with 3D Touch for quick access to additional options. * The App Store received its first major design overhaul since iOS 7 to focus on editorial content and daily highlights. * A " Files" file manager app allowed access to files stored locally on-device and in iCloud and other cloud services. Wit ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Apple Silicon
Apple silicon is a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. It is the basis of most new Mac computers as well as iPhone, iPad, iPod Touch, Apple TV, and Apple Watch, and of products such as AirPods, HomePod, HomePod Mini, and AirTag. Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22, 2020. The first Macs built with the Apple M1 processor were unveiled on November 10, 2020. In 2022, the newest Mac models were built with Apple silicon; only older models of the Mac Mini and the Mac Pro still use Intel Core and Xeon processors respectively. Apple fully controls the integration of Apple silicon chips with the company's hardware and software products. Johny Srouji is in charge of Apple's silicon design. Manufacturing of the chips is outsourced to semiconductor contract manufacturers such as Samsung and TSMC. A s ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Metal Gate
A metal gate, in the context of a lateral metal–oxide–semiconductor (MOS) stack, is the gate electrode separated by an oxide from the transistor's channel – the gate material is made from a metal. In most MOS transistors since about the mid 1970s, the "M" for metal has been replaced by a non-metal gate material. Aluminum gate The first MOSFET (metal–oxide–semiconductor field-effect transistor) was made by Mohamed Atalla and Dawon Kahng at Bell Labs in 1959, and demonstrated in 1960. They used silicon as channel material and a non-self-aligned aluminum gate. Aluminum gate metal (typically deposited in an evaporation vacuum chamber onto the wafer surface) was common through the early 1970s. Polysilicon By the late 1970s, the industry had moved away from aluminum as the gate material in the metal–oxide–semiconductor stack due to fabrication complications and performance issues. A material called polysilicon ( polycrystalline silicon, highly doped with donors o ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
High-κ Dielectric
The term high-κ dielectric refers to a material with a high dielectric constant (κ, kappa), as compared to silicon dioxide. High-κ dielectrics are used in semiconductor manufacturing processes where they are usually used to replace a silicon dioxide gate dielectric or another dielectric layer of a device. The implementation of high-κ gate dielectrics is one of several strategies developed to allow further miniaturization of microelectronic components, colloquially referred to as extending Moore's Law. Sometimes these materials are called "high-k" (pronounced "high kay"), instead of "high-κ" (high kappa). Need for high-κ materials Silicon dioxide () has been used as a gate oxide material for decades. As metal-oxide-semiconductor field-effect transistors (MOSFETs) have decreased in size, the thickness of the silicon dioxide gate dielectric has steadily decreased to increase the gate capacitance (per unit area) and thereby drive current (per device width), raising device pe ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Package On Package
Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations. Configuration Two widely used configurations exist for PoP: * Pure memory stacking: two or more memory only packages are stacked on each other * Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be a system on a chip (SoC) for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard. During PCB assembly, the bottom package of a P ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heat Spreader
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat transfer with expenditure of energy as work supplied by an external source. A heat pipe uses fluids inside a sealed case. The fluids circulate either passively, by spontaneous convection, triggered when a threshold temperature difference occurs; or actively, because of an impeller driven by an external source of work. Without sealed circulation, energy can be carried by transfer of fluid matter, for example externally supplied colder air, driven by an external source of work, from a hotter body to another external body, though this is not exactly heat transfer as defined in physics. Exemplifying increase of entropy according to the secon ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Memory Controller
The memory controller is a digital circuit that manages the flow of data going to and from the computer's main memory. A memory controller can be a separate chip or integrated into another chip, such as being placed on the same die or as an integral part of a microprocessor; in the latter case, it is usually called an integrated memory controller (IMC). A memory controller is sometimes also called a memory chip controller (MCC) or a memory controller unit (MCU). A common form of memory controller is the memory management unit (MMU) which in many operating systems implements virtual addressing. History Most modern desktop or workstation microprocessors use an ''integrated memory controller'' (IMC), including microprocessors from Intel, AMD, and those built around the ARM architecture. Prior to K8 (circa 2003), AMD microprocessors had a memory controller implemented on their motherboard's northbridge. In K8 and later, AMD employed an integrated memory controller. Likewi ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Graphics Processing Unit
A graphics processing unit (GPU) is a specialized electronic circuit designed to manipulate and alter memory to accelerate the creation of images in a frame buffer intended for output to a display device. GPUs are used in embedded systems, mobile phones, personal computers, workstations, and game consoles. Modern GPUs are efficient at manipulating computer graphics and image processing. Their parallel structure makes them more efficient than general-purpose central processing units (CPUs) for algorithms that process large blocks of data in parallel. In a personal computer, a GPU can be present on a video card or embedded on the motherboard. In some CPUs, they are embedded on the CPU die. In the 1970s, the term "GPU" originally stood for ''graphics processor unit'' and described a programmable processing unit independently working from the CPU and responsible for graphics manipulation and output. Later, in 1994, Sony used the term (now standing for ''graphics processing ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Multi-core Processor
A multi-core processor is a microprocessor on a single integrated circuit with two or more separate processing units, called cores, each of which reads and executes program instructions. The instructions are ordinary CPU instructions (such as add, move data, and branch) but the single processor can run instructions on separate cores at the same time, increasing overall speed for programs that support multithreading or other parallel computing techniques. Manufacturers typically integrate the cores onto a single integrated circuit die (known as a chip multiprocessor or CMP) or onto multiple dies in a single chip package. The microprocessors currently used in almost all personal computers are multi-core. A multi-core processor implements multiprocessing in a single physical package. Designers may couple cores in a multi-core device tightly or loosely. For example, cores may or may not share caches, and they may implement message passing or shared-memory inter-core comm ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
IOS 10
iOS 10 is the tenth major release of the iOS mobile operating system developed by Apple Inc., being the successor to iOS 9. It was announced at the company's Worldwide Developers Conference on June 13, 2016, and was released on September 13, that year. It was succeeded by iOS 11 on September 19, 2017. iOS 10 incorporates changes to 3D Touch and the lock screen. There are new features to some apps: Messages has additional emojis and third-party apps can extend functionality in iMessage, Maps has a redesigned interface and additional third-party functions, the Home app manages "HomeKit"-enabled accessories, Photos has algorithmic search and categorization of media known as "Memories," and Siri is compatible with third-party app-specific requests, such as starting workouts apps, sending IMs, using Lyft or Uber or to use payment functions. iOS 10 is the final version to support 32-bit devices and apps. In iOS 10.3, Apple introduced its new file system, APFS. Reviews of iOS 10 w ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
