|
3Com 3c509
3Com 3c509 is a line of Ethernet IEEE 802.3 network cards for the Industry Standard Architecture, ISA, Extended Industry Standard Architecture, EISA, Micro Channel architecture, MCA and PC Card, PCMCIA computer buses. It was designed by 3Com and put on the market in 1992, followed by the improved version 3c509B in 1994. (PDF) Features The 3Com 3c5x9 family of network controllers has various interface combinations of computer bus including ISA, EISA, MCA, and PCMCIA. For network connection, 10BASE-2, Attachment Unit Interface, AUI and 10BASE-T are used. B = On ISA and PCMCIA, adapter numbers indicate that these adapters are part of the second generation of the Parallel Tasking EtherLink III technology. The Dual in-line package, DIP-28 (U1) EPROM for network booting may be 8, 16, or 32 KB in size. This means EPROMs of EPROM#EPROM sizes and types, type 64, 128, and 256 kbit (2^10) are compatible, like the 27C256. Boot ROM address is located between 0xC0000 - 0xDE000. T ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
3Com 3C509BC Ethernet NIC
3Com Corporation was an American digital electronics manufacturer best known for its computer network products. The company was co-founded in 1979 by Robert Metcalfe, Howard Charney and others. Bill Krause joined as President in 1981. Metcalfe explained the name 3Com was a contraction of "Computer Communication Compatibility", with its focus on Ethernet technology that he had co-invented, which enabled the networking of computers. 3Com provided network interface controller and network switch, switches, Router (computing), routers, wireless access points and controllers, IP voice systems, and intrusion prevention systems. The company was based in Santa Clara, California. From its 2007 acquisition of 100 percent ownership of H3C Technologies Co., Limited (H3C) —initially a joint venture with China-based Huawei, Huawei Technologies—3Com achieved a market presence in China, and a significant networking market share in Europe, Asia, and the Americas. 3Com products were sold un ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Dual In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
OpenBSD
OpenBSD is a security-focused, free and open-source, Unix-like operating system based on the Berkeley Software Distribution (BSD). Theo de Raadt created OpenBSD in 1995 by forking NetBSD 1.0. According to the website, the OpenBSD project emphasizes "portability, standardization, correctness, proactive security and integrated cryptography." The OpenBSD project maintains portable versions of many subsystems as packages for other operating systems. Because of the project's preferred BSD license, many components are reused in proprietary and corporate-sponsored software projects. The firewall code in Apple's macOS is based on OpenBSD's PF firewall code, Android's Bionic C standard library is based on OpenBSD code, LLVM uses OpenBSD's regular expression library, and Windows 10 uses OpenSSH (OpenBSD Secure Shell) with LibreSSL. The word "open" in the name OpenBSD refers to the availability of the operating system source code on the Internet, although the word "open" in the nam ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-263
The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can have 3 to 7 terminals. Image:D2PAK.JPG, A pair of MOSFETs in the surface-mount package D2PAK. Image:TO263 beside TO220.JPG, A TO-220 package compared to a D2PAK package. Dimensions Variants Texas instruments has a smaller version of the TO-263: the TO-263 THIN. The height of the TO-263 THIN is 2mm instead of the standard 4,5mm. See also TO-220, through hole version of the TO-263 References External links Package informationfrom Fairchild Mechanic ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
78xx
78xx (sometimes L78xx, LM78xx, MC78xx...) is a family of self-contained fixed linear voltage regulator integrated circuits. The 78xx family is commonly used in electronic circuits requiring a regulated power supply due to their ease-of-use and low cost. Nomenclature and packaging For ICs within the 78xx family, the ''xx'' is replaced with two digits, indicating the output voltage (for example, the 7805 has a 5-volt output, while the 7812 produces 12 volts). The 78xx line are positive voltage regulators: they produce a voltage that is positive relative to a common ground. There is a related line of 79xx devices which are complementary negative voltage regulators. 78xx and 79xx ICs can be used in combination to provide positive and negative supply voltages in the same circuit. 78xx ICs have three terminals and are commonly found in the TO-220 form factor, although they are available in surface-mount, TO-92, and TO-3 packages. These devices support an input voltage anywhere ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Power MOSFET
A power MOSFET is a specific type of metal–oxide–semiconductor field-effect transistor (MOSFET) designed to handle significant power levels. Compared to the other power semiconductor devices, such as an insulated-gate bipolar transistor (IGBT) or a thyristor, its main advantages are high switching speed and good efficiency at low voltages. It shares with the IGBT an isolated gate that makes it easy to drive. They can be subject to low gain, sometimes to a degree that the gate voltage needs to be higher than the voltage under control. The design of power MOSFETs was made possible by the evolution of MOSFET and CMOS technology, used for manufacturing integrated circuits since the 1960s. The power MOSFET shares its operating principle with its low-power counterpart, the lateral MOSFET. The power MOSFET, which is commonly used in power electronics, was adapted from the standard MOSFET and commercially introduced in the 1970s. The power MOSFET is the most common power semicond ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Logic Level
In digital circuits, a logic level is one of a finite number of states that a digital signal can inhabit. Logic levels are usually represented by the voltage difference between the signal and ground, although other standards exist. The range of voltage levels that represent each state depends on the logic family being used. A '' logic-level shifter'' can be used to allow compatibility between different circuits. 2-level logic In binary logic the two levels are logical high and logical low, which generally correspond to binary numbers 1 and 0 respectively. Signals with one of these two levels can be used in boolean algebra for digital circuit design or analysis. Active state The use of either the higher or the lower voltage level to represent either logic state is arbitrary. The two options are active high and active low. Active-high and active-low states can be mixed at will: for example, a read only memory integrated circuit may have a chip-select signal that is active-low, bu ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Network Booting
Network booting, shortened netboot, is the process of booting a computer from a network rather than a local drive. This method of booting can be used by routers, diskless workstations and centrally managed computers (thin clients) such as public computers at libraries and schools. Network booting can be used to centralize management of disk storage, which supporters claim can result in reduced capital and maintenance costs. It can also be used in cluster computing, in which nodes may not have local disks. In the late 1980s/early 1990s, network boot was used to save the expense of a disk drive, because a decently sized harddisk would still cost thousands of dollars, often equaling the price of the CPU. Hardware support Contemporary desktop personal computers generally provide an option to boot from the network in their BIOS/UEFI via the Preboot Execution Environment (PXE). Post-1998 PowerPC ( G3 G5) Mac systems can also boot from their New World ROM firmware to a network dis ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Transformer Types
A variety of types of electrical transformer are made for different purposes. Despite their design differences, the various types employ the same basic principle as discovered in 1831 by Michael Faraday, and share several key functional parts. Power transformer Laminated core This is the most common type of transformer, widely used in electric power transmission and appliances to convert mains voltage to low voltage to power electronic devices. They are available in power ratings ranging from mW to MW. The insulated laminations minimizes eddy current losses in the iron core. Small appliance and electronic transformers may use a split bobbin, giving a high level of insulation between the windings. The rectangular cores are made up of stampings, often in E-I shape pairs, but other shapes are sometimes used. Shields between primary and secondary may be fitted to reduce EMI (electromagnetic interference), or a screen winding is occasionally used. Small appliance and electron ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
EEPROM
EEPROM (also called E2PROM) stands for electrically erasable programmable read-only memory and is a type of non-volatile memory used in computers, usually integrated in microcontrollers such as smart cards and remote keyless systems, or as a separate chip device to store relatively small amounts of data by allowing individual bytes to be erased and reprogrammed. EEPROMs are organized as arrays of floating-gate transistors. EEPROMs can be programmed and erased in-circuit, by applying special programming signals. Originally, EEPROMs were limited to single-byte operations, which made them slower, but modern EEPROMs allow multi-byte page operations. An EEPROM has a limited life for erasing and reprogramming, now reaching a million operations in modern EEPROMs. In an EEPROM that is frequently reprogrammed, the life of the EEPROM is an important design consideration. Flash memory is a type of EEPROM designed for high speed and high density, at the expense of large erase blocks (ty ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Static Random-access Memory
Static random-access memory (static RAM or SRAM) is a type of random-access memory (RAM) that uses latching circuitry (flip-flop) to store each bit. SRAM is volatile memory; data is lost when power is removed. The term ''static'' differentiates SRAM from DRAM (''dynamic'' random-access memory) — SRAM will hold its data permanently in the presence of power, while data in DRAM decays in seconds and thus must be periodically refreshed. SRAM is faster than DRAM but it is more expensive in terms of silicon area and cost; it is typically used for the cache and internal registers of a CPU while DRAM is used for a computer's main memory. History Semiconductor bipolar SRAM was invented in 1963 by Robert Norman at Fairchild Semiconductor. MOS SRAM was invented in 1964 by John Schmidt at Fairchild Semiconductor. It was a 64-bit MOS p-channel SRAM. The SRAM was the main driver behind any new CMOS-based technology fabrication process since 1959 when CMOS was invented. In 1965 ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CMOS
Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", ) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including CMOS BIOS), and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors (CMOS sensors), data converters, RF circuits (RF CMOS), and highly integrated transceivers for many types of communication. The CMOS process was originally conceived by Frank Wanlass at Fairchild Semiconductor and presented by Wanlass and Chih-Tang Sah at the International Solid-State Circuits Conference in 1963. Wanlass later filed US patent 3,356,858 for CMOS circuitry and it was granted in 1967. commercialized the technology with the trademark "COS-MO ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
